JPS6234469Y2 - - Google Patents
Info
- Publication number
- JPS6234469Y2 JPS6234469Y2 JP1981100817U JP10081781U JPS6234469Y2 JP S6234469 Y2 JPS6234469 Y2 JP S6234469Y2 JP 1981100817 U JP1981100817 U JP 1981100817U JP 10081781 U JP10081781 U JP 10081781U JP S6234469 Y2 JPS6234469 Y2 JP S6234469Y2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- lead frame
- reflective
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 239000012778 molding material Substances 0.000 claims 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981100817U JPS587364U (ja) | 1981-07-07 | 1981-07-07 | 発光ダイオ−ドランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981100817U JPS587364U (ja) | 1981-07-07 | 1981-07-07 | 発光ダイオ−ドランプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS587364U JPS587364U (ja) | 1983-01-18 |
JPS6234469Y2 true JPS6234469Y2 (it) | 1987-09-02 |
Family
ID=29895497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981100817U Granted JPS587364U (ja) | 1981-07-07 | 1981-07-07 | 発光ダイオ−ドランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS587364U (it) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60186412U (ja) * | 1984-05-23 | 1985-12-10 | 沖電線株式会社 | 強化被覆光フアイバ |
JP2519504Y2 (ja) * | 1989-10-31 | 1996-12-04 | 豊田合成株式会社 | 発光ダイオード |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53164772U (it) * | 1977-05-31 | 1978-12-23 |
-
1981
- 1981-07-07 JP JP1981100817U patent/JPS587364U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS587364U (ja) | 1983-01-18 |
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