JPS6236312Y2 - - Google Patents

Info

Publication number
JPS6236312Y2
JPS6236312Y2 JP1981182468U JP18246881U JPS6236312Y2 JP S6236312 Y2 JPS6236312 Y2 JP S6236312Y2 JP 1981182468 U JP1981182468 U JP 1981182468U JP 18246881 U JP18246881 U JP 18246881U JP S6236312 Y2 JPS6236312 Y2 JP S6236312Y2
Authority
JP
Japan
Prior art keywords
light
light emitting
lead frame
pellet
ohmic metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981182468U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5887368U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18246881U priority Critical patent/JPS5887368U/ja
Publication of JPS5887368U publication Critical patent/JPS5887368U/ja
Application granted granted Critical
Publication of JPS6236312Y2 publication Critical patent/JPS6236312Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP18246881U 1981-12-08 1981-12-08 発光ダイオ−ド Granted JPS5887368U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18246881U JPS5887368U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18246881U JPS5887368U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS5887368U JPS5887368U (ja) 1983-06-14
JPS6236312Y2 true JPS6236312Y2 (ru) 1987-09-16

Family

ID=29980855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18246881U Granted JPS5887368U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS5887368U (ru)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5271179A (en) * 1975-12-11 1977-06-14 Toshiba Corp Semiconductor device
JPS5610983A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Composite semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5271179A (en) * 1975-12-11 1977-06-14 Toshiba Corp Semiconductor device
JPS5610983A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Composite semiconductor device

Also Published As

Publication number Publication date
JPS5887368U (ja) 1983-06-14

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