JPS6233337Y2 - - Google Patents
Info
- Publication number
- JPS6233337Y2 JPS6233337Y2 JP16566386U JP16566386U JPS6233337Y2 JP S6233337 Y2 JPS6233337 Y2 JP S6233337Y2 JP 16566386 U JP16566386 U JP 16566386U JP 16566386 U JP16566386 U JP 16566386U JP S6233337 Y2 JPS6233337 Y2 JP S6233337Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- cooling plate
- resin
- adhesive layer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 239000010408 film Substances 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000004809 Teflon Substances 0.000 description 5
- 229920006362 Teflon® Polymers 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- -1 polyfluoroethylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16566386U JPS6233337Y2 (enExample) | 1986-10-30 | 1986-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16566386U JPS6233337Y2 (enExample) | 1986-10-30 | 1986-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6276541U JPS6276541U (enExample) | 1987-05-16 |
| JPS6233337Y2 true JPS6233337Y2 (enExample) | 1987-08-26 |
Family
ID=31095902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16566386U Expired JPS6233337Y2 (enExample) | 1986-10-30 | 1986-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6233337Y2 (enExample) |
-
1986
- 1986-10-30 JP JP16566386U patent/JPS6233337Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6276541U (enExample) | 1987-05-16 |
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