JPS6236263A - Mounting method of parts onto flexible printed board - Google Patents

Mounting method of parts onto flexible printed board

Info

Publication number
JPS6236263A
JPS6236263A JP60176684A JP17668485A JPS6236263A JP S6236263 A JPS6236263 A JP S6236263A JP 60176684 A JP60176684 A JP 60176684A JP 17668485 A JP17668485 A JP 17668485A JP S6236263 A JPS6236263 A JP S6236263A
Authority
JP
Japan
Prior art keywords
flexible printed
printed board
mounting
roll
sprockets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60176684A
Other languages
Japanese (ja)
Inventor
Seiji Miyoshi
清司 三好
Toru Yokoyama
徹 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60176684A priority Critical patent/JPS6236263A/en
Publication of JPS6236263A publication Critical patent/JPS6236263A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components

Landscapes

  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Advancing Webs (AREA)

Abstract

PURPOSE:To improve the efficiency in part mounting work and permit automatic mounting by forming a driving roll and trailing rolls thin at the center parts and installing sprockets at the both-edge projection parts of the driving roll and the holes corresponding to the sprockets onto a flexible printed board and carrying out both-surface mounting. CONSTITUTION:The center part of a driving roll 9 is cut, leaving the both edges, and sprockets 91 are formed at the both-edge projection parts. At the both edges in the direction of traveling of a flexible printed board 10, sprocket holes 101 corresponding to the sprockets 91 installed at the both edges of the driving roll are drilled. Also the center part of a trailing roll is cut, leaving the both edges. Therefore, when a tip part is mounted onto the flexible printed board 10, the both-surface mounting is carried out by pulling and shifting the flexible printed board 10 by the driving roll 9 and a plurality of trailing rolls. Therefore, the efficiency in mounting work for parts can be improved, and automatic mounting is permitted.

Description

【発明の詳細な説明】 〔概要〕 フレキシブルプリント板への部品実装方法であって、フ
レキシブルプリント板を駆動ロールド、複数の従動ロー
ルとで移動させつつ、チップ部品を搭載するものである
DETAILED DESCRIPTION OF THE INVENTION [Summary] A method for mounting components on a flexible printed board, in which chip components are mounted while the flexible printed board is moved by a driving roll and a plurality of driven rolls.

〔産業上の利用分野〕[Industrial application field]

本発明は、フレキシブルプリント板への部品実装方法に
係り、とくにフレキシブルプリント板を複数のロールで
走行せしめながら、チップ部品を実装するフレキシブル
プリント板への部品実装方法に関する。
The present invention relates to a method for mounting components on a flexible printed board, and particularly to a method for mounting components on a flexible printed board, in which chip components are mounted while the flexible printed board is run on a plurality of rolls.

近年、機器類の急速なエレクトロニクス化に伴ない、プ
リント配線板は従来使われていなかった分野にまで進出
し、高成長を続けている。とくにフレキシブルプリント
板は元来電話機、自動車ダツシュボード等の曲面部分に
使用されていたが、最近はフレキシブルプリント板の持
つ特性を活かし新しい分野に、また軽薄、短小の要求に
対応する分野に使用されるようになった。ところがフレ
キシブルプリント板は柔軟性に富み厚さが薄いため、部
品実装に難点があるので、部品実装が容易で自動実装化
が期待できるフレキシブルプリント板への部品実装方法
の開発が強く要望されている。
In recent years, with the rapid shift to electronic equipment, printed wiring boards have entered fields where they have not been used before, and continue to grow at a high rate. In particular, flexible printed boards were originally used for curved parts such as telephones and automobile dashboards, but recently they are being used in new fields that take advantage of the characteristics of flexible printed boards, and in fields that meet the demands of lightness, thinness, shortness, and smallness. It became so. However, flexible printed boards are highly flexible and thin, making it difficult to mount components.Therefore, there is a strong demand for the development of a method for mounting components on flexible printed boards that allows for easy component mounting and automated mounting. .

〔従来の技術〕[Conventional technology]

従来のフレキシブルプリント板への部品実装方法は、フ
レキシブルプリント仮に形成したパターンに実装するチ
ップ部品に予め電極以外の部分に接着剤を塗布したチッ
プ部品を、フレキシブルプリント板に形成したパターン
に電極が対応するよ・う接着したるのち、噴流半田等で
の接着を手作業により行なっている。
The conventional method of mounting components on a flexible printed board is to mount the chip component onto a pattern that has been temporarily formed on the flexible printed board, and then apply adhesive to the parts other than the electrodes beforehand, and then the electrodes correspond to the pattern formed on the flexible printed board. After the parts are glued together, they are bonded by hand using jet solder or the like.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記従来のフレキシブルプリント板への部品実装方法に
あっては、柔軟性に冨み厚さが薄いため部品実装は手作
業によるしかなく、多大の工数を要し作業能率が悪いと
いう問題点があった。
The above-mentioned conventional method for mounting components on flexible printed circuit boards has the problem of high flexibility and thin thickness, so components must be mounted manually, which requires a large amount of man-hours and reduces work efficiency. Ta.

C問題点を解決するための手段〕 本発明は、上記の問題点を解決して部品実装作業能率を
向上し、自動実装の可能なフレキシブルプリント板への
部品実装方法を提供するものである。
Means for Solving Problem C] The present invention solves the above problems, improves the efficiency of component mounting work, and provides a method for mounting components on a flexible printed board that can be automatically mounted.

すなわち、フレキシブルプリント板を駆動ロールと複数
の従動ロールで移動して、チップ部品を実装するように
するとともに、駆動ロールと従動ロールを中細に形成し
、この駆動ロールの両端突出部にスプロケットを設け、
フレキシブルプリント板の走行方向両側に前記スプロケ
ットに対応するスプロケット孔を設け、両面実装を行な
うようにしたことよって解決される。
In other words, the flexible printed board is moved by a driving roll and a plurality of driven rolls to mount chip components, and the driving roll and driven rolls are formed to be medium-thin, and sprockets are attached to the protruding parts at both ends of the driving roll. established,
This problem can be solved by providing sprocket holes corresponding to the sprockets on both sides of the flexible printed board in the running direction to perform double-sided mounting.

〔作用〕[Effect]

上記フレキシブルプリント板へのチップ部品の実装方法
は、1個の駆動ロールと複数の従動ロールによりフレキ
シブルプリント板を引張り移動しながら、チップ部品の
自動実装が可能となる。
The method for mounting chip components onto a flexible printed board described above enables automatic mounting of chip components while pulling and moving the flexible printed board using one driving roll and a plurality of driven rolls.

〔実施例〕〔Example〕

第1図は、本発明の一実施例を説明する模式的側面図で
ある。
FIG. 1 is a schematic side view illustrating an embodiment of the present invention.

図において、長尺のフレキシブルプリント板1を第1の
従動ロール2に巻回して回転可能に軸止する。そして第
2の従動ロール3と第3の従動ロール4と、第4の従動
ロール5および駆動ロール6を、はぼ矩形状の隅部に位
置するように回転可能に軸止する。
In the figure, a long flexible printed board 1 is wound around a first driven roll 2 and rotatably fixed. Then, the second driven roll 3, the third driven roll 4, the fourth driven roll 5, and the drive roll 6 are rotatably fixed so as to be located at the corners of the rectangular shape.

そしてフレキシブルプリント板1の先端部を駆動ロール
6に引っ掛けた状態で、駆動ロール6を回動して、フレ
キシブルプリント板1は矢印方向に所定の速度で移動せ
しめる。そしてチップ部品7の搭載面の中央部に接着剤
8を塗布したチップ部品7を、第2の従動ロール3と第
3の従動ロール4との第1工程で所定位置(実装するパ
ターンの中央部)にチップ部品7の電極と、フレキシブ
ルプリント板1に形成したパターンとが密着するように
接着する。
Then, with the leading end of the flexible printed board 1 hooked on the drive roll 6, the drive roll 6 is rotated to move the flexible printed board 1 at a predetermined speed in the direction of the arrow. Then, the chip component 7 with the adhesive 8 applied to the center of the mounting surface of the chip component 7 is moved to a predetermined position (the center of the pattern to be mounted) in the first step using the second driven roll 3 and the third driven roll 4. ) are bonded so that the electrodes of the chip component 7 and the pattern formed on the flexible printed board 1 are in close contact with each other.

このように仮接着したチップ部品7は第40従動ロール
5と駆動ロール6との第2工程で、図示しない噴流槽に
おいて噴流半田により接着され、部品実装の終わったフ
レキシブルプリント板lは駆動ロール6を通過後所定位
置で切断される構造である。
The chip components 7 temporarily bonded in this manner are bonded to the 40th driven roll 5 and the drive roll 6 by jet soldering in a jet tank (not shown) in the second step, and the flexible printed board l on which the components have been mounted is bonded to the drive roll 6. The structure is such that it is cut at a predetermined position after passing through.

第2図は、本発明の他の実施例を説明する要部斜視図で
ある。
FIG. 2 is a perspective view of essential parts explaining another embodiment of the present invention.

第2図は、フレキシブルプリント板の両面に部品実装を
行なう駆動ロール9と、フレキシブルプリント板10を
示したものである。
FIG. 2 shows a drive roll 9 and a flexible printed board 10 for mounting components on both sides of the flexible printed board.

すなわち、駆動ロール9は両端を残して中央部を切除し
て、両端にはスプロケット91を形成したものである。
That is, the driving roll 9 has a center portion cut out except for both ends, and sprockets 91 are formed at both ends.

したがってフレキシブルプリント板10の走行方向両端
には、駆動ロール9の両端に設けたスプロケット91に
対応するスプロケット孔101を穿設した構造である。
Therefore, the flexible printed board 10 has a structure in which sprocket holes 101 corresponding to the sprockets 91 provided at both ends of the drive roll 9 are bored at both ends in the running direction.

第2図では駆動ロール9についてのみ説明したが、他の
従動ロールも両端を残して中央部を切除する以外の部品
実装要領は第1図で説明したと同様である。
Although only the drive roll 9 has been described in FIG. 2, the component mounting procedure for the other driven rolls is the same as that described in FIG. 1, except that the center portion is cut off leaving both ends intact.

〔発明の効果〕 以上の説明から明らかなように、本発明によればフレキ
シブルプリント板への部品実装作業能率が向上し、自動
実装に極めて有効である。
[Effects of the Invention] As is clear from the above description, the present invention improves the efficiency of mounting components onto flexible printed boards and is extremely effective for automatic mounting.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の一実施例を説明する模式的側面図、 第2図は、本発明の他の実施例を説明する要部斜視図で
ある。 図において、1.10はフレキシブルプリント板、2は
第1の従動ロール、3は第2の従動ロール、4は第3の
従動ロール、5は第4の従動ロール、6.9は駆動ロー
ル、7はチ・7プ部品、8は接着剤、91はスプロケッ
ト、101はスプロケット孔、をそれぞれ示す。 ≧ト、ギ6θj1h−ブζjマ杷づツR”+揉aJfi
lソd!コ七ゴ1i1図
FIG. 1 is a schematic side view illustrating one embodiment of the present invention, and FIG. 2 is a perspective view of essential parts illustrating another embodiment of the present invention. In the figure, 1.10 is a flexible printed board, 2 is a first driven roll, 3 is a second driven roll, 4 is a third driven roll, 5 is a fourth driven roll, 6.9 is a drive roll, 7 is a tip part, 8 is an adhesive, 91 is a sprocket, and 101 is a sprocket hole. ≧T, gi6θj1h-buζjma loquats R”+揉aJfi
lsod! Koshichigo 1i1 diagram

Claims (2)

【特許請求の範囲】[Claims] (1)フレキシブルプリント板(1)へのチップ部品(
7)の実装方法であって、 該フレキシブルプリント板(1)を駆動ロール(6)と
複数の従動ロール(2)〜(5)で移動して、チップ部
品を実装するようにしたことを特徴とするフレキシブル
プリント板への部品実装方法。
(1) Chip parts (
7) The mounting method is characterized in that the flexible printed board (1) is moved by a drive roll (6) and a plurality of driven rolls (2) to (5) to mount the chip components. A method for mounting components on flexible printed boards.
(2)前記駆動ロールと従動ロールを中細に形成し、前
記駆動ロール(9)の両端突出部にスプロケット(91
)を設け、フレキシブルプリント板(10)の走行方向
両側に前記スプロケット(91)に対応するスプロケッ
ト孔(101)を設け、両面実装を行なうようにしたこ
とを特徴とする特許請求の範囲第(1)項に記載のフレ
キシブルプリント板への部品実装方法。
(2) The driving roll and the driven roll are formed to be medium-thin, and sprockets (91
), and sprocket holes (101) corresponding to the sprockets (91) are provided on both sides of the flexible printed board (10) in the running direction, so that double-sided mounting is possible. ) Method of mounting components on a flexible printed board as described in section.
JP60176684A 1985-08-10 1985-08-10 Mounting method of parts onto flexible printed board Pending JPS6236263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60176684A JPS6236263A (en) 1985-08-10 1985-08-10 Mounting method of parts onto flexible printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60176684A JPS6236263A (en) 1985-08-10 1985-08-10 Mounting method of parts onto flexible printed board

Publications (1)

Publication Number Publication Date
JPS6236263A true JPS6236263A (en) 1987-02-17

Family

ID=16017915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60176684A Pending JPS6236263A (en) 1985-08-10 1985-08-10 Mounting method of parts onto flexible printed board

Country Status (1)

Country Link
JP (1) JPS6236263A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013082357A1 (en) * 2011-11-30 2013-06-06 Corning Incorporated Methods and apparatuses for conveying flexible glass substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013082357A1 (en) * 2011-11-30 2013-06-06 Corning Incorporated Methods and apparatuses for conveying flexible glass substrates
US9428359B2 (en) 2011-11-30 2016-08-30 Corning Incorporated Methods and apparatuses for conveying flexible glass substrates
US9522800B2 (en) 2011-11-30 2016-12-20 Corning Incorporated Methods and apparatuses for conveying flexible glass substrates

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