JPS5685825A - Thin film coating device of semiconductor wafer - Google Patents
Thin film coating device of semiconductor waferInfo
- Publication number
- JPS5685825A JPS5685825A JP16377579A JP16377579A JPS5685825A JP S5685825 A JPS5685825 A JP S5685825A JP 16377579 A JP16377579 A JP 16377579A JP 16377579 A JP16377579 A JP 16377579A JP S5685825 A JPS5685825 A JP S5685825A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- reinforcing agent
- anchor reinforcing
- wafer
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
PURPOSE:To obtain a uniform thin film through the effectie use of an anchor reinforcing agent by a method wherein the vapor of the anchor reinforcing agent and a mixed gas of compressed gas are injected into a wafer. CONSTITUTION:The compressed gas is introduced in a vessel 3, the anchor reinforcing agent 5 is heated to cause vapor to be promoted and the mixed gas is discharged 2 and injected into the wafer 8 through a nozzle 7. The wafer 8 is adsorbed to and rotated by means of a motor 10 to be coated for forming a thin film. A valve 13 regulates a pressure and electromagnetic valves 12, 12' and flow control valves 11, 11' control the injection and displacement of the compressed gas and mixes gas respectively and control a film tickness. With this construction, since the expensive anchor reinforcing agent can effectively be utilized, it is economical, and the film thickness control can be performed easily and in high precesion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16377579A JPS5685825A (en) | 1979-12-17 | 1979-12-17 | Thin film coating device of semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16377579A JPS5685825A (en) | 1979-12-17 | 1979-12-17 | Thin film coating device of semiconductor wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5685825A true JPS5685825A (en) | 1981-07-13 |
JPS6232614B2 JPS6232614B2 (en) | 1987-07-15 |
Family
ID=15780474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16377579A Granted JPS5685825A (en) | 1979-12-17 | 1979-12-17 | Thin film coating device of semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5685825A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5988824A (en) * | 1982-11-12 | 1984-05-22 | Hitachi Tokyo Electronics Co Ltd | Wafer processing apparatus |
JPS59228719A (en) * | 1983-06-10 | 1984-12-22 | Hitachi Tokyo Electronics Co Ltd | Method and apparatus for manufacturing electronic element |
JPS6122627A (en) * | 1984-07-10 | 1986-01-31 | Mitsubishi Electric Corp | Photo-sensitive resin coating nozzle |
JPS62131264A (en) * | 1985-12-03 | 1987-06-13 | Nec Corp | Apparatus for treating silane coupling agent |
JPS62148943A (en) * | 1985-12-23 | 1987-07-02 | Nec Corp | Treatment with silane coupling agent |
JPS6425535A (en) * | 1987-07-22 | 1989-01-27 | Matsushita Electronics Corp | Treatment of substrate for forming resist film |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02111911U (en) * | 1989-02-20 | 1990-09-07 |
-
1979
- 1979-12-17 JP JP16377579A patent/JPS5685825A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5988824A (en) * | 1982-11-12 | 1984-05-22 | Hitachi Tokyo Electronics Co Ltd | Wafer processing apparatus |
JPS59228719A (en) * | 1983-06-10 | 1984-12-22 | Hitachi Tokyo Electronics Co Ltd | Method and apparatus for manufacturing electronic element |
JPS6122627A (en) * | 1984-07-10 | 1986-01-31 | Mitsubishi Electric Corp | Photo-sensitive resin coating nozzle |
JPH0237687B2 (en) * | 1984-07-10 | 1990-08-27 | Mitsubishi Electric Corp | |
JPS62131264A (en) * | 1985-12-03 | 1987-06-13 | Nec Corp | Apparatus for treating silane coupling agent |
JPS62148943A (en) * | 1985-12-23 | 1987-07-02 | Nec Corp | Treatment with silane coupling agent |
JPS6425535A (en) * | 1987-07-22 | 1989-01-27 | Matsushita Electronics Corp | Treatment of substrate for forming resist film |
Also Published As
Publication number | Publication date |
---|---|
JPS6232614B2 (en) | 1987-07-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR890008936A (en) | Organometallic Chemical Vapor Deposition Apparatus and Method of Use | |
JPS5685825A (en) | Thin film coating device of semiconductor wafer | |
JPS5762311A (en) | Liquid fuel combustion apparatus | |
JPS5362037A (en) | Carburetter with auxiliary accelerator pump | |
JPS56154134A (en) | Distribution type fuel jet device | |
CA1215509A (en) | Method and apparatus for casting around metal bodies | |
JPS55117068A (en) | Fuel injection nozzle | |
JPS61103572A (en) | Coating method of two-pack type paint | |
JPS54124313A (en) | Liquid fuel atomizer | |
JPS5783658A (en) | Fuel injection device | |
JPS5428933A (en) | Pressure control valve | |
JPS62148943A (en) | Treatment with silane coupling agent | |
JPS5317835A (en) | Fuel control system | |
JPS55123356A (en) | Fuel injection apparatus | |
JPS5334015A (en) | Fuel injection valve | |
JPS5738126A (en) | Manufacture of heat insulated cabinet | |
FR2115585A5 (en) | Gas-liquid emulsion generator - for foundry sand hardening agent | |
JPS5672252A (en) | Fuel supply device | |
JPS5317830A (en) | Exhaust gas recirculation amount controlling apparatus | |
JPS53134117A (en) | Injection carburetor | |
JPS556187A (en) | Rotary burner with nitrogen oxide decreased | |
JPS5650408A (en) | Fluid microquantifying and supplying method | |
JPS5584847A (en) | Mixed gas atomization accelerator for internal-combustion engine | |
JPS5622313A (en) | Discharge graft polymerization | |
JPS5786551A (en) | Fuel feeder for liquidified gas |