JPS6233438A - Semiconductor substrate - Google Patents

Abstract

PURPOSE:To enable a substrate to be handled without the plane thereof being contacted so that even a substrate having a larger diameter can be handled easily, by providing an engaging hole in the plane of the substrate so that the substrate can be handled with the peripheral face of the engaging hole and the outer peripheral face of the substrate being grasped. CONSTITUTION:An engaging hole 4a is provided approximately at the center of a semiconductor substrate 4. In order to handle the substrate, the pin 5a of a handling jig 5 is inserted into the engaging hole 4a in the semiconductor substrate and a stopper 5b is applied against the outer periphery of the semiconductor substrate 4. The handling jig 5 has a handle 5c. When this handle 5c is pulled with the stopper 5b pushed in the direction as indicated by the arrow, the pin 5a provided vertically on the upper face of the end portion of an arm 5d is moved to the direction opposite to said direction of the arrow and is applied against the peripheral face of the engaging hole 4a. Namely, the outer periphery of the semiconductor substrate 4 and the peripheral face of the engaging hole 4a are grasped by the 'U' shaped bottom face of the stopper 5b and the outer peripheral face of the pin 5a, respectively. Once they are grasped, they can be fixed in this condition. Thus, the substrate can be handled to the next process by an operator grasping the handle 5c.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor substrate forming a substrate of a semiconductor integrated circuit.

[Conventional technology]

Conventionally, this type of semiconductor substrate is handled using a bottle set, air tweezers, or the like.

FIG. 3 shows an example using a bottle set, where 1 is a semiconductor substrate and 2 is a bottle set. The peripheral edge of the semiconductor substrate 1 is gripped and held by a bottle set 2, and a link to the next process is performed.

FIG. 4 shows an example using an air bin set, in which the suction part 3& of the air tweezers 3 is vacuum-adsorbed on the back surface of the semiconductor substrate 1, and handling is performed.

[Problems to be solved by the invention] However, according to this handling method,
When handling the semiconductor substrate 1, the gripping portion of the bottle set 2 comes into contact with the peripheral edge of the semiconductor substrate 1, which causes a problem in that the peripheral edge is adversely affected. Also,
When handling using air bottle set 3,
There was a problem that the contact portion with the suction part 31 was contaminated.

In addition, the demand for semiconductor substrates is expected to increase further in the future.
Such a handling method cannot adequately cope with the increasing size of large-diameter semiconductor substrates, and it was expected that the handling would become difficult.

The present invention has been made in view of these points, and its purpose is to provide a semiconductor substrate that does not have a negative effect on the substrate and can be easily handled even when transitioning to a large-diameter substrate. It is about providing.

[Means for solving problems]

In order to achieve this object, the present invention provides an engagement hole in a flat surface of a semiconductor substrate.

[Effect]

Therefore, according to the semiconductor substrate of the present invention, it is possible to handle the substrate without contacting the flat surface of the substrate while grasping the peripheral end surface of the engagement hole formed in the flat surface of the substrate and the outer peripheral end surface of the substrate.

〔Example〕

Hereinafter, a semiconductor substrate according to the present invention will be explained using the drawings. FIG. 1 is an external perspective view showing one embodiment of this semiconductor substrate. An engagement hole 4a is formed approximately in the center of the semiconductor substrate 40 on one side.

Note that 4b is an orientation flat formed at a position perpendicular to the crystal of the semiconductor substrate 4.

Next, a method of handling the semiconductor substrate 4 formed in this manner will be described. That is, the pin 5a of the handling jig 5 is inserted into the engagement hole 4m of the semiconductor substrate 4, as shown in FIG. 2, and the stopper 5b is brought into contact with the outer peripheral end surface of the semiconductor substrate 4. The stopper 5b is formed in the shape of a disconnection "U", and the bottom surface of the rUJ shape is connected to the semiconductor substrate 4.
The structure is such that the upper and lower surfaces of the semiconductor substrate 4 do not contact the front and back surfaces of the semiconductor substrate 4 . The handling jig 5Fi has a handle 5c, and by pulling the handle 5c while pressing the stopper 5b in the direction of the arrow shown in the figure, a small pin 5a implanted on the upper surface of the tip of the arm 5d moves in the direction of the arrow along with the arm 5d. It moves in the opposite direction and comes into contact with the peripheral end surface of the engagement hole 4. The outer peripheral end surface of the pick, the semiconductor substrate 4, and the peripheral end surface of the engagement hole 4a are gripped by the "U"-shaped bottom surface of the stopper 5b and the outer peripheral wall surface of the pin 5&. After gripping and holding, this state can be fixed, so that the handle 5c can be gripped and handled to the next step.

In this manner, by using the engagement hole 4a, it is possible to handle the semiconductor substrate 4 without contacting the substrate surface, and the conventional problems caused by contacting the substrate surface are solved. In addition, by using such a handling jig 5, it is possible to sufficiently cope with larger diameter semiconductor substrates.
Easy handling.

Note that the handling jig 5 used in this embodiment does not necessarily have to have such a configuration; in short, it grips and holds the outer peripheral end surface of the semiconductor substrate 4 and the peripheral end surface of the engagement hole 4a, and handles it. If possible, a handling jig with another configuration may be used. Further, a plurality of engagement holes 4a may be provided, and do not necessarily have to be provided approximately at the center of the 1000th surface of the substrate.

Furthermore, in this example, only the handling was explained, but by using a round hole formed in the semiconductor substrate, it is possible to improve the positioning in an automatic machine and to make the inside of the substrate uniform in the processing process. You can expect good results. That is, in the processing process, processing such as rotating the substrate in a vacuum is performed in order to form a patterned protective film, etc., so it is necessary to position and fix the substrate using the engagement hole. The substrate itself does not shift and the uniformity of processing can be improved.

〔Effect of the invention〕

As explained above, according to the semiconductor substrate according to the present invention, since the engagement hole is formed in the flat surface of the substrate, handling can be performed without contacting the flat surface of the substrate while grasping the peripheral end surface of the engagement hole and the outer peripheral end surface of the substrate. Therefore, there is no adverse effect on the substrate due to contact, and it is possible to easily handle the substrate even if the substrate has a large diameter.

Further, effects such as improved positioning in automatic machines and uniformity of processing within the substrate during processes can be expected.

[Brief Description of the Drawings] Fig. 1 is an external perspective view showing an embodiment of a semiconductor substrate according to the present invention, Fig. 2 is an external perspective view illustrating a method of handling this semiconductor substrate, and Fig. 3 is an external perspective view showing an example of a semiconductor substrate according to the present invention. External perspective view illustrating the handling method of the semiconductor substrate used, Part 4
The figure is an external perspective view illustrating a method of handling a semiconductor substrate using air tweezers. 4... Semiconductor substrate, 4a... Engaging hole, 5...
・Hand link Jiji J14.5a fist --- bottle, 5b...
・Fist stopper, 5cφ...-handle.

Claims (1)

[Claims] A semiconductor substrate forming a substrate of a semiconductor integrated circuit, characterized in that an engagement hole is formed in a flat surface of the substrate.