JPS6235202B2 - - Google Patents

Info

Publication number
JPS6235202B2
JPS6235202B2 JP57177994A JP17799482A JPS6235202B2 JP S6235202 B2 JPS6235202 B2 JP S6235202B2 JP 57177994 A JP57177994 A JP 57177994A JP 17799482 A JP17799482 A JP 17799482A JP S6235202 B2 JPS6235202 B2 JP S6235202B2
Authority
JP
Japan
Prior art keywords
acicular
inorganic
circuit board
fibrous
additive circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57177994A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5968104A (ja
Inventor
Norio Shimizu
Noryuki Shimizu
Akiji Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikkan Industries Co Ltd
Original Assignee
Nikkan Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikkan Industries Co Ltd filed Critical Nikkan Industries Co Ltd
Priority to JP57177994A priority Critical patent/JPS5968104A/ja
Priority to US06/493,269 priority patent/US4524098A/en
Publication of JPS5968104A publication Critical patent/JPS5968104A/ja
Publication of JPS6235202B2 publication Critical patent/JPS6235202B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/002—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of fibres, filaments, yarns, felts or woven material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B32/00—Artificial stone not provided for in other groups of this subclass
    • C04B32/005—Artificial stone obtained by melting at least part of the composition, e.g. metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/02—Fibres; Filaments; Yarns; Felts; Woven material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/06—Whiskers ss
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP57177994A 1982-10-09 1982-10-09 アデイテイブ回路基板 Granted JPS5968104A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57177994A JPS5968104A (ja) 1982-10-09 1982-10-09 アデイテイブ回路基板
US06/493,269 US4524098A (en) 1982-10-09 1983-05-10 Board for additive circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57177994A JPS5968104A (ja) 1982-10-09 1982-10-09 アデイテイブ回路基板

Publications (2)

Publication Number Publication Date
JPS5968104A JPS5968104A (ja) 1984-04-18
JPS6235202B2 true JPS6235202B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-07-31

Family

ID=16040678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57177994A Granted JPS5968104A (ja) 1982-10-09 1982-10-09 アデイテイブ回路基板

Country Status (2)

Country Link
US (1) US4524098A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5968104A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3371734D1 (en) * 1983-02-23 1987-06-25 Ibm Deutschland Process for the production of metallic layers adhering to plastic supports
DE3510202A1 (de) * 1985-03-21 1986-09-25 Bayer Ag, 5090 Leverkusen Elektrische leiterplatten
JPH0883861A (ja) * 1994-07-12 1996-03-26 Nitto Denko Corp 半導体パッケージ被覆用金属箔材料および半導体装置
US6417486B1 (en) * 1999-04-12 2002-07-09 Ticona Gmbh Production of conductor tracks on plastics by means of laser energy
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
CN101878678A (zh) 2007-09-28 2010-11-03 三星层板有限公司 用于在印刷电路板中钻孔的改进系统和方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3949147A (en) * 1970-10-01 1976-04-06 Foseco International Limited Protection of turbine casings
JPS54149708A (en) * 1978-05-17 1979-11-24 Sumitomo Bakelite Co Ceramic laminate containing shield layer and production thereof
US4335216A (en) * 1981-05-01 1982-06-15 Tam Ceramics, Inc. Low temperature fired dielectric ceramic composition and method of making same

Also Published As

Publication number Publication date
JPS5968104A (ja) 1984-04-18
US4524098A (en) 1985-06-18

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