JPS62293654A - 半導体用ヒ−トパイプ冷却器およびその製造方法 - Google Patents

半導体用ヒ−トパイプ冷却器およびその製造方法

Info

Publication number
JPS62293654A
JPS62293654A JP13671886A JP13671886A JPS62293654A JP S62293654 A JPS62293654 A JP S62293654A JP 13671886 A JP13671886 A JP 13671886A JP 13671886 A JP13671886 A JP 13671886A JP S62293654 A JPS62293654 A JP S62293654A
Authority
JP
Japan
Prior art keywords
heat
heat pipe
pipe
nozzle
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13671886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0466389B2 (enrdf_load_stackoverflow
Inventor
Takashi Murase
孝志 村瀬
Suemi Tanaka
田中　末美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP13671886A priority Critical patent/JPS62293654A/ja
Publication of JPS62293654A publication Critical patent/JPS62293654A/ja
Publication of JPH0466389B2 publication Critical patent/JPH0466389B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP13671886A 1986-06-12 1986-06-12 半導体用ヒ−トパイプ冷却器およびその製造方法 Granted JPS62293654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13671886A JPS62293654A (ja) 1986-06-12 1986-06-12 半導体用ヒ−トパイプ冷却器およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13671886A JPS62293654A (ja) 1986-06-12 1986-06-12 半導体用ヒ−トパイプ冷却器およびその製造方法

Publications (2)

Publication Number Publication Date
JPS62293654A true JPS62293654A (ja) 1987-12-21
JPH0466389B2 JPH0466389B2 (enrdf_load_stackoverflow) 1992-10-23

Family

ID=15181868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13671886A Granted JPS62293654A (ja) 1986-06-12 1986-06-12 半導体用ヒ−トパイプ冷却器およびその製造方法

Country Status (1)

Country Link
JP (1) JPS62293654A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990009037A1 (en) * 1989-02-06 1990-08-09 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe-type semiconductor cooling device
US5283464A (en) * 1989-06-08 1994-02-01 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe type cooling apparatus for semiconductor
JP2644372B2 (ja) * 1989-02-02 1997-08-25 古河電気工業株式会社 電気絶縁型ヒートパイプ冷却器

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543841A (en) * 1967-10-19 1970-12-01 Rca Corp Heat exchanger for high voltage electronic devices
JPS5624875U (enrdf_load_stackoverflow) * 1979-08-02 1981-03-06
JPS5624875A (en) * 1979-08-07 1981-03-10 Ricoh Co Ltd Facsimile unit
JPS56110665U (enrdf_load_stackoverflow) * 1980-01-24 1981-08-27
JPS56108098A (en) * 1980-01-29 1981-08-27 Matsushita Electric Ind Co Ltd Heat pipe
JPS577980U (enrdf_load_stackoverflow) * 1980-06-18 1982-01-16
JPS5732396U (enrdf_load_stackoverflow) * 1980-07-30 1982-02-20
JPS5732396A (en) * 1980-07-31 1982-02-22 Yoshida Kogyo Kk <Ykk> Method for forming opaque colored film on aluminum surface
JPS5740882U (enrdf_load_stackoverflow) * 1980-08-14 1982-03-05
JPS61165591A (ja) * 1985-01-11 1986-07-26 Toshiba Corp 電気絶縁形ヒ−トパイプ

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543841A (en) * 1967-10-19 1970-12-01 Rca Corp Heat exchanger for high voltage electronic devices
JPS5624875U (enrdf_load_stackoverflow) * 1979-08-02 1981-03-06
JPS5624875A (en) * 1979-08-07 1981-03-10 Ricoh Co Ltd Facsimile unit
JPS56110665U (enrdf_load_stackoverflow) * 1980-01-24 1981-08-27
JPS56108098A (en) * 1980-01-29 1981-08-27 Matsushita Electric Ind Co Ltd Heat pipe
JPS577980U (enrdf_load_stackoverflow) * 1980-06-18 1982-01-16
JPS5732396U (enrdf_load_stackoverflow) * 1980-07-30 1982-02-20
JPS5732396A (en) * 1980-07-31 1982-02-22 Yoshida Kogyo Kk <Ykk> Method for forming opaque colored film on aluminum surface
JPS5740882U (enrdf_load_stackoverflow) * 1980-08-14 1982-03-05
JPS61165591A (ja) * 1985-01-11 1986-07-26 Toshiba Corp 電気絶縁形ヒ−トパイプ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644372B2 (ja) * 1989-02-02 1997-08-25 古河電気工業株式会社 電気絶縁型ヒートパイプ冷却器
WO1990009037A1 (en) * 1989-02-06 1990-08-09 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe-type semiconductor cooling device
US5283464A (en) * 1989-06-08 1994-02-01 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe type cooling apparatus for semiconductor

Also Published As

Publication number Publication date
JPH0466389B2 (enrdf_load_stackoverflow) 1992-10-23

Similar Documents

Publication Publication Date Title
US4982274A (en) Heat pipe type cooling apparatus for semiconductor
US10727163B2 (en) Semiconductor device
US5151777A (en) Interface device for thermally coupling an integrated circuit to a heat sink
JP2724033B2 (ja) 半導体モジユール
WO1990009036A1 (fr) Procede de production d&#39;un dispositif de refroidissement du type a caloduc pour element semi-conducteur
US3826957A (en) Double-sided heat-pipe cooled power semiconductor device assembly using compression rods
EP4195894A1 (en) Heat dissipation device and manufacturing method therefor
US5132777A (en) Cooled high-power semiconductor device
JPS62293654A (ja) 半導体用ヒ−トパイプ冷却器およびその製造方法
JPH0466390B2 (enrdf_load_stackoverflow)
JP2610041B2 (ja) ヒートパイプ式放熱器
US4358707A (en) Insulated collector assembly for power electronic tubes and a tube comprising such a collector
GB2167550A (en) Cooling apparatus for semiconductor device
JP2008196787A (ja) ヒートパイプ
KR930005489B1 (ko) 전기 절연형 히트 파이프식 반도체 냉각기
KR20100037675A (ko) 방열어셈블리
JPH02206151A (ja) ヒートパイプ式半導体冷却器
US3457474A (en) Semiconductor rectifier structure having semiconductor element assembly screwed into place on support base
JPH06185883A (ja) 絶縁型ヒートパイプおよび冷却ユニット
WO1999051069A2 (en) Fiber heat sink and fiber heat exchanger
JP2737792B2 (ja) 電気絶縁型ヒートパイプ
CN101552212A (zh) 半导体元件与热管的接合方法
JPH02275294A (ja) 電気絶縁型ヒートパイプ
CA1295054C (en) Grooved heat pipe cooling apparatus for semiconductors
KR20110052230A (ko) 전열블록을 구비한 히트파이프 제조방법, 이 방법에 의해 제조된 히트파이프 및 이러한 히트파이프를 포함한 냉각장치