JPS62293109A - Inspecting instrument for shape of electronic parts - Google Patents

Inspecting instrument for shape of electronic parts

Info

Publication number
JPS62293109A
JPS62293109A JP13646786A JP13646786A JPS62293109A JP S62293109 A JPS62293109 A JP S62293109A JP 13646786 A JP13646786 A JP 13646786A JP 13646786 A JP13646786 A JP 13646786A JP S62293109 A JPS62293109 A JP S62293109A
Authority
JP
Japan
Prior art keywords
edge
information
parts
circuit
cracking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13646786A
Other languages
Japanese (ja)
Inventor
Hiroyuki Tsukahara
博之 塚原
Noriyuki Hiraoka
平岡 規之
Masahito Nakajima
雅人 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13646786A priority Critical patent/JPS62293109A/en
Publication of JPS62293109A publication Critical patent/JPS62293109A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To automatically inspect even a defect which causes the area variation of an electronic parts like cracking by tracking information regarding the edge of the parts among pieces of image information on the plane shape of the parts and comparing it with edge limit information. CONSTITUTION:The image of the plane shape of the electronic parts 1 to be inspected is picked up 2, A/D-converted, and stored in a memory 3. An edge tracking circuit 4 tracks an edge information line 11 read out of the memory 3 by using a detection operator. At this time, even at the position of the cracking 12 tracking is carried up to the inside along the edge of cracking. A deficit part 13 is the same. Further, edge information 10 on the conforming article limit value of the parts 1 is set in a limiting edge information setting means 5 previously. An edge position inspecting and deciding circuit 6 compares the output of the circuit 4 with the output of a setting means 5 successively. In this case, the information line 11 extends beyond a limit line 10 at the cracking 12 and deficit part 13, so it is decided that the parts 1 is defective. The decision result can be known through a warning circuit and a conveying device 8 is used to perform the automatic inspection while parts 1 are changed one after another.

Description

【発明の詳細な説明】 3、発明の詳細な説明 [概要コ 電子部品についてエツジ情報の中にひび割れがあること
、ひび割れの大きさが標準値を超えていると判断したと
き不良品と判定するような電子部品の形状を自動的に且
つ的確に検査する装置である。
[Detailed description of the invention] 3. Detailed description of the invention [Summary] When it is determined that there is a crack in the edge information about an electronic component and that the size of the crack exceeds a standard value, it is determined that the product is defective. This is a device that automatically and accurately inspects the shape of such electronic components.

[産業上の利用分野] 本発明は半導体集積回路チップで代表される電子部品に
ついて、製造工程の比較的早い時期にひび割れ、欠損の
有無を自動的に検査できる装置に関する。
[Industrial Field of Application] The present invention relates to an apparatus that can automatically inspect electronic components such as semiconductor integrated circuit chips for cracks and defects at a relatively early stage of the manufacturing process.

電子部品のうち直方体状のチップ部品について、平面的
に見てひび割れ、欠けが発生していることを検査するた
め、検査員が目視作業による以外、機械により的確に自
動検査することが要望されて来た。
In order to inspect rectangular parallelepiped chip parts among electronic parts for cracks and chips when viewed from a plane, there is a demand for accurate automatic inspection by machines in addition to visual inspection by inspectors. It's here.

[従来の技術] 直方体状のチップ部品について検査員が目視作業により
検査することは従来の作業工程で欠かせなかった。第4
図はチップ部品の検査において、照明の様子を示すもの
で、チップ部品1に対し水平方向の四方から光線を照射
する以外に、斜め下方からまたは斜め上方から全周囲に
わたって照明を与え、上方から目視検査を行う。このよ
うな照明光により欠けた所がより明瞭になる。またひび
割れを見出すことも容易になっている。検査員の目視作
業以外に機械的に行うことは例えばパターンマツチング
により行うことができる。この場合基準パターンについ
て少なくとも縁取りをする線で囲んだ範囲を定めるよう
に、予めメモリに格納して置く。次に被検査部品を調べ
、面積データとして前記メモリから読出したデータと比
較する。所定値以内の誤差を有して一致する場合を合格
と判定する。
[Prior Art] It has been indispensable in the conventional work process for inspectors to visually inspect rectangular parallelepiped chip components. Fourth
The figure shows the state of illumination in the inspection of chip components.In addition to irradiating the chip component 1 with light beams from all four directions in the horizontal direction, illumination is applied to the entire circumference from diagonally below or diagonally above, and visual inspection is performed from above. Perform inspection. Such illumination light makes the chipped area more obvious. It is also easier to spot cracks. In addition to visual inspection by the inspector, mechanical operations can be performed, for example, by pattern matching. In this case, the reference pattern is stored in the memory in advance so as to define at least the range surrounded by the border line. Next, the part to be inspected is examined and compared with the data read from the memory as area data. If they match with an error within a predetermined value, it is determined to be a pass.

[発明が解決しようとする問題点] 検査員が目視検査を行うことは、熟練を要し、また長時
間にわたり作業を続けると疲労のため見逃しを起こし易
い。更に個人差が生じることは避けられない。一方、機
械検査によることは検査基準を一定にできるが、部品表
面から内部に向かってひび割れがあるとき、それを良品
とすることがあった。
[Problems to be Solved by the Invention] Visual inspection by inspectors requires skill, and if the inspector continues to work for a long time, he or she is likely to miss something due to fatigue. Furthermore, it is inevitable that individual differences will occur. On the other hand, mechanical inspection allows the inspection standards to be constant, but if there are cracks from the surface of the part toward the inside, it may be judged as non-defective.

本発明の目的は前述の欠点を改善し、ひび割れのように
部品の面積的な変化を起こさない欠陥も自動的に検査で
きる装置を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned drawbacks and to provide an apparatus that can automatically inspect defects such as cracks that do not cause changes in the area of parts.

[問題点を解決するための手段] 第1図は本発明の基本構成を示すブロック図である。第
1図において、1は被検査電子部品で、横断面を見てい
る。2は撮像装置で例えば工業用TV、3は画像メモリ
で、撮像装置2で得られた被検査電子部品の平面形状に
対する画像情報を格納するもの、4はエツジ追跡回路で
、画像メモリ2から読出した情報のうち電子部品のエツ
ジに関する情報を順次追跡してエツジ枠を得るもの、5
はエツジの限界情報を設定する手段、6はエツジ位置の
検出・判定回路でエツジ追跡回路4の出力と、エツジ限
界情報設定手段5の出力とを比較し、被検査部品のエツ
ジ枠がエツジ限界を超えて出入することの有無を判定す
る。
[Means for Solving the Problems] FIG. 1 is a block diagram showing the basic configuration of the present invention. In FIG. 1, reference numeral 1 indicates an electronic component to be inspected, which is viewed in cross section. 2 is an imaging device, for example, an industrial TV; 3 is an image memory that stores image information regarding the planar shape of the electronic component to be inspected obtained by the imaging device 2; 4 is an edge tracking circuit that reads out from the image memory 2; Among the information collected, information on the edges of electronic components is sequentially tracked to obtain an edge frame, 5
6 is an edge position detection/judgment circuit that compares the output of the edge tracking circuit 4 with the output of the edge limit information setting means 5, and determines whether the edge frame of the part to be inspected is at the edge limit. Determine whether or not the person enters or exits in excess of the specified limit.

なお7はエツジ書込回路で画像メモリ3に対し標準エツ
ジの情報を書込み、エツジ追跡回路4の動作をチェック
することなどに準備する。8は電子部品の移送装置を示
す。
An edge writing circuit 7 writes standard edge information to the image memory 3 and prepares for checking the operation of the edge tracking circuit 4. Reference numeral 8 indicates an electronic component transfer device.

[作用コ 第2図は被検査電子部品の平面図を示し、第2図により
第1図装置の動作を説明する。第2図において、10は
エツジの限界線を、11は画像メモリから読出したエツ
ジ情報の線を示す。12はひび割れの箇所、13は欠損
部を示している。第1図の撮像装置2により、被検査電
子部品1の平面形状を撮像し、例えばA/D変換の後画
像メモリ3に格納する。次いで画像メモリ3から読出し
たエツジ情報の線11について右下隅から左廻りに判定
するような場合、第1図のエツジ追跡回路4は公知のエ
ツジ検出オペレータを使用してエツジを追跡して行く。
[Operation] FIG. 2 shows a plan view of the electronic component to be inspected, and the operation of the apparatus shown in FIG. 1 will be explained with reference to FIG. In FIG. 2, reference numeral 10 indicates an edge limit line, and reference numeral 11 indicates a line of edge information read from the image memory. 12 indicates a cracked portion, and 13 indicates a defective portion. The imaging device 2 shown in FIG. 1 captures an image of the planar shape of the electronic component 1 to be inspected, and stores it in the image memory 3 after A/D conversion, for example. Next, when the edge information line 11 read out from the image memory 3 is determined in a counterclockwise direction from the lower right corner, the edge tracking circuit 4 of FIG. 1 tracks the edge using a known edge detection operator.

ひび割れの箇所工2において、エツジは内部まで入り込
んでいるから、それがエツジであるとして追跡して行く
。欠損部13においても同様である。また予め電子部品
lの良品限界値を示すエツジの情報10を手段5におい
て設定して置く。エツジ位置検査・判定回路6ではエツ
ジ追跡回路4の出力と、手段5の出力とを順次比較する
。ひび割れ箇所12・欠損部13においてエツジ情報1
1はエツジ限界情報10を超えて出入しているから、こ
こにおいて電子部品1は不良品であると判定できる。判
定結果を警報回路により知らせることもでき、さらに移
送装置8を使用して被検査電子部品1を次々に交換しな
がら、自動的な検査ができる。
In crack repair work 2, the edge has penetrated into the interior, so it is traced as an edge. The same applies to the defective portion 13. Further, edge information 10 indicating the non-defective limit value of the electronic component 1 is set in advance in the means 5. The edge position inspection/judgment circuit 6 sequentially compares the output of the edge tracking circuit 4 and the output of the means 5. Edge information 1 at cracked part 12 and missing part 13
1 is in and out beyond the edge limit information 10, so it can be determined that the electronic component 1 is a defective product. The judgment result can be notified by an alarm circuit, and furthermore, the electronic parts 1 to be tested can be automatically tested while being replaced one after another using the transfer device 8.

【実施例] 第3図は本発明の実施例としてエツジ追跡回路において
使用するオペレータを示す。第1図における画素メモリ
3には電子部品について、縦横のアドレスを割当て、各
アドレスにおける像データを見て信号変化点があればエ
ツジであると判断し、それらデータを多量に格納してい
る。
Embodiment FIG. 3 shows an operator used in an edge tracking circuit as an embodiment of the present invention. In the pixel memory 3 in FIG. 1, vertical and horizontal addresses are assigned to electronic components, image data at each address is checked, and if there is a signal change point, it is determined that it is an edge, and a large amount of such data is stored.

今、第3図に示すオペレータのPnがエツジ追跡回路の
動作アドレスのデータを示すとすれば、P は1ステツ
プ前に処理の終わったアドレスとなる。P’ nにおけ
るデータに信号変化のあることを検出して「エツジ」で
あると判定したとき、そのアドレスを図示しない中央処
理装置に通知する。
Now, if the operator Pn shown in FIG. 3 represents the data of the operating address of the edge tracking circuit, then P is the address that was processed one step ago. When detecting that there is a signal change in the data at P'n and determining that it is an "edge", the address is notified to a central processing unit (not shown).

そして次の追跡処理を第3図の■から開始する。Then, the next tracking process starts from ◯ in FIG.

■におけるデータにより■の部分がエツジであると判定
したとき、エツジである旨を通知し、その場所にPnを
移して前述と同様に処理する。■がエツジでないとき■
へ移り■がエツジであるかどうか判定する。このように
して最初にエツジであることが見つけられたアドレスへ
順次に移って行くことを繰り返すから、電子部品のエツ
ジの枠線を追跡できる。第3図に示すオペレータを使用
すると、第2図について右廻りにエツジの枠線を追跡し
て行くことができる。
When it is determined that the part (2) is an edge based on the data in (2), it is notified that it is an edge, and Pn is moved to that location and processed in the same way as described above. When ■ is not an edge■
Move to and determine whether ■ is an edge. In this way, the edge frame of the electronic component can be traced by repeating the process of sequentially moving to the first address found to be an edge. Using the operator shown in FIG. 3, the edge border can be traced clockwise with respect to FIG.

C発明の効果コ このようにして本発明によると、作業員の目視検査など
では発見できなかったひび割れについても、エツジ追跡
回路により追跡し、エツジ限界情報と比較して的確に発
見することができる。また画像メモリと、被検査部品移
送装置とを使用して、検査を自動化することも容易にで
きる。
C. Effects of the Invention In this way, according to the present invention, even cracks that could not be discovered through visual inspection by a worker can be tracked by the edge tracking circuit and accurately discovered by comparing them with edge limit information. . Furthermore, inspection can be easily automated by using an image memory and a device for transporting parts to be inspected.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の基本構成を示す図、 第2図・第3図は第1図の動作説明用の図、第4図は電
子部品の形状検査のときに行う照明についての説明図で
ある。 1−・−電子部品     2−撮像装置3・・−画像
メモリ    4−エツジ追跡回路5−エツジ限界情報
設定手段 6・−・エツジ位置検査・判定回路 10−エツジ限界線 11・−エツジ情報線 12−ひび割れ箇所 特許出願人    富士通株式会社 代理人    弁理士  鈴木栄祐 第1図 第2図 エツジ元」亦オ公レータ 第3図
Fig. 1 is a diagram showing the basic configuration of the present invention, Figs. 2 and 3 are diagrams for explaining the operation of Fig. 1, and Fig. 4 is an explanatory diagram of illumination used when inspecting the shape of electronic components. be. 1--Electronic components 2-Imaging device 3--Image memory 4-Edge tracking circuit 5-Edge limit information setting means 6--Edge position inspection/judgment circuit 10-Edge limit line 11--Edge information line 12 - Crack area Patent applicant Fujitsu Ltd. agent Patent attorney Eisuke Suzuki Figure 1 Figure 2 Edge source and official figure 3

Claims (1)

【特許請求の範囲】 電子部品(1)の平面形状を撮像する装置(2)と、得
られた画像情報を格納する画像メモリ(3)と、該画像
メモリ(3)から読出した電子部品のエッジ情報を順次
追跡する回路(4)と、 前記電子部品(1)のエッジ限界情報を設定する手段(
5)と、 エッジ追跡情報とエッジ限界情報とによりエッジ位置を
検査・判定する回路(6)と、 で構成することを特徴とする電子部品の形状検査装置。
[Claims] A device (2) for capturing an image of the planar shape of an electronic component (1), an image memory (3) for storing the obtained image information, and an image of the electronic component read from the image memory (3). A circuit (4) for sequentially tracking edge information; and means (4) for setting edge limit information of the electronic component (1).
5); and a circuit (6) for inspecting and determining edge positions based on edge tracking information and edge limit information.
JP13646786A 1986-06-12 1986-06-12 Inspecting instrument for shape of electronic parts Pending JPS62293109A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13646786A JPS62293109A (en) 1986-06-12 1986-06-12 Inspecting instrument for shape of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13646786A JPS62293109A (en) 1986-06-12 1986-06-12 Inspecting instrument for shape of electronic parts

Publications (1)

Publication Number Publication Date
JPS62293109A true JPS62293109A (en) 1987-12-19

Family

ID=15175794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13646786A Pending JPS62293109A (en) 1986-06-12 1986-06-12 Inspecting instrument for shape of electronic parts

Country Status (1)

Country Link
JP (1) JPS62293109A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0273110A (en) * 1988-09-09 1990-03-13 Hitachi Ltd Device and method for checking chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0273110A (en) * 1988-09-09 1990-03-13 Hitachi Ltd Device and method for checking chip

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