JPS6232635A - Resin sealed type module - Google Patents

Abstract

PURPOSE:To prevent deterioration of characteristics and to improve reliability, by providing a coupling means having a large contact area at a connecting part of an external-terminal taking out electrode and an external terminal, assembling the connecting part and the coupling means, and soldering and bonding the coupling part. CONSTITUTION:Both end parts of an external-terminal taking out electrode 14 are bent in one direction at the angle of about 90 deg.. Thus bent parts 14a and 14b are formed so as to form a U shape. The back surface of the electrode is soldered and fixed to the outer surface of a thermal stress buffer material 1. Meanwhile, in an outer terminal 15, to which the external-terminal taking out electrode 14 is connected, U shaped engaging parts 15b and 15c and a reinforcing plate 15d are provided as a unitary body. Coupling holes 15a, to which the bent parts 14a and 14b can be inserted, are formed in the engaging parts. The bent parts 14a and 14b of the external-terminal taking out electrode 14 are inserted in the coupling holes 15a of the engaging parts 15b and 15c of the external terminal 15 as shown by arrows. The bonding parts are fixed by solder. Thus, the contact area of the contact part between the external terminal taking out electrode 14 and the external terminal 15 can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a resin-sealed module configured by resin-sealing a plurality of semiconductor chips.

[Conventional technology]

Conventionally, this type of resin-sealed module has a semiconductor pellet 3 such as a diode or thyristor placed between a pair of thermal stress buffering materials 1 and 2 formed into a flat plate, as shown in FIG. The semiconductor pellet 3 and the thermal stress buffering materials 1 and 2 are integrated, and the external terminal extraction electrode 4 is brazed to the outer surface of the thermal stress buffering material 1 to form a basic element, as shown in FIG. External terminals 5 and 6 are soldered to the basic element and attached to the heat dissipation base 8 via the insulating substrate T. A case 9 is placed on the heat dissipation space 8, and then an epoxy resin 10 is filled and hardened. It is sealed with resin.

[Problem that the invention seeks to solve]

In the conventional resin-sealed module as mentioned above,
To connect the external terminal extraction electrode 4 and the external terminal 5, insert the cut-out part 5 & of the external terminal 5 into the corner 4 of the external terminal extraction electrode 4, and solder with low temperature solder to form a multi-joint. In this case, the contact area between the external terminal extraction electrode 4 and the external terminal 5 was approximately 511n x 5cm or less.

However, in the case of such a joint structure with a small contact area, when the current capacity is about 100 A or less, current flows through the joint, causing heat generation in the joint and raising the temperature.
There was no problem because the temperature at this junction was below about 130°C, but in a 1U flow capacity module of about 100 to 300A, the temperature rise at the junction was the melting point of the solder (18
In addition, even if the temperature does not rise to near the melting point of the solder, the temperature rises above approximately 130°C, causing the inconvenient problem of melting the low-temperature solder and deteriorating its characteristics. However, there was an inconvenient problem in that the strength of the low-temperature solder gradually decreased, the characteristics deteriorated, and the reliability decreased.

This invention was made to solve the above-mentioned conventional problems, and by increasing the contact area between the external terminal extraction electrode and the external terminal, it prevents characteristic deterioration and improves reliability. The object of the present invention is to provide a resin-sealed semiconductor module that can be

[Means for Solving the Problems] The resin-sealed module according to the present invention is provided with a fitting means having a large contact area at the connection portion between the external terminal extraction electrode and the external terminal, and combines the two. This fitting portion is joined by soldering.

[Effect]

In this invention, the contact area of the joint portion is increased and the temperature rise of the contact portion can be suppressed to about 130° C. or less by soldering.

〔Example〕

FIG. 1 is a perspective view showing an embodiment of the present invention, and the same reference numerals as in the previous figures indicate the same or corresponding parts. In the same figure, the external terminal extraction electrode 14 is formed into a U-shape having bent portions 14m and 14b bent in one direction at an angle of about 90 degrees on both ends thereof, and the back side thereof has a thermal stress buffer. Brazing is fixed to the outer surface of the material 1. On the other hand, the external terminal 15 to which this external terminal extraction electrode 14 is connected has the bent portion 14 on its lower side.

U-shaped engaging portions 15b and 15e each having a fitting hole 15& into which the fitting 14b can be inserted, and a reinforcing plate 15d thereof are integrally provided. Then, the engaging portion 15b of the external terminal 15 is attached to the bent portion 114b of the external terminal extraction electrode 14.
, 15e are inserted into the fitting holes 15m from the direction of the arrows, and the joints are fixed by soldering.

According to such a configuration, the contact area of the contact portion between the external terminal extraction electrode 14 and the external terminal 15 can be increased.
The temperature rise at this contact portion will not exceed about 130° C., and deterioration such as melting of the solder will not occur, and reliability problems will not occur.

In the above embodiment, the external terminal extraction electrode 14 has a convex bent portion 14&.

14b and on the other hand, the external terminal 15 is provided with concave engaging portions 15b and 15e. However, the present invention is not limited to this, and the fitting structure in which the concave and convex shapes are reversed has been described. It goes without saying that the same effect as described above can be obtained by using a combined structure, a combined structure of these, or a modified structure thereof. [Effects of the Invention] As explained above, according to the present invention, By providing a fitting means at the connection part between the electrode and the external terminal so that they fit into each other and joining the fitting part by soldering, the contact area between the two can be increased, so the temperature rise at the contact part can be reduced by approximately 130%. ℃ or less, eliminates melting of low-temperature solder at the contact portion, prevents deterioration of characteristics, and improves reliability.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a bonding structure between a semiconductor basic element portion and an external terminal, showing an embodiment of a resin-sealed module according to the present invention, and FIG. 2 is a conventional bonding structure between a semiconductor basic element portion and an external terminal. FIG. 3 is a sectional view of a main part of a conventional resin-sealed module. 1.2...Thermal stress buffering material, 3...Semiconductor pellet, 14...Electric wire for taking out external terminals, 14m, 14
b...Bending portion, 15...External terminal, 151
e*e・fitting hole, 15b, 15c e・biting/retaining part.

Claims (1)

[Claims] A resin-sealed module in which a semiconductor pellet is placed between a pair of thermal stress buffering materials, and the connection portion between the external terminal extraction electrode and the external terminal is soldered and fixed to the thermal stress buffering material by brazing. A resin-sealed module characterized in that the connecting portions are provided with fitting means that have a large contact area with each other, the two are combined, and the fitting portions are joined by soldering.