JPS62294164A - Method and apparatus for vapor deposition - Google Patents

Abstract

PURPOSE:To form a vapor deposited film having a uniform thickness on the surface of a plate material for vapor deposition by mounting a vapor deposition material to one face of a light transmissive substrate, disposing the plate material for vapor deposition to face said face ad radiating laser light from the back of the light transmissive substrate. CONSTITUTION:The substrate 11 consisting of quart, etc., having excellent light transmissivity is disposed in a vacuum vessel 13. The vapor deposition material such as Al, Au, W, Ti, or Mo is mounted to the surface 11a of the light transmissive substrate 11. The flat plate material 14 for vapor deposition having a large aspect ratio of the surface 14a for vapor deposition is disposed to the position where said material face the surface of the substrate. the quartz substrate is irradiated with laser light 15 from behind the same. The laser light light 15 passes the substrate 11 and heats and evaporates the material 12, thus forming the vapor deposited film of a uniform thickness on the surface 14a of the material 14 facing same.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Industrial Application Field] The invention of the present application relates to a vapor deposition method and a vapor deposition apparatus for heating and vaporizing a vapor deposition material and adhering the vapor deposition material to a material to be vaporized. It is.

[Summary of the invention]

The present invention provides the vapor deposition method and vapor deposition apparatus as described above, in which the surface of the material to be vaporized faces the vapor deposition material disposed on the first surface of the transparent substrate, and By irradiating the second surface opposite to the first surface with heating light,
This makes it possible to obtain uniform vapor deposition and high throughput.

[Conventional technology]

7. A common method for depositing is a method in which point-shaped vapor deposition material is heated and evaporated in a high vacuum. In this case, in order to perform uniform deposition on a large number of materials to be deposited, it is common to lengthen the mean free path.

[Problem that the invention seeks to solve]

However, when performing evaporation on a material whose surface is uneven, if the mean free path is long, the evaporation material will adhere to the concave portions of the evaporation surface, making it difficult to perform uniform evaporation. Can not.

Furthermore, when the area of the deposition surface of each deposition material increases, the number of deposition materials that can be deposited at one time decreases, and the throughput decreases.

Means for Solving Problem C] The vapor deposition method according to the invention of the present application includes the steps of preparing a substrate 11 made of a translucent material and having a vapor deposition material 12 disposed on a first surface 11a; Deposition surface 14a of vapor deposition material 14
facing the vapor deposition material 12; and
heating the vapor deposition material 12 by irradiating the second surface 11b opposite to the first surface 11a of the vapor deposition material 12, and depositing the vapor deposition material 12 on the vapor deposition surface 14a. Equipped with

Further, the vapor deposition apparatus according to the invention of the present application includes a substrate 11 made of a light-transmitting material and having a vapor deposition material 12 disposed on the first surface 11a, and a vapor deposition surface 14a of the vapor deposition material 14 made of a transparent material. a support mechanism that supports the material to be deposited 14 while facing the substrate 12; and a light source that irradiates a second surface 11b of the substrate 11 opposite to the first surface 11a with heating light 15. Each is equipped with the following.

[Effect]

In the vapor deposition method and single deposition apparatus according to the invention of the present application, the substrate 11
Since the vapor deposition is performed using the vapor deposition material 12 arranged on the surface 11a, the vapor deposition source is not point-like but planar, and
Even if the aspect ratio of the evaporation material 12 is high, a high proportion of the evaporation material 12 reaches the evaporation target surface 14a at approximately a predetermined angle.

Further, since the vapor deposition source is planar, the substrate 11 and the light source are placed on the vapor deposition material 12 while the vapor deposition surface 14a is opposed to the vapor deposition material 12.
If the substrate 11 is moved toward the surface 11a of the substrate 11 relative to the substrate 11, a plurality of materials 14 to be deposited having a large area of the surface to be deposited 14a can be continuously deposited even in a deposition apparatus having a small floor area.

In addition, of the substrate 11, the deposition surface 14a of the deposition material 14 is
The second face 1 on the opposite side to the first face 11a facing
1b is irradiated with the heating light 15, vapor deposition can be performed with the vapor deposition material 12 and the surface to be vapor-deposited 14a brought close to each other.

〔Example〕

Hereinafter, one embodiment of the invention of the present application will be described with reference to the drawings.

In this embodiment, a quartz substrate 11 on which a vapor deposition material 12 is preliminarily deposited on a first surface 11a is placed in a vacuum vessel 13, and a surface to be vaporized of a material to be vaporized 14 is placed in the vacuum vessel 13.
4a is made to face vapor deposition t and 4 material 12.

In this case, if the thickness of the film to be formed on the deposition surface 14a by vapor deposition is about 0.4 μm, the distance between the deposition material 12 and the deposition surface 14a is preferably about 5 to 10 μm.

Then, a second surface 11b of the quartz substrate 11 opposite to the first surface 11a is irradiated with laser light 15 from a laser light source (not shown). Since the quartz substrate 11 is transparent to the laser beam 15, the laser beam 15 is transmitted through the quartz substrate 11.
is transmitted through the vapor deposition material 12 to selectively heat only the vapor deposition material 12. Then, the evaporation material 12 is evaporated by this heating, and the evaporated evaporation material 12 adheres to the surface to be evaporated 14a.

The vapor deposition material 12 includes AI, Au, W, T+,
Mo etc. can be used, and as a laser light source, YA
G laser, ^r laser, excimer laser, etc. can be used.

Methods of irradiating the laser beam 15 include a step-and-repeat method, a line-shaped irradiation method, and a method of irradiating the entire second surface 11b of the quartz substrate 11.

Furthermore, if a mask is formed with a mask that deflects the laser beam 15 and this mask is placed on the second surface 11b of the quartz substrate 11, the vapor deposition material 12 can be adhered to the vapor deposition surface 14a in accordance with the pattern of the mask. be able to.

If the evaporation material 12 with the same thickness as that to be formed on the evaporation target surface 14a is deposited on the quartz substrate 11 in advance, the evaporation material 12 is rapidly heated to a temperature higher than its melting point. For example, the first place is achieved in a very short time.

On the other hand, if the vapor deposition material 12 with a relatively thick film thickness is pre-deposited on the quartz substrate 11 and the vapor deposition material 12 is heated to around its melting point to gradually evaporate, the vapor deposition becomes relatively thick. Although it takes a long time, vapor deposition can be performed multiple times on the same quartz substrate 11.

Although the above embodiment uses the quartz substrate 11 on which the evaporation material 12 has been deposited in advance, the evaporation material 12 in the form of a thin film may simply be placed on the quartz substrate 11. Even in this case, since the quartz substrate 11 supports the vapor deposition material 12, handling is easy.

Furthermore, although laser light was used as the heating light in the above-described embodiments, other light such as infrared light may also be used. In that case, the vapor deposition material 12 is supported by a substrate that is transparent to these infrared rays and the like.

〔Effect of the invention〕

In the vapor deposition method and vapor deposition apparatus according to the invention of the present application, since the aspect ratio of the vapor deposition surface of the vapor deposition material is high, the proportion of the vapor deposition material reaching the vapor deposition surface at approximately a predetermined angle is high, and the vapor deposition material and the vapor deposition surface are Since the vapor deposition can be carried out in close proximity to the
Uniform vapor deposition is possible.

In addition, since a plurality of materials to be deposited having a large area can be continuously deposited, a high throughput can be obtained.

[Brief explanation of the drawing]

The drawing is a schematic side sectional view showing a vapor deposition apparatus according to the invention of the present application. In addition, in the symbols used in the drawings, 11-...----...- Quartz substrate 11 a--
------1.-First surface 11b------1--
−・−Second surface 12−−−1・・・−・−−−−1−−
- Vapor deposition material 14 - - - - - - - - - - - - Vapor deposition material 14 - - - - -
Deposited material 14 a-1--------Deposited surface 1
5.-1-----------------Laser light.

Claims (1)

[Claims] 1. A step of preparing a substrate made of a light-transmitting material and having a vapor deposition material arranged on its first surface, and making the surface of the vapor-deposited material face the vapor-deposited material. and a step of irradiating a second surface of the substrate opposite to the first surface with light to heat the deposition material, thereby depositing the deposition material on the surface to be deposited. vapor deposition method. 2. A substrate made of a transparent material and having a vapor deposition material arranged on its first surface, and supporting the vapor deposition material with the vapor deposition surface of the vapor deposition material facing the vapor deposition material. A vapor deposition apparatus including a support mechanism and a light source that irradiates a second surface of the substrate opposite to the first surface with heating light.