JPS6232614B2 - - Google Patents
Info
- Publication number
- JPS6232614B2 JPS6232614B2 JP16377579A JP16377579A JPS6232614B2 JP S6232614 B2 JPS6232614 B2 JP S6232614B2 JP 16377579 A JP16377579 A JP 16377579A JP 16377579 A JP16377579 A JP 16377579A JP S6232614 B2 JPS6232614 B2 JP S6232614B2
- Authority
- JP
- Japan
- Prior art keywords
- compressed gas
- wafer
- mixed gas
- container
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 2
- 238000009501 film coating Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 239000012744 reinforcing agent Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003623 enhancer Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16377579A JPS5685825A (en) | 1979-12-17 | 1979-12-17 | Thin film coating device of semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16377579A JPS5685825A (en) | 1979-12-17 | 1979-12-17 | Thin film coating device of semiconductor wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5685825A JPS5685825A (en) | 1981-07-13 |
JPS6232614B2 true JPS6232614B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-07-15 |
Family
ID=15780474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16377579A Granted JPS5685825A (en) | 1979-12-17 | 1979-12-17 | Thin film coating device of semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5685825A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02111911U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-02-20 | 1990-09-07 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5988824A (ja) * | 1982-11-12 | 1984-05-22 | Hitachi Tokyo Electronics Co Ltd | ウエハ処理装置 |
JPS59228719A (ja) * | 1983-06-10 | 1984-12-22 | Hitachi Tokyo Electronics Co Ltd | 電子部品の製造方法および製造装置 |
JPS6122627A (ja) * | 1984-07-10 | 1986-01-31 | Mitsubishi Electric Corp | 感光性樹脂塗布装置 |
JPS62131264A (ja) * | 1985-12-03 | 1987-06-13 | Nec Corp | シランカツプリング剤処理装置 |
JPS62148943A (ja) * | 1985-12-23 | 1987-07-02 | Nec Corp | シランカツプリング剤処理方法 |
JPH0793254B2 (ja) * | 1987-07-22 | 1995-10-09 | 松下電子工業株式会社 | レジスト膜形成用基板の処理方法 |
-
1979
- 1979-12-17 JP JP16377579A patent/JPS5685825A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02111911U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1989-02-20 | 1990-09-07 |
Also Published As
Publication number | Publication date |
---|---|
JPS5685825A (en) | 1981-07-13 |