JPS62285459A - Wiring method for chip-shaped electronic device - Google Patents

Abstract

PURPOSE:To conduct fine wirings without disconnection by filling a section between chip-shaped electronic devices with a resist, flattening the upper surface of the resist and forming a wiring pattern. CONSTITUTION:Chip-shaped electronic devices 2 are arranged adjacently on a substrate 1 and joined. A positive type resist 4 is applied on the surfaces of the devices 2 and in the clearances 3 of the devices. Only the surface layer section of the resist is exposed L and developed, the resists are left in the clearances 3, and sections among the devices 2 are flattened. When a wiring material 5 is deposited on the upper sections of the devices 2 and the clearances 3, the wiring material 5 is supported by the resists 4, and is not disconnected. The wiring material 5 is patterned, thus shaping fine wirings among each device 2. According to the constitution, mounting with high density is enabled.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention <Industrial Application Field> The present invention relates to wiring between a plurality of IC chips bonded to a substrate or chips such as pyroelectric elements, piezoelectric elements, and photodiodes. The present invention relates to a wiring method for a chip-shaped electronic element that can be used for wiring between a state-of-the-art device and a peripheral circuit.

<Conventional technology> For example, when interconnecting multiple IC chips, the IC chips obtained by dicing a wafer have minute irregularities on the cut surface caused by the dicing, so it is difficult to bond them together. Occasionally, gaps occur between IC chips due to unevenness. Therefore, when wiring material is deposited on the surface of each of these IC chips, the wiring material will be disconnected due to the gap between each IC chip. It is not possible to connect these IC chips to each other by wiring directly between them.

Therefore, IC chips are interconnected using a hybrid. That is, IC chips are bonded onto a substrate with wiring, and the IC chips are interconnected via the wiring on the substrate.

<Problems to be Solved by the Invention> As described above, since it is not possible to interconnect IC chips by directly wiring them, high-density packaging of chip-shaped electronic elements cannot be performed. Moreover, as the wiring length between each chip increases, stray capacitance increases.
The disadvantage is that it lacks electrical reliability.

<Object of the Invention> The present invention has been made in view of the above-mentioned conventional problems, and it provides a chip-shaped electronic device that can be electrically connected to each other by directly wiring between the chip-shaped electronic devices. The purpose is to provide a wiring method.

<Means for Solving the Problems> According to the wiring method for chip-shaped electronic devices of the present invention, a photosensitive material is applied to the gaps between a plurality of chip-shaped electronic devices arranged close to each other and the surface of each electronic device. Apply a resist of
After exposing this resist to light, development is performed to remove the resist other than the resist between the electronic elements, and then a wiring material is attached to the surface of each electronic element and the remaining resist, and the wiring material is The method is characterized in that it includes a step of patterning and wiring between the electronic elements.

By applying wiring between each chip-shaped electronic element through the above process, the wiring material is supported without disconnection by the resist filled in the gap between each electronic element, and each electronic element can be directly wired. Ru.

<Example> Embodiments of the present invention will be described in detail below with reference to the drawings.

FIGS. 1 to 4 are explanatory diagrams sequentially showing the steps of an embodiment of the present invention. As shown in FIG. 1, chip-shaped electronic devices 2 made of, for example, IC chips are arranged as close as possible to each other and die-bonded onto a substrate l. At this time, each electronic element 2 by dicing is placed between each electronic element 2.
A gap 3 exists due to the unevenness of the cut surface.

Next, as shown in FIG. 2, using a dip method or a spin coating method, a positive resist 4 whose exposed portions are peeled off is applied to the surface of each electronic element 2 and the gap 3, that is, the entire surface of each electronic element 2. Apply. After that, these are exposed from above. This exposure amount is set so that only the surface layer portion of the resist 4 is exposed.

Therefore, when development is performed, as shown in FIG. 3, the exposed portions of the positive resist 4 are peeled off and removed, leaving only the resist 4 filled in the gaps 3 of each electronic element 2. That is, the resist 4 remaining in the gap 3 between each electronic element 2
The gap 3 is filled and the space between each electronic element 2 is flattened. Here, if the environmental resistance of the resist 4 is a problem, a passivation film may be formed on the upper surface of the resist 4.

Then, as shown in FIG. 4, a wiring material is deposited on the upper surface. The wiring material 5 attached to the upper surface is supported by the flattened resist 4 between each electronic element 2, and is not disconnected. By patterning this wiring material 5 using exposure technology, WX! III wiring is completed, and each electronic element 2 can be electrically connected to each other.

5 to 6 are explanatory diagrams showing other embodiments of the present invention in the order of steps, and in these figures, the same reference numerals are given to the same or equivalent parts as in FIGS. 1 to 4. It is attached. In the embodiments shown in FIGS. 1 to 4, a positive resist 4 was used in which the exposed portion was peeled off by development.
This embodiment differs from the previous embodiment in that a negative resist 6 whose exposed portions remain after development is used.

As shown in FIG. 5, a plurality of chip-shaped electronic devices 2 are bonded as close as possible to a substrate 7 made of a light-transmitting material, and as shown in FIG. After applying the negative resist 6, exposure is performed from the substrate 7 side. Therefore,
Only the resist 6 between the electronic elements 2 is exposed by the light transmitted through the substrate 7, and the resist 6 attached to the surface of each electronic element 2 is not exposed because the light does not pass through the electronic element 2. Therefore, when developing next time,
Only the unexposed portions of the resist 6 adhering to the surface of each electronic element 2 are peeled off and removed as shown in FIG. 7, resulting in the same state as in FIG. 3. At this time, if the environmental resistance of the resist 6 is a problem as in the previous embodiment, a puffivation film may be formed on the upper surface of the resist 6.

Thereafter, as shown in FIG. 8, a wiring material 5 is deposited on the entire surface, and this wiring material 5 is patterned using an exposure technique, so that the electronic elements 2 are interconnected.

It should be noted that the present invention is not limited only to the embodiments described above, and it goes without saying that various embodiments can be considered as long as the scope of the claims is not exceeded. It is not limited to the positive type and negative type used in the example, but any photosensitive material can achieve the same effects as in the previous example.

In addition, although the above embodiment describes the case of wiring between IC chips, wiring between chip-shaped electronic elements such as piezoelectric elements, pyroelectric elements, and photodiodes and their peripheral circuits, etc. Also available.

<Effects of the Invention> As detailed above, according to the wiring method for chip-shaped electronic devices of the present invention, after filling the gaps between each chip-shaped electronic device with resist and flattening the top surface, Since the process of patterning the wiring material is used, it is possible to perform fine wiring that directly connects each chip-shaped electronic element, and high-density packaging is possible.

In addition, compared to the case of hybridization and wiring between IC chips, the wiring length between each chip-shaped electronic element is significantly shorter, and the stray capacitance associated with the wiring is significantly reduced, and problems caused by this stray capacitance can be solved. It can be resolved.

[Brief explanation of the drawing]

1 to 4 are explanatory diagrams sequentially showing steps of an example of implementing the wiring method for a chip-shaped electronic device according to the present invention, and FIGS. 5 to 8 are explanatory diagrams showing the steps of the other side according to the implementation of the present invention. FIG.

Claims (1)

[Claims] (1) A photosensitive resist is applied to the gaps between a plurality of chip-shaped electronic devices arranged close to each other and the surface of each electronic device, and after the resist is exposed to light, development is performed to create a gap between the electronic devices. removing the other resists except for the resist, and then depositing a wiring material on the surface of each of the electronic elements and the remaining resist, and patterning this wiring material to perform wiring between the electronic elements. Features a wiring method for chip-shaped electronic devices.