JPS6234425U - - Google Patents

Info

Publication number
JPS6234425U
JPS6234425U JP11983285U JP11983285U JPS6234425U JP S6234425 U JPS6234425 U JP S6234425U JP 11983285 U JP11983285 U JP 11983285U JP 11983285 U JP11983285 U JP 11983285U JP S6234425 U JPS6234425 U JP S6234425U
Authority
JP
Japan
Prior art keywords
wafer
main surface
chuck
semiconductor wafer
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11983285U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11983285U priority Critical patent/JPS6234425U/ja
Publication of JPS6234425U publication Critical patent/JPS6234425U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
JP11983285U 1985-08-06 1985-08-06 Pending JPS6234425U (US20100012521A1-20100121-C00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11983285U JPS6234425U (US20100012521A1-20100121-C00001.png) 1985-08-06 1985-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11983285U JPS6234425U (US20100012521A1-20100121-C00001.png) 1985-08-06 1985-08-06

Publications (1)

Publication Number Publication Date
JPS6234425U true JPS6234425U (US20100012521A1-20100121-C00001.png) 1987-02-28

Family

ID=31007575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11983285U Pending JPS6234425U (US20100012521A1-20100121-C00001.png) 1985-08-06 1985-08-06

Country Status (1)

Country Link
JP (1) JPS6234425U (US20100012521A1-20100121-C00001.png)

Similar Documents

Publication Publication Date Title
US6793764B1 (en) Chemical dispensing system for semiconductor wafer processing
JPS62150828A (ja) ウエハ乾燥装置
JPS6234425U (US20100012521A1-20100121-C00001.png)
JPH02133916A (ja) レジスト塗布装置
JPS60234323A (ja) 半導体集積回路装置の製造装置
JP2507587B2 (ja) 吹き付け式半導体基板等吸着装置
JPS61125045U (US20100012521A1-20100121-C00001.png)
JPH01100435U (US20100012521A1-20100121-C00001.png)
JPS62131433U (US20100012521A1-20100121-C00001.png)
JPS62187680U (US20100012521A1-20100121-C00001.png)
JPS63164217U (US20100012521A1-20100121-C00001.png)
JPS60117034U (ja) 半導体真空回転チヤツク
JPS62101230U (US20100012521A1-20100121-C00001.png)
JPH0167735U (US20100012521A1-20100121-C00001.png)
JP2575959B2 (ja) 回転塗布装置
JPH01171030U (US20100012521A1-20100121-C00001.png)
JPH0441975Y2 (US20100012521A1-20100121-C00001.png)
JP2527682Y2 (ja) 回転塗布装置
JPH0379872U (US20100012521A1-20100121-C00001.png)
JPS6333660Y2 (US20100012521A1-20100121-C00001.png)
JPS639130U (US20100012521A1-20100121-C00001.png)
JPH0399431U (US20100012521A1-20100121-C00001.png)
JPH0227724U (US20100012521A1-20100121-C00001.png)
JPH06120202A (ja) 半導体基板湿式処理装置
JPS62138440U (US20100012521A1-20100121-C00001.png)