JPH03161999A - Pushing-up equipment for electronic component - Google Patents
Pushing-up equipment for electronic componentInfo
- Publication number
- JPH03161999A JPH03161999A JP1301160A JP30116089A JPH03161999A JP H03161999 A JPH03161999 A JP H03161999A JP 1301160 A JP1301160 A JP 1301160A JP 30116089 A JP30116089 A JP 30116089A JP H03161999 A JPH03161999 A JP H03161999A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- component
- electronic component
- receiving surface
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、例えば抵抗器、コンデンサあるいはトランジ
スタ等のチップ化した電子部品が貼着されたシートから
各々の電子部品を選択的に剥離するに用いられる電子部
品の突上げ装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to selectively peeling electronic components such as resistors, capacitors, transistors, etc. from a sheet to which chipped electronic components are attached. This invention relates to a device for pushing up electronic components.
［従来の技術］
従来、この種の電子部品の突上げ装置においては、特開
昭６２−２５７７４６号公報に開示されているような構
戊を有するものがある。[Prior Art] Conventionally, there is a device for pushing up electronic components of this type having a structure as disclosed in Japanese Patent Laid-Open No. 62-257746.
このような従来装置にあっては、第６図及び第７図に示
すように、Ｘ−Ｙ方向に平行移動可能な真空吸着ステー
ジｌ上のシート受面２の中央部にピンガイド孔３を設け
、このピンガイド孔３から突上げピン４の先端部４ａを
突出可能にするとともに、このピンガイド孔３の周囲に
、図示しない真空源に連通ずる複数個（図示の例では４
個）の真空吸着孔５を開口させている。In such a conventional device, as shown in FIGS. 6 and 7, a pin guide hole 3 is provided in the center of a sheet receiving surface 2 on a vacuum suction stage l that is movable in parallel in the X-Y direction. The pin guide hole 3 is provided with a plurality of holes (in the illustrated example, four
) vacuum suction holes 5 are opened.
−２−
そして，前記真空吸着ステージ１上には、電子部品Ｗを
貼着した粘着性シー１−６が吸着され、このシ一ト６に
貼着された電子部品Ｗを前記シー１〜受面２の中央部に
設けたピンガイド孔３に対応する位置に位置決めし、前
記突」二げピン４の突Ｌげ動作により剥離して、吸着コ
レット７に吸着保持させるようになっている。-2- Then, the adhesive sheet 1-6 with the electronic component W pasted thereon is suctioned onto the vacuum suction stage 1, and the electronic component W pasted on this sheet 6 is sucked onto the vacuum suction stage 1. It is positioned at a position corresponding to the pin guide hole 3 provided in the center of the surface 2, and is peeled off by the protruding action of the protruding pin 4, and is then adsorbed and held by the adsorbing collet 7.
［発明が解決しようとする課題］
しかしながら、上記した従来の突Ｌけ装置では、真空吸
着ステージ１のシート受而２が水ｊｌ／面であるために
、第８図及び第９図に示オように、電子部品Ｗのサイズ
が大きくなると、電子部品Ｗがシート６から剥離しにく
くなり、場合によっては、突上げピン４の突−ＬＩ″Ｊ
″７．１一ロー夕を大きくしなければならない。[Problems to be Solved by the Invention] However, in the conventional thrusting device described above, since the sheet receiver 2 of the vacuum suction stage 1 is a water surface, the problems shown in FIGS. As shown in FIG.
``7.1 - We have to make the rotor larger.
また、このように突Ｌ：！Ｊ’ビン４の突上げストロー
クが大きいと、電子部品Ｗの｛Ｉ′Ｉｔｉｖｔずれが生
じてピックアップミスを起こし易く、電子部晶Ｗへのダ
メージが大きくなるという問題があった。Also, like this L:! If the pushing up stroke of the J' bin 4 is large, there is a problem in that {I'Itivt deviation of the electronic component W occurs, which tends to cause a pick-up error, and increases damage to the electronic component W.
［発明の目的］
本発明の目的は、電子部品のサイズが大きくなっても，
電子部品がシートから剥離し易くし、電子部品の位置ず
れによるピックアップミスを確実に防Ｉヒするとともに
、電子部品へのダメージを小さくすることができるよう
にした電子部品の突上げ装置を提供することにある。[Object of the Invention] The object of the present invention is to achieve a
To provide a push-up device for electronic components that makes it easy to separate electronic components from a sheet, reliably prevents pickup errors due to misalignment of electronic components, and reduces damage to electronic components. There is a particular thing.
［Ｓ題を解決するための手段］
上記した目的を達戊ずるために、本発明は、シー１〜受
面の中央部に設けたピンガイド孔から突上げＬ′ｌ’
）一＝１ ，＋Ｐ， ’ｌｉｆ能にしかつこのピンガイ
ド孔の周““ ９１！数個の＋：Ｌ空吸完”Ｊ孔を開口
させてなる真Ｚ！吸冫，，（テージ上に、電イ・部品が
貼着された粘着性シー１〜を吸着し、この゛−１〜じ貼
着さ４１た電子部品を前記シート受面の中央部１二ａ
４−１たピンガイド孔に対応する位置に位｝？ｉ決めす
るとともに、前オ己突上げピンの突上げ動イ１．により
剥離して労ｎ二口 ノトに吸着保持させて）！’＋：る
電−ｒ部品の突上げ装ｊｉ”＋’こあって、前記ピンガ
一′ド孔か討け１゛、１１，たシー１・・ミ３−
面の中央部に、電子部品のサｒズより小径な部品受面を
形或し、この部品受面の周門に溝を形或して、この溝に
前記各々の真空吸着孔を開口させてなる構成としたもの
である。[Means for Solving Problem S] In order to achieve the above-mentioned object, the present invention provides a pin guide hole provided at the center of the seat 1 to the receiving surface.
) 1 = 1, +P, 'lif function and the circumference of this pin guide hole "" 91! Several +: L air suction completed" True Z! Suction made by opening the J hole,, (Adsorb the adhesive sheet 1~ with the electric parts and parts attached on the stage, and then use this ゛- The electronic components 1 to 41 pasted are placed on the center portion 12a of the sheet receiving surface.
4-1 in the position corresponding to the pin guide hole}? 1. At the same time as deciding the direction, the front thrusting pin should be pushed up.1. Peel it off and hold it in place by adsorption)! ``+: Push-up device for electronic components'' A component receiving surface is formed with a diameter smaller than that of the SARZ, a groove is formed in the peripheral gate of this component receiving surface, and each of the vacuum suction holes is opened in this groove. .
［作 用］
すなわち、本発明は、突−１二げ１−゛ンを突出させる
ようにピンガイド孔が設けられた真空吸着ステージ上の
シート受面の中央部に、電子部品のサイズより小径な部
品受面を形成し、かっこの部品受面の周曲に溝を形成す
るとともに、この溝に各々の真空吸着孔を開口させてな
るために、部品受面しにシー１−に貼着された電子部品
が位置すると、溝の形或部における真空吸着作用でシー
トが下方に吸引されて電子部品から容易に剥がれる。[Function] That is, in the present invention, a pin guide hole is provided in the central part of the sheet receiving surface on the vacuum suction stage in which the pin guide hole is provided so that the protrusion 1 and the pin 1 protrude. A groove is formed on the circumferential curve of the component receiving surface of the bracket, and each vacuum suction hole is opened in this groove. When the electronic component is located, the sheet is sucked downward by the vacuum suction action in a certain portion of the groove, and is easily peeled off from the electronic component.
［実 施 例］
以下、本発明を第ｌ図から第５図に示す図面を参照しな
がら詳細に説明する。なお、本発明に係る図示の装置に
おいて、第６同から第９図に示す５
−４
従来装置と構或が重複する部分は同一符号を用９）で説
明する。[Example] Hereinafter, the present invention will be described in detail with reference to the drawings shown in FIGS. 1 to 5. In addition, in the illustrated apparatus according to the present invention, the same reference numerals will be used to describe the same parts as those of the conventional apparatus in 5-4 shown in FIGS.
すなわち、本発明は、第１図及び第２図に示すように、
Ｘ−Ｙ方向に平行移動可能な真空吸着ステージエ」二の
シート受面２の中央部に設けた突【一げピン４の先端部
４ａが突出するピンガイド孔３の周囲に、電子部品Ｗの
サイズよりも小径な部品受面２１が形成されるように残
して、環状溝２２を形或し，この環状溝２２に各々の真
空吸着孔５・・を開口させてなる構或を有するものであ
る。That is, the present invention, as shown in FIGS. 1 and 2,
A protrusion provided at the center of the second sheet receiving surface 2 of the vacuum suction stage movable in parallel in the X-Y direction. An annular groove 22 is formed leaving a component receiving surface 21 smaller in diameter than the size of the annular groove 22, and each vacuum suction hole 5 is opened in the annular groove 22. It is.
したがって、上記した本発明の構或によれば、前記真空
吸着ステージエ上に、電子部品Ｗが貼着した粘着性シ一
ト６を吸着し、かつこのシ一ト６に貼着された電子部品
Ｗを前記シート受面２の中央部に設けたピンガイド孔３
に対応する部品受面２１に位置決めすると，第３図に示
すように、前記突上げビン４の突上げ動作前に、環状溝
２２の形或部でシ一ト６が下方に吸引されて、電子部品
Ｗから一部が剥がれ始める。Therefore, according to the above-described structure of the present invention, the adhesive sheet 6 on which the electronic component W is adhered is adsorbed onto the vacuum adsorption stage, and the electronic component W adhered to the sheet 6 is A pin guide hole 3 in which the component W is provided in the center of the seat receiving surface 2
When the sheet 6 is positioned on the component receiving surface 21 corresponding to the part receiving surface 21, as shown in FIG. Part of the electronic component W begins to peel off.
これによって、突上げピン４の突上げ動作前に−６−
は、既にシ一ト６の一部が電子部品Ｗから剥離している
ことから、第４図に示すように、突上げピン４により電
子部品Ｗを突上げて吸着コレット７に吸着保持させる際
には、小さなストロークで容易にシ一ト６を電子部品Ｗ
から剥がすことが可能になる。As a result, as shown in FIG. When the electronic component W is pushed up and held by the suction collet 7, the seat 6 can be easily pushed up and held by the suction collet 7.
It becomes possible to peel it off.
なお、上記の実施例において，真空吸着ステージ１上の
シート受面２の中央部に部品受面２工を形或する場合に
、ピンガイド孔３の周囲に環状溝２２を形成したが、第
５図に示すように、シート受面２の中央部に形成した部
品受面２１の周囲に、所定の間隔を存して溝部２２を複
数個、例えば図示のように４個部分的に形成して、これ
ら各々の溝部２２・・・に各々の真空吸着孔５・・・を
開口させるように構威しても良い。In the above embodiment, when forming the component receiving surface 2 in the center of the sheet receiving surface 2 on the vacuum suction stage 1, the annular groove 22 was formed around the pin guide hole 3. As shown in FIG. 5, a plurality of grooves 22, for example four as shown in the figure, are partially formed at a predetermined interval around the component receiving surface 21 formed in the center of the seat receiving surface 2. Then, each vacuum suction hole 5 may be opened in each of these groove portions 22 .
［発明の効果］
以上の説明から明らかなように、本発明は、突上げピン
を突出させるようにピンガイド孔が設けられた真空吸着
ステージ」二のシート受面の中央部に、電子部品のサイ
ズより小径な部品受面を形或し、かつこの部品受面の周
囲に溝を形成するとともに、この溝に各々の真空吸着孔
を開口させてなることから、部品受面上にシートに貼着
された電子部品が位置すると、溝の形戒部における真空
吸着作用でシートが下方に吸引されて電子部品から容易
に剥離させることができ、これによって、電子部品のサ
イズが大きくなっても、従来のような電子部品の位置ず
れによるピックアップミスを確実に防止することができ
、また電子部品へのダメージを小さくすることができる
というすぐれた効果を奏するものである。[Effects of the Invention] As is clear from the above description, the present invention has an electronic component mounted in the center of the seat receiving surface of the second vacuum suction stage in which a pin guide hole is provided to allow the push-up pin to protrude. By forming a component receiving surface with a smaller diameter than the component receiving surface, forming a groove around this component receiving surface, and opening each vacuum suction hole in this groove, it is possible to attach a sheet to the component receiving surface. Once the attached electronic component is located, the sheet is sucked downward by the vacuum suction in the groove shape section and can be easily peeled off from the electronic component. This has excellent effects in that it is possible to reliably prevent pickup errors caused by misalignment of electronic components as in the prior art, and it is also possible to reduce damage to electronic components.
第１図は本発明に係る電子部品の突上げ装置の一実施例
を示す要部断面図、
第２図は同じく平面図、
第３図は同じく突」―げピンの突上げ動作前のシー１−
の剥離状態を示す説明図、
第４同は同じく突上げピンの突上げ動作時のシ７
一トの剥離状態を示す説明図、
第５図は本発明に係る他の実施例を示す平面図、第６図
は従来の電子部品の突上げ装置の要部断面図、
第７図は同しく平面図、
第８図及び第９図は同じく従来の突上げピンの突上げ動
作時のシートの剥離状態を示す説明図である。
ｌ・・・真空吸着ステージ、２・・・シート受面、２ｌ
・・・部品受面、 ２２・・・溝、３・・・ピンガ
イド孔、
４・・・突上げピン、 ４ａ・・・先端部、５・・
・真空孔、 ６・・・粘着性シート、７・・・吸着
コレット、Ｗ・・・電子部品。FIG. 1 is a cross-sectional view of essential parts showing an embodiment of the device for pushing up electronic components according to the present invention, FIG. 2 is a plan view of the same, and FIG. 1-
FIG. 4 is an explanatory diagram showing the peeling state of the sheet 7 during the pushing-up operation of the push-up pin. FIG. 5 is a plan view showing another embodiment of the present invention. , Fig. 6 is a sectional view of the main part of a conventional ejecting device for electronic components, Fig. 7 is a plan view, and Figs. 8 and 9 are diagrams of the sheet during ejecting operation of a conventional ejecting pin. It is an explanatory view showing a peeling state. l... Vacuum suction stage, 2... Sheet receiving surface, 2l
... Component receiving surface, 22 ... Groove, 3 ... Pin guide hole, 4 ... Push-up pin, 4a ... Tip part, 5 ...
- Vacuum hole, 6...Adhesive sheet, 7...Adsorption collet, W...Electronic component.
Claims (1)
上げピンを突出可能にしかつこのピンガイド孔の周囲に
複数個の真空吸着孔を開口させてなる真空吸着ステージ
上に、電子部品が貼着された粘着性シートを吸着し、こ
のシートに貼着された電子部品を前記シート受面の中央
部に設けたピンガイド孔に対応する位置に位置決めする
とともに、前記突上げピンの突上げ動作により剥離して
吸着コレットに吸着保持させてなる電子部品の突上げ装
置であって、 前記ピンガイド孔が設けられたシート受面の中央部に、
電子部品のサイズより小径な部品受面を形成し、この部
品受面の周囲に溝を形成して、この溝に前記各々の真空
吸着孔を開口させたことを特徴とする電子部品の突上げ
装置。(1) Electronic components are mounted on a vacuum suction stage that allows a push-up pin to protrude from a pin guide hole provided in the center of the seat receiving surface and that has multiple vacuum suction holes opened around the pin guide hole. The electronic component attached to this sheet is positioned at a position corresponding to the pin guide hole provided in the center of the sheet receiving surface, and the protrusion of the push-up pin is A device for pushing up electronic components, which is peeled off by a lifting action and held by a suction collet by suction, wherein the pin guide hole is provided in the center of the sheet receiving surface.
A push-up of an electronic component, characterized in that a component receiving surface having a diameter smaller than the size of the electronic component is formed, a groove is formed around the component receiving surface, and each of the vacuum suction holes is opened in the groove. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1301160A JPH03161999A (en) | 1989-11-20 | 1989-11-20 | Pushing-up equipment for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1301160A JPH03161999A (en) | 1989-11-20 | 1989-11-20 | Pushing-up equipment for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03161999A true JPH03161999A (en) | 1991-07-11 |
Family
ID=17893509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1301160A Pending JPH03161999A (en) | 1989-11-20 | 1989-11-20 | Pushing-up equipment for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03161999A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1178718A1 (en) * | 2000-08-04 | 2002-02-06 | United Monolithic Semiconductor S.A.S. | Device for extracting components |
| EP1601005A2 (en) * | 2004-05-28 | 2005-11-30 | ASM Assembly Automation Ltd. | Peeling device for chip detachment |
| CN105430917A (en) * | 2015-11-30 | 2016-03-23 | 江门崇达电路技术有限公司 | Method for fabricating connected slot in PCB |
-
1989
- 1989-11-20 JP JP1301160A patent/JPH03161999A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1178718A1 (en) * | 2000-08-04 | 2002-02-06 | United Monolithic Semiconductor S.A.S. | Device for extracting components |
| FR2812789A1 (en) * | 2000-08-04 | 2002-02-08 | United Monolithic Semiconduct | DEVICE FOR TAKING COMPONENTS |
| EP1601005A2 (en) * | 2004-05-28 | 2005-11-30 | ASM Assembly Automation Ltd. | Peeling device for chip detachment |
| KR20060046237A (en) * | 2004-05-28 | 2006-05-17 | 에이에스엠 어쌤블리 오토메이션 리미티드 | Peeling device for chip detachment |
| EP1601005A3 (en) * | 2004-05-28 | 2008-11-12 | ASM Assembly Automation Ltd. | Peeling device for chip detachment |
| CN105430917A (en) * | 2015-11-30 | 2016-03-23 | 江门崇达电路技术有限公司 | Method for fabricating connected slot in PCB |
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