JPS6229334B2 - - Google Patents
Info
- Publication number
- JPS6229334B2 JPS6229334B2 JP56195002A JP19500281A JPS6229334B2 JP S6229334 B2 JPS6229334 B2 JP S6229334B2 JP 56195002 A JP56195002 A JP 56195002A JP 19500281 A JP19500281 A JP 19500281A JP S6229334 B2 JPS6229334 B2 JP S6229334B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- rotating shaft
- arm
- semiconductor substrates
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- De-Stacking Of Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19500281A JPS5896749A (ja) | 1981-12-03 | 1981-12-03 | 半導体基板の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19500281A JPS5896749A (ja) | 1981-12-03 | 1981-12-03 | 半導体基板の製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5896749A JPS5896749A (ja) | 1983-06-08 |
| JPS6229334B2 true JPS6229334B2 (enrdf_load_html_response) | 1987-06-25 |
Family
ID=16333893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19500281A Granted JPS5896749A (ja) | 1981-12-03 | 1981-12-03 | 半導体基板の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5896749A (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453941A (en) * | 1987-08-25 | 1989-03-01 | Nec Corp | Housing device for sheet |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW296361B (enrdf_load_html_response) * | 1995-06-26 | 1997-01-21 | Kakizaki Seisakusho Kk | |
| CN102969262B (zh) * | 2012-12-07 | 2017-03-01 | 上海集成电路研发中心有限公司 | 硅片倒片装置 |
-
1981
- 1981-12-03 JP JP19500281A patent/JPS5896749A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453941A (en) * | 1987-08-25 | 1989-03-01 | Nec Corp | Housing device for sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5896749A (ja) | 1983-06-08 |
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