JPS62287625A - スピン式エッチング装置 - Google Patents

スピン式エッチング装置

Info

Publication number
JPS62287625A
JPS62287625A JP13003486A JP13003486A JPS62287625A JP S62287625 A JPS62287625 A JP S62287625A JP 13003486 A JP13003486 A JP 13003486A JP 13003486 A JP13003486 A JP 13003486A JP S62287625 A JPS62287625 A JP S62287625A
Authority
JP
Japan
Prior art keywords
etching
sample
liquid
work holder
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13003486A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439225B2 (enrdf_load_stackoverflow
Inventor
Koichi Saisu
齋須　好一
Masakatsu Takasu
鷹栖　征勝
Toyoichi Nemoto
根本　豊一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13003486A priority Critical patent/JPS62287625A/ja
Publication of JPS62287625A publication Critical patent/JPS62287625A/ja
Publication of JPH0439225B2 publication Critical patent/JPH0439225B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
JP13003486A 1986-06-06 1986-06-06 スピン式エッチング装置 Granted JPS62287625A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13003486A JPS62287625A (ja) 1986-06-06 1986-06-06 スピン式エッチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13003486A JPS62287625A (ja) 1986-06-06 1986-06-06 スピン式エッチング装置

Publications (2)

Publication Number Publication Date
JPS62287625A true JPS62287625A (ja) 1987-12-14
JPH0439225B2 JPH0439225B2 (enrdf_load_stackoverflow) 1992-06-26

Family

ID=15024506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13003486A Granted JPS62287625A (ja) 1986-06-06 1986-06-06 スピン式エッチング装置

Country Status (1)

Country Link
JP (1) JPS62287625A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0251229A (ja) * 1988-08-12 1990-02-21 Dainippon Screen Mfg Co Ltd 回転式表面処理方法および回転式表面処理における処理終点検出方法、ならびに回転式表面処理装置
US5667592A (en) * 1996-04-16 1997-09-16 Gasonics International Process chamber sleeve with ring seals for isolating individual process modules in a common cluster
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
DE19854743A1 (de) * 1998-11-27 2000-06-08 Sez Semiconduct Equip Zubehoer Vorrichtung zum Naßätzen einer Kante einer Halbleiterscheibe
WO2000045428A1 (fr) * 1999-01-28 2000-08-03 Stmicroelectronics S.A. Dressage du bord d'une plaquette semiconductrice et machine de dressage correspondante
JP2001135612A (ja) * 1999-07-09 2001-05-18 Applied Materials Inc 基板をエッチングする装置及び方法
EP4109495A1 (de) * 2021-06-23 2022-12-28 Infineon Technologies Bipolar GmbH & Co. KG Verfahren und vorrichtung zur herstellung einer randstruktur eines halbleiterbauelements

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0251229A (ja) * 1988-08-12 1990-02-21 Dainippon Screen Mfg Co Ltd 回転式表面処理方法および回転式表面処理における処理終点検出方法、ならびに回転式表面処理装置
US5667592A (en) * 1996-04-16 1997-09-16 Gasonics International Process chamber sleeve with ring seals for isolating individual process modules in a common cluster
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
DE19854743A1 (de) * 1998-11-27 2000-06-08 Sez Semiconduct Equip Zubehoer Vorrichtung zum Naßätzen einer Kante einer Halbleiterscheibe
WO2000045428A1 (fr) * 1999-01-28 2000-08-03 Stmicroelectronics S.A. Dressage du bord d'une plaquette semiconductrice et machine de dressage correspondante
JP2001135612A (ja) * 1999-07-09 2001-05-18 Applied Materials Inc 基板をエッチングする装置及び方法
EP1067591A3 (en) * 1999-07-09 2004-03-24 Applied Materials, Inc. Edge bead removal/spin rinse dry module
EP4109495A1 (de) * 2021-06-23 2022-12-28 Infineon Technologies Bipolar GmbH & Co. KG Verfahren und vorrichtung zur herstellung einer randstruktur eines halbleiterbauelements
US12342581B2 (en) 2021-06-23 2025-06-24 Infineon Technologies Bipolar Gmbh & Co. Kg Method and device for producing an edge structure of a semiconductor component

Also Published As

Publication number Publication date
JPH0439225B2 (enrdf_load_stackoverflow) 1992-06-26

Similar Documents

Publication Publication Date Title
US4968375A (en) Etching apparatus
JPS63185029A (ja) ウエハ処理装置
JPH0568092B2 (enrdf_load_stackoverflow)
JPS62287625A (ja) スピン式エッチング装置
US20060046413A1 (en) Substrate processing apparatus and substrate processing method
JPH11297652A (ja) 基板処理装置
JP3111300B2 (ja) 半導体素子のシール式スピンエッチング装置
TWI395282B (zh) 基板處理裝置及基板處理方法
JPH0781197B2 (ja) 半導体基板鍍金装置
JP2000311846A (ja) レジスト現像方法およびレジスト現像装置
JP3289469B2 (ja) 基板の洗浄装置と洗浄方法
JPH03274722A (ja) 半導体装置の製造方法及び製造装置
JP2809754B2 (ja) 現像装置
JP3627651B2 (ja) 半導体ウエハの表面処理方法及びその装置
JPH0417334A (ja) 基板のウェット処理装置
JPH0529305B2 (enrdf_load_stackoverflow)
JP2005026553A (ja) スピンエッチング方法
US20070051389A1 (en) Method and apparatus for substrate rinsing
JP2004267870A (ja) 処理液供給ノズル及び処理液供給装置、並びにノズルの洗浄方法
JPS62287624A (ja) 半導体素子のエッチング装置
KR970009865B1 (ko) 반도체 소자의 입자제거 방법
JP2004237257A (ja) 基板処理装置および基板処理方法
JPH04163916A (ja) 半導体基板エッチング装置
JPS60124821A (ja) 半導体基体に被着されたポジレジスト現像方法
JPS6169126A (ja) 板状体の処理方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees