JP3967608B2 - Electronic component delivery mechanism and method in electronic component transport apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component delivery mechanism and method in an electronic component transport apparatus, and more particularly to an electronic component delivery mechanism and method in a transport apparatus for minute electronic components (hereinafter also referred to as devices) such as transistors, diodes, and ICs. .
[0002]
[Prior art]
The minute electronic components (devices) as described above are individually put into a linear movement type transport mechanism (hereinafter also referred to as a linear parts feeder), aligned by the transport mechanism, and various types of automatic handling systems (auto handlers). Supplied to the processing step. In various processing steps, various processes such as an electrical property test, marking, appearance inspection, taping, and the like are performed.
[0003]
FIG. 1 shows a conventional device delivery mechanism at the front end of a linear movement type conveyance mechanism (linear parts feeder) used in the automatic handling system. FIG. 1A is a side view schematically showing a conventional device delivery mechanism (partially a cross-sectional view), and FIG. 1B is a front view thereof (with a vacuum suction part removed). .
In these drawings, reference numeral 1 denotes a linear parts feeder which vibrates in the traveling direction and sequentially and continuously conveys the devices 2 to the tip 3. On the other hand, a vacuum suction part 4 is provided in front of the tip part 3, and the device 2 that has reached the tip part 3 is moved to the delivery position 5 by vacuum suction. A vacuum chuck 6 that can move up and down is arranged above the delivery position 5, and is lowered when the device 2 is delivered. After the device 2 is vacuum-sucked, it is raised and the device 2 is transferred to the next processing step stage. It has become.
As another conventional device delivery mechanism, as shown in FIG. 2, a push-up pin 7 that can be moved up and down is disposed below the delivery position 5 and is lifted during delivery to support the device 2 by vacuum suction. There are also configurations that do.
[0004]
However, the conventional device delivery mechanism has the following problems.
The linear parts feeder 1 vibrates for device conveyance, and the device 2 is supplied in the linear parts feeder 1 with a large play as shown in the figure. Therefore, if the device 2 is chucked directly from the vibrating linear parts feeder 1 by the vacuum chuck 6, the position of the device 2 becomes unstable and a chucking mistake may occur.
Further, the supply speed of the device 2 immediately before the delivery position 5 is left to the linear parts feeder 1, the supply speed is slow, and it takes time to deliver the device. Furthermore, when the device 2 has a resin burr, the resin burr of the delivery device 2 and the subsequent device 2 may be caught and the device 2 may fall.
[0005]
[Problems to be solved by the invention]
The present invention eliminates the problems of the prior art, increases the positioning accuracy of the electronic component at the delivery position, eliminates the chucking mistake due to the unstable position of the electronic component, increases the supply speed of the electronic component, and shortens the delivery time. It is an object of the present invention to provide an electronic component delivery mechanism and method in an electronic component conveying apparatus that can eliminate the chucking mistake caused by the electronic components falling due to the catching of resin burrs.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the electronic component delivery mechanism in the electronic component conveying apparatus according to claim 1 conveys a large number of electronic components individually and sequentially on the electronic component conveying device, and the tip of the electronic component conveying device. In the electronic component delivery mechanism in the electronic component transport apparatus, the electronic component is delivered to the vacuum suction means at the electronic component delivery position in front of the tip portion. It is movable between a tip position and the electronic component delivery position, and has a vacuum suction portion for receiving the electronic component by vacuum suction at the tip position, and the received electronic component is delivered to the electronic component An electronic component suction moving means for moving the electronic component to the position, an air blow means for assisting the supply of the electronic component in the vicinity of the position of the tip of the electronic component transport device, and a subsequent electronic component before the electronic component is delivered. Stopper means for preventing protrusion and elevating means for elevating and lowering the electronic component adsorption moving means, the electronic component adsorption movement means having an axis perpendicular to the direction in which the electronic component is moved, and centering on this axis It is characterized by comprising a lever member swingable in the rotation direction.
According to another aspect of the present invention, there is provided an electronic component delivery method in which the electronic component delivery method sequentially and continuously conveys a large number of electronic components individually on the electronic component delivery device. In the electronic component delivery method in the electronic component transport apparatus, the parts are supplied, and the electronic component is delivered to the vacuum suction means at the electronic component delivery position in front of the tip part. The electronic component can be moved between the electronic component delivery position by a lever member that swings in a rotational direction about an axis perpendicular to the direction in which the electronic component is moved, and the electronic component is vacuum-sucked at the tip position. Electronic component suction moving means having a vacuum suction portion for receiving the electronic component, stopper means for stopping the subsequent electronic component before delivery of the electronic component to prevent popping out, and the electronic component suction movement The electronic component sucking and moving means for receiving the supplied electronic component and delivering the electronic component to the vacuum suction means at the electronic component delivery position, and the stopper means. Then, before the delivery, the subsequent electronic component is stopped and prevented from popping out, and when the electronic component is delivered to the vacuum suction means, the electronic component suction moving means is raised by the elevating means.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
The preferred embodiments of the present invention will be described below.
FIG. 3 is a diagram schematically showing the structure of an electronic component delivery mechanism (hereinafter also referred to as a device delivery mechanism) according to an embodiment of the present invention. 3A is a side view of the electronic component delivery mechanism (partially a sectional view), and FIG. 3B is a front view of the electronic component delivery mechanism (with the arm-like member removed). In FIG. 3A, what is indicated by a one-dot chain line is a state at the time of device supply, and what is indicated by a solid line is a state at the time of device delivery.
[0008]
In the figure, 11 is a linear parts feeder, which vibrates in the device traveling direction to align the devices 12 and sequentially and sequentially conveys them to the tip portion 13. The linear parts feeder 11 has a positioning member 14 for positioning the device 12 in the width direction, and a notch portion 15 is formed at the distal end portion 13. When the device 12 is a semiconductor element such as an IC, the positioning member 14 performs positioning so that the distance from the device 12 is about 0.05 to 0.1 mm on one side. B is a resin burr of the device 12.
[0009]
A lever member 16 is disposed on the front side of the linear parts feeder 11 so as to be swingable around a shaft 17. The lever member 16 has a placement portion 18 for placing the supplied device 12, and a vacuum for vacuum-fixing the device 12 supplied at the distal end portion 13 of the linear parts feeder 11 by vacuum suction. It has a suction part 19. The lever member 16 is swingable between a device delivery position indicated by a solid line and a device supply position indicated by an alternate long and short dash line, and the swinging operation is performed by an actuator 20 including a high-speed operation solenoid.
[0010]
A vacuum chuck 22 is installed above the device delivery position 21 so as to be movable up and down. In addition, an air blow unit 23 that assists the supply of the device 12 is installed in front of the front end portion 13 of the linear parts feeder 11. Further, above the vicinity of the tip 13 of the linear parts feeder 11, a stopper 24 for preventing the subsequent device 12 at the device supply position (tip 13) from unexpectedly jumping out around the shaft 25 when the device is delivered. It is rotatably arranged. The rotation operation of the stopper 24 is performed by an actuator 26 composed of a high-speed operation solenoid or the like, and can swing between an operation position indicated by a solid line and a non-operation position indicated by a one-dot chain line.
[0011]
A shaft 17 that pivotally supports the lever member 16 is rotatably attached to a support base 27. The support base 27 is raised by the operation of an actuator 28 such as a high-speed operation solenoid as shown in FIG. Otherwise, it is in the lowered position as shown in FIG.
[0012]
Next, the operation of the device delivery mechanism of this embodiment will be described.
First, the linear parts feeder 11 vibrates in the device traveling direction, aligns the devices 12, and sequentially and sequentially conveys them toward the tip portion 13. The air blow unit 23 blows air toward the distal end portion 13 to assist the supply of the device 12 to the distal end portion 13. In this conveyance, the device 12 is positioned in the width direction by the positioning member 14.
[0013]
At the time of supplying the device, the actuator 20 operates to swing the lever member 16 to the position of the alternate long and short dash line. At this time, the stopper 24 is in the position of the one-dot chain line, and the support base 27 is in the lowered position. The lever member 16 is positioned in the width direction in the linear parts feeder 11 by the vacuum suction portion 19 and vacuum-fixes the device 12 that has reached the distal end portion 13. Thereafter, the lever member 16 swings to the solid line position by the operation of the actuator 20, whereby the delivery device 12 (hatched) is placed on the placement portion 18 of the lever member 16. Is forcibly pulled out and separated from the vibrating linear parts feeder 11. In synchronization with this operation, the next delivery device 12 reaches the tip 13 by the vibration of the linear parts feeder 11. Next, the support base 27 is raised by the operation of the actuator 28, so that even if there is an overlap of the resin burrs B between the devices 12 as shown in FIG. 3, the overlap of the resin burrs B is separated as shown in FIG. Then, after the vacuum chuck 22 is lowered and chucks the device 12 to be delivered, simultaneously with the ascent, the stopper 24 is in a solid line position by the operation of the actuator 26, and the subsequent device 12 is prevented from popping out when the device is received.
When the delivery of the device 12 is completed, after the lever member 16 has moved to pick up the device 12 at the distal end portion 13, the stopper 24 is rotated to the state of the one-dot chain line by the operation of the actuator 26.
[0014]
By repeating the above operation, device delivery is performed at high speed. For example, when a high-speed operation solenoid is used as the actuators 20 and 26, the device supply operation can be 20 ms or less per cycle. Further, positioning in the width direction by the positioning portion 14 and delivery in a state separated from the linear parts feeder 11 at the time of device delivery improves positioning accuracy and eliminates a chucking error due to unstable device position. Furthermore, even if the resin burrs B overlap each other in the device 12, the lever member 16 rises together with the support base 27 at the time of delivery of the device, and the overlap of the resin burrs B is separated. Eliminates chucking mistakes due to overlap.
[0015]
Although the present invention has been described based on one embodiment, the present invention is not limited to the above embodiment, and various modifications and changes can be made.
For example, in the above embodiment, a swingable lever member is used as the electronic component suction moving means, but a member that moves forward and backward in a linear direction may be used.
In the above embodiment, a high-speed solenoid is used as the actuator, but an eccentric cam using a pulse motor may be used.
[0016]
【The invention's effect】
According to the present invention, the electronic component transport device is separated from the vibrating electronic component transport device by forcibly pulling the supplied electronic component by the electronic component suction moving means that can be vacuum fixed at the tip of the electronic component transport device. Since electronic parts can be delivered, positioning accuracy is improved and chucking mistakes due to unstable electronic part positions can be eliminated.
Further, by providing the electronic component suction moving means and the stopper means for preventing the electronic component from popping out, the supply speed of the electronic components can be increased.
Further, when the electronic component is delivered, the lifting / lowering means raises the electronic component suction moving means. Therefore, even if there is an overlap between the resin burr of the delivered electronic component and the resin burr of the subsequent electronic component, it is separated. Chucking mistakes can be eliminated.
[Brief description of the drawings]
1A and 1B are diagrams schematically showing a structure of a conventional device delivery mechanism, where FIG. 1A is a side view and FIG. 1B is a front view.
2A and 2B are views schematically showing the structure of another conventional device delivery mechanism, where FIG. 2A is a side view and FIG. 2B is a front view.
3A and 3B are diagrams schematically showing a structure of a device delivery mechanism according to an embodiment of the present invention, where FIG. 3A is a side view and FIG. 3B is a front view.
FIG. 4 is a diagram illustrating a state of a device delivery mechanism at the time of device delivery.
[Explanation of symbols]
11 Linear parts feeder 12 Device (micro electronic parts)
13 Tip part 14 Positioning member 15 Notch part 16 Lever member 17 Shaft 18 Placement part 19 Vacuum suction part 20 Actuator 21 Device delivery position 22 Vacuum chuck 23 Air blow part 24 Stopper 25 Shaft 26 Actuator 27 Support base 28 Actuator B Resin burr

Claims (2)

A number of electronic components individually in sequence continuously transporting the electronic component transporting apparatus above performs the supply of the electronic component at the tip of the electronic component conveying device, vacuum at the front of the electronic component transfer position than the tip In the electronic component delivery mechanism in the electronic component transport device that delivers the electronic component to the suction means,
Electronic wherein a the tip position of the electronic component conveying device movable between said electronic component delivery position, having a vacuum suction unit for receiving and vacuum suck the electronic component at the tip position, the received an electronic component suction moving means for moving the component to the electronic component delivery position,
And air blowing means for assisting the supply of the electronic component at the tip position near the electronic component conveying device,
Stopper means for preventing subsequent electronic parts from popping out before delivery of the electronic parts;
And a lifting means for lifting the electronic component suction moving means,
The electronic component suction moving means comprises a lever member that has a shaft in a direction perpendicular to the direction in which the electronic component is moved, and that is swingable in the rotational direction about the shaft. Delivery mechanism. A large number of electronic components sequentially transported continuously at discrete electronic component conveying device on, perform the supply of the electronic components in the vicinity of the distal end portion of the electronic component conveying device, the electronic component transfer position in front than the tip In the electronic component delivery method in the electronic component transport device, which delivers the electronic component to the vacuum suction means,
It is movable between the tip position of the electronic component transport device and the electronic component delivery position by a lever member that swings in a rotational direction about an axis perpendicular to the direction in which the electronic component is moved. Electronic component suction moving means having a vacuum suction part for vacuum-sucking and receiving the electronic component at the part position;
Stopper means to stop the subsequent electronic parts and prevent popping out before delivery of the electronic parts,
Elevating means for elevating the electronic component suction moving means;
Using,
By the electronic component suction moving means to receive said electronic components, which is supplied, together with the transferring electronic components to the vacuum suction means in the electronic component delivery position, pop-out to stop the subsequent electronic components before delivery by the stopper means An electronic component delivery method in an electronic component transport apparatus , wherein the electronic component suction moving means is raised when the electronic component is delivered to the vacuum suction means by the elevating means .

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