JPS6236312Y2 - - Google Patents
Info
- Publication number
- JPS6236312Y2 JPS6236312Y2 JP1981182468U JP18246881U JPS6236312Y2 JP S6236312 Y2 JPS6236312 Y2 JP S6236312Y2 JP 1981182468 U JP1981182468 U JP 1981182468U JP 18246881 U JP18246881 U JP 18246881U JP S6236312 Y2 JPS6236312 Y2 JP S6236312Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- lead frame
- pellet
- ohmic metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 24
- 239000008188 pellet Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18246881U JPS5887368U (ja) | 1981-12-08 | 1981-12-08 | 発光ダイオ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18246881U JPS5887368U (ja) | 1981-12-08 | 1981-12-08 | 発光ダイオ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5887368U JPS5887368U (ja) | 1983-06-14 |
JPS6236312Y2 true JPS6236312Y2 (US20100056889A1-20100304-C00004.png) | 1987-09-16 |
Family
ID=29980855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18246881U Granted JPS5887368U (ja) | 1981-12-08 | 1981-12-08 | 発光ダイオ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5887368U (US20100056889A1-20100304-C00004.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5271179A (en) * | 1975-12-11 | 1977-06-14 | Toshiba Corp | Semiconductor device |
JPS5610983A (en) * | 1979-07-06 | 1981-02-03 | Mitsubishi Electric Corp | Composite semiconductor device |
-
1981
- 1981-12-08 JP JP18246881U patent/JPS5887368U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5271179A (en) * | 1975-12-11 | 1977-06-14 | Toshiba Corp | Semiconductor device |
JPS5610983A (en) * | 1979-07-06 | 1981-02-03 | Mitsubishi Electric Corp | Composite semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5887368U (ja) | 1983-06-14 |