JPS62282249A - Pattern detector - Google Patents

Pattern detector

Info

Publication number
JPS62282249A
JPS62282249A JP12632386A JP12632386A JPS62282249A JP S62282249 A JPS62282249 A JP S62282249A JP 12632386 A JP12632386 A JP 12632386A JP 12632386 A JP12632386 A JP 12632386A JP S62282249 A JPS62282249 A JP S62282249A
Authority
JP
Japan
Prior art keywords
pattern
circuit
black line
detection device
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12632386A
Other languages
Japanese (ja)
Inventor
Satoshi Iwata
敏 岩田
Moritoshi Ando
護俊 安藤
Koji Oka
浩司 岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12632386A priority Critical patent/JPS62282249A/en
Publication of JPS62282249A publication Critical patent/JPS62282249A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To take out only a true pattern while removing the erroneously detected pattern generated in an invisible region, by leaving the common part of image binary information obtained by a detection from two directions different from each other while removing the other parts thereof. CONSTITUTION:In order to obtain binary image signals in X- and Y-axis directions, the X-direction signal being the output of a line sensor is applied to a CCD signal processing circuit 16x to perform black line detection processing and the image data binarized by a binarization circuit 17x is stored in a buffer memory 18. The stored binarized image signal data is inputted to one of the input terminals of an AND gate circuit 19. Further, a substrate mount stand is rotated by 90 deg. and the Y-direction signal obtained by Y-direction scanning is applied to a CCD signal processing circuit 16y to perform black line detection processing and the image data binarized by a binarization circuit 17y is applied to the other input terminal of the circuit 19. Because no AND condition is formed in the invisible region in the circuit 19, an erroneously detected pattern is removed and only a true pattern is taken out.

Description

【発明の詳細な説明】 3、発明の詳細な説明 〔概   要〕 本発明はパターン検知装置において、ブラックラインマ
スクを用いて被験物体、特にプリント基板に形成したパ
ターンを検知するために照明を施し、該パターン上のブ
ラックラインを反射検知する際に被検物体をY軸および
Y軸方向から検知してパターンの不可視部によってパタ
ーンが実際の寸法より太き(検知される問題を解決する
ものでY軸及びY軸の2軸方向で検知した検知出カバタ
ーンのアンドを取った出力により真のパターンを検知゛
するようにしたパターン検知装置を提供するものである
[Detailed Description of the Invention] 3. Detailed Description of the Invention [Summary] The present invention provides a pattern detection device in which illumination is applied to detect a pattern formed on a test object, particularly a printed circuit board, using a black line mask. When detecting the black line on the pattern by reflection, the object to be detected is detected from the Y-axis and the Y-axis direction, and the pattern is thicker than the actual size due to the invisible part of the pattern. The present invention provides a pattern detection device which detects a true pattern by an output obtained by ANDing detected output patterns detected in two axial directions: the Y-axis and the Y-axis.

〔産業上の利用分野〕[Industrial application field]

本発明は被検物体、例えばプリント基板のパターンを検
知するためのパターン検知装置に係り、特に第1の方向
と該第1の方向に対し直交する第2の方向の2方向から
パターンを検知し、夫々の検知出力のアンドをとってパ
ターンの誤検出を防止する様にしたパターン検知装置に
関する。
The present invention relates to a pattern detection device for detecting a pattern on an object to be inspected, such as a printed circuit board, and in particular detects a pattern from two directions: a first direction and a second direction perpendicular to the first direction. The present invention relates to a pattern detection device that prevents erroneous detection of a pattern by ANDing the respective detection outputs.

近時、プリント基板のパターンは多層化、高密度化が進
みこれらプリント基板パターンの複雑化、緻密化に対応
出来るパターン検査装置の開発が要望されている。
In recent years, printed circuit board patterns have become more multilayered and denser, and there is a demand for the development of pattern inspection equipment that can handle the increasingly complex and dense patterns of printed circuit boards.

〔従 来 の 技 術〕[Traditional techniques]

従来のパターン検知装置としては被検物体上のパターン
を[灸知するために第4図に示す如きブラックラインマ
スクを用いた照明方法によってパターン上に投影された
ブラックラインを検知する検知装置が知られている。
As a conventional pattern detection device, there is a detection device that detects a black line projected onto a pattern by an illumination method using a black line mask as shown in FIG. It is being

即ち、第4図において、1は被検物体のプリント基板を
示し、該プリント基板上には銅箔より構成されたパター
ン2が形成されている。3はパターン2上に配された照
明手段を構成する光源で、該光源からの照明光はブラッ
クラインマスク4及びマスク結像用レンズ5を通じてパ
ターン2上にブラックライン6を結像する。該ブラック
ラインマスク4にはストライプ状の黒色パターン4aが
形成され、照明手段からの光は、黒色パターン部分を透
過しないためにプリント基板lのパターン2上に結像さ
れたブラックライン6は黒(なり他の部分は明部7とな
る。このブランクライン6を反射結像用レンズ8を介し
てラインセンサ9等の検知手段で斜め方向から検知して
いる。
That is, in FIG. 4, reference numeral 1 indicates a printed circuit board of the object to be inspected, and a pattern 2 made of copper foil is formed on the printed circuit board. Reference numeral 3 denotes a light source constituting an illumination means disposed on the pattern 2, and the illumination light from the light source forms a black line 6 on the pattern 2 through a black line mask 4 and a mask imaging lens 5. A striped black pattern 4a is formed on the black line mask 4, and since the light from the illumination means does not pass through the black pattern portion, the black line 6 imaged on the pattern 2 of the printed circuit board l is black ( The other portion becomes a bright portion 7. This blank line 6 is detected from an oblique direction by a detection means such as a line sensor 9 via a reflective imaging lens 8.

この様なパターン検知装置によるとパターン部分が光ら
ないので検知し易い検知装置が得られる。
According to such a pattern detection device, since the pattern portion does not shine, it is possible to obtain a detection device that is easy to detect.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

叙上の従来構成によると、第5図tag、 fb)に示
す様に斜め方向からの検出又は照明によって生ずる弊害
があり、実際のプリント基板上のパターン長に比べて長
いパターンを検知する問題が発生する。
According to the conventional configuration described above, there are problems caused by detection or illumination from an oblique direction, as shown in FIG. Occur.

即ち第5図(alはプリント基板と、そのパターンを側
面から拡大してみたものであるが照明手段の光源3から
の照明光3aによってブラックラインマスクを介してパ
ターン上にブラックラインが投影されるがこの投影され
たパターン上のブラックライン部をラインセンサ9で検
知する場合にパターン2の幅に比べてZ軸方向のパター
ン高さが無視出来ない高さであるためにパターンの高さ
によって生ずる不可視部10の部分だけ実際のパターン
より大きくなる。令弟5図(a)に示す実際のパターン
2が円形のものであれば第5図(blの検知信号11で
示す様に本来の円形の形状であるパターン2に不可視部
10により一定の方向につば状に生じて不可視部による
誤検出部12を生ずることになる。
That is, in FIG. 5 (al is a printed circuit board and its pattern enlarged from the side), a black line is projected onto the pattern via a black line mask by illumination light 3a from the light source 3 of the illumination means. When detecting the black line portion on this projected pattern with the line sensor 9, this occurs due to the height of the pattern because the height of the pattern in the Z-axis direction is not negligible compared to the width of the pattern 2. Only the invisible part 10 is larger than the actual pattern.If the actual pattern 2 shown in Figure 5(a) is circular, it will be larger than the original circular pattern as shown by the detection signal 11 in Figure 5 (bl). In the pattern 2, which is a shape, the invisible portion 10 causes a brim shape in a certain direction, resulting in an erroneous detection portion 12 due to the invisible portion.

〔問題点を解決するための手段] 本発明は叙上の欠点に鑑みなされたものであり、その目
的とするところはブラックラインマスク照明方式を用い
ても不可視部による誤検出部を発生しないパターン検知
装置を得るにある。第1図(a)。
[Means for Solving the Problems] The present invention was made in view of the above-mentioned drawbacks, and its purpose is to create a pattern that does not cause false detection due to invisible parts even when using a black line mask illumination method. There is a detection device to obtain. Figure 1(a).

fb)、 fc)は本発明のパターン検知装置の原理を
説明するための検知信号パターンであり、先ず第1図(
a)に示される様にブラックラインマスクを介してプリ
ント基板上のパターンにブラックラインを投影して斜め
方向から検知手段によってパターンを検知する。プリン
ト基板のパターン2が円である場合の不可視部10によ
る誤検出部は例えばX軸方向につば状部10Xが形成さ
れる。次に同一の円パターンをX軸方向とは90°異な
るY軸方向に回転させて、上記と同様にブラックライン
マスクを介して照明を旙してY軸方向から検知すれば第
1図(blに示す様に不可視部IOによる誤検出部には
例えばY軸方向につば状部10Yが形成される。
fb) and fc) are detection signal patterns for explaining the principle of the pattern detection device of the present invention.
As shown in a), a black line is projected onto a pattern on a printed circuit board through a black line mask, and the pattern is detected from an oblique direction by a detection means. When the pattern 2 of the printed circuit board is a circle, the erroneous detection part due to the invisible part 10 is, for example, a flange-shaped part 10X formed in the X-axis direction. Next, if the same circular pattern is rotated in the Y-axis direction, which is 90 degrees different from the As shown in FIG. 2, for example, a flange-shaped portion 10Y is formed in the Y-axis direction at the erroneously detected portion due to the invisible portion IO.

これらの2値画像IとJ(第1図(a) 、 (bl 
)の信号をアンドゲート回路に通してInJの値をとっ
て合成画像を得れば第1図(C1に示すようにつば伏部
10X、IOYはアンド条件がなり立たないので元の円
パターン2だけが取り出せることになる。
These binary images I and J (Fig. 1(a), (bl
) is passed through an AND gate circuit and the value of InJ is taken to obtain a composite image. As shown in Figure 1 (C1), the AND condition does not hold for the brim section 10X and IOY, so the original circular pattern 2 is obtained. Only that can be taken out.

〔作   用〕[For production]

本発明では互いに異なる二方向から検出或いは照明を施
すことによって得られた画像二値情報の共通部分のみ残
して他を除去することで不可視領域によって生ずる誤検
出パターンが取り除かれる。
In the present invention, erroneous detection patterns caused by invisible areas are removed by leaving only common parts of image binary information obtained by performing detection or illumination from two different directions and removing the rest.

〔実  施  例〕〔Example〕

以下、本発明の一実施例を第2図(al、 (b)及び
第3図について詳記する。
Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 2(al), (b) and 3.

第2図(al、 (blは本発明のパターン形成された
プリント基板を90°異なる方向に回動させて照明、検
出を行う様にしたパターン及び回動手段の斜視図を示す
ものであり、第3図は本発明のパターン検知装置の信号
処理系の系統図である。
FIGS. 2A and 2B show perspective views of a pattern and a rotating means in which the pattern-formed printed circuit board of the present invention is rotated in 90 degrees different directions for illumination and detection, FIG. 3 is a system diagram of the signal processing system of the pattern detection device of the present invention.

第2図(a)、 (blにおいて、プリント基板1は基
板載置台13上に乗せられて矢印で示す様に矢印方向に
移動され、照明手段である光′R3からの照明光3aを
パターン面2に垂直に照射し、X軸方向に斜めに配され
た検知手段のラインセンサ9上にパターン2上の反射さ
れたブラックライン部分を検知する。このときの二値化
画像はX軸方向に実際より長くなる。基板載置台13の
下端にはターンテーブル(図示せず)があり、該ターン
テーブルの中心に固定された軸15aはターンテーブル
下端に設けられた固定された基板14の中心部分に穿っ
た通孔を貫通してパルスモータ等の駆動手段15のロー
タ軸に結合されている。第2図(alで示す状態ではプ
リント基板1のパターン2はY軸方向に細長い銅箔線路
が示されているが駆動手段15を付勢することでターン
テーブル上に乗せられた基板載置台13と共にプリント
基板1が第2図(blの様に90°回転し、プリント基
板1のY軸方向がプリント基1反の矢印で示す移動方向
となり、この時ラインセンサ9はY軸方向に斜めに配さ
れることになるので、垂直方向から照射したブラックラ
イン部分の二値化画像はY軸方向に実際より長いパター
ンとなる。
In FIGS. 2(a) and (bl), the printed circuit board 1 is placed on the board mounting table 13 and moved in the direction of the arrow as shown by the arrow, and the illumination light 3a from the light 'R3 which is the illumination means is applied to the pattern surface. 2 and detects the reflected black line portion on the pattern 2 on the line sensor 9 of the detection means arranged obliquely in the X-axis direction.At this time, the binarized image is irradiated in the X-axis direction. There is a turntable (not shown) at the lower end of the substrate mounting table 13, and the shaft 15a fixed at the center of the turntable is located at the center of the fixed substrate 14 provided at the lower end of the turntable. It is coupled to the rotor shaft of a drive means 15 such as a pulse motor by passing through a through hole bored in the 2. In the state shown in FIG. As shown, by energizing the driving means 15, the printed circuit board 1 is rotated by 90 degrees as shown in FIG. is the moving direction indicated by the arrow on the print board 1, and at this time the line sensor 9 is arranged diagonally in the Y-axis direction, so the binarized image of the black line portion illuminated from the vertical direction is in the Y-axis direction. The pattern will be longer than it actually is.

即ち、パターン2が円形であれば第1図(a)又は(b
iに示す様な二値化画像を得る。
That is, if the pattern 2 is circular, then the pattern shown in FIG. 1(a) or (b)
A binarized image as shown in i is obtained.

この様にX軸及びY軸方向の二値化画像信号を得るため
には第3図に示すようにラインセンサ9等の出力である
X方向信号をCCD信号処理回路16yに加えてブラッ
クライン検知処理を行った二値化回路17Xで二値化し
た画像データをバッファメモリ18内に収納する。次に
プリント基板1を載せた基板載置台を90°回転させて
Y方向走査を行ない得られるY方向信号をCCD信号処
理回路16yに加えてブラックライン検知処理を行い二
値化回路17yで二値化した画像データをアンドゲート
回路19の一方の入力端子に加える。
In order to obtain binary image signals in the X-axis and Y-axis directions in this way, as shown in FIG. The processed image data binarized by the binarization circuit 17X is stored in the buffer memory 18. Next, the board mounting table on which the printed circuit board 1 is placed is rotated by 90 degrees to perform Y-direction scanning, and the obtained Y-direction signal is applied to the CCD signal processing circuit 16y to perform black line detection processing, and then to the binary conversion circuit 17y. The converted image data is applied to one input terminal of the AND gate circuit 19.

一方上記バノファメモリに収納されていたX方向の走査
により得られた二値化画像信号データはアンドゲート回
路19の他方の入力端子に加えられる。この様なアンド
ゲート出力は第1図に示した不可視部による誤検出部1
0X、IOYは出力されずに真のパターン2のみが第1
図(C1の様に取り出すことが出来る。尚、上記実施例
ではパターンを90°回転させた場合を述べたが30’
〜33o°程度の範囲で適宜回転させる様にしてもよく
、要するにX、Y方向誤検出部が重ならなければよい。
On the other hand, the binarized image signal data obtained by scanning in the X direction and stored in the Banoffer memory is applied to the other input terminal of the AND gate circuit 19. This kind of AND gate output is generated by the erroneous detection unit 1 due to the invisible part shown in Figure 1.
0X, IOY are not output and only true pattern 2 is the first
It can be taken out as shown in Figure (C1). In the above example, the case where the pattern was rotated by 90 degrees was described, but 30'
The rotation may be made as appropriate within a range of about 33 degrees, and in short, it is sufficient as long as the X and Y direction erroneous detection parts do not overlap.

〔発明の効果〕〔Effect of the invention〕

本発明は叙上の如く構成し、且つ動作させたのでパター
ン銅箔によって生ずる不可視部の影響を取り除くことが
穫めて簡単に行なえて真のプリント基板のパターンを検
知出来るパターン検知装置を得ることが出来る特徴を有
する。
The present invention is configured and operated as described above, so that it is possible to easily remove the influence of invisible areas caused by patterned copper foil, and to obtain a pattern detection device that can detect the true pattern of a printed circuit board. It has the characteristic of being able to

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)〜(C1は本発明のパターン検知装置のル
J作原理を説明するための画像パターン模式図、第2図
(al、 (blは本発明のパターン検知装置の構成を
示す斜視図、 第3図は本発明のパターン検知装置の信号処理系を示す
系統図、 第4図は従来のパターン検知装置でのブラ、クライン照
明を示す模式的な斜視図、 第5図(a)は従来のプリント基板の側面とパターンに
よって生ずる不可視部を説明する模式的な側面図、 第5図(blは不可視部の影響によって生ずる検出信号
パターンの模式的平面図である。 1 ・ ・ ・プリント基1反、 2・ ・ ・パターン、 3・・・光源、 4・・・ブラックラインマスク、 6・・・ブランクライン、 7・・・明部、 9・・・ラインセンサ、 10・・・不可視部、 11・・・検知信号、 12・・・不可視部による誤検出部、 13・・・基板載置台、 14・・・基板、 15・・・駆動手段、 16x、t6y・・−ccD信号処理回路、17x、1
7y・・・二値化回路、 18・・・バッファメモリ、 19・・・アンドゲート回路。
Figures 1 (a) to (C1 are schematic diagrams of image patterns for explaining the principle of operation of the pattern detection device of the present invention, and Figures 2 (al and (bl) show the configuration of the pattern detection device of the present invention. 3 is a system diagram showing the signal processing system of the pattern detection device of the present invention, FIG. 4 is a schematic perspective view showing the Bra and Klein illumination in the conventional pattern detection device, and FIG. ) is a schematic side view illustrating the invisible part caused by the side surface and pattern of a conventional printed circuit board, and FIG. 5 (bl is a schematic plan view of a detection signal pattern caused by the influence of the invisible part. 1 print base, 2...pattern, 3...light source, 4...black line mask, 6...blank line, 7...bright area, 9...line sensor, 10... Invisible part, 11... Detection signal, 12... Erroneous detection part due to invisible part, 13... Substrate mounting table, 14... Substrate, 15... Driving means, 16x, t6y...-ccD signal Processing circuit, 17x, 1
7y... Binarization circuit, 18... Buffer memory, 19... AND gate circuit.

Claims (1)

【特許請求の範囲】 1)被検物体のパターン上にブラックラインマスクを介
して照明を施す照明手段(3)と、該被検物体のパター
ンに結像したブラックラインを検知する検知手段(9)
と、該照明手段でパターン上に結像させたブラックライ
ンを1つの方向から該検知手段で検知すると共に上記被
検物体を該1つの方向とは所定角度異なる方向から検知
して、該二つの検知信号を合成してなる合成手段とより
なることを特徴とするパターン検知装置。 2)前記二つの検知信号を得るために前記被検物体を載
置したテーブルを90°回転させてなることを特徴とす
る特許請求の範囲第1項記載のパターン検知装置。 3)前記二つの検知信号を得るために被検物体を90°
回転させることを特徴とする特許請求の範囲第1項記載
のパターン検知装置。 4)前記二つの検知信号を得るために前記被検物体を照
明するブラックラインマスクを90°回転させてなるこ
とを特徴とする特許請求の範囲第1項記載のパターン検
知装置。 5)前記二つの検知信号を得る合成手段はアンドゲート
回路であることを特徴とする特許請求の範囲第1項記載
のパターン検知装置。
[Scope of Claims] 1) Illumination means (3) that illuminates the pattern of the object to be inspected via a black line mask, and detection means (9) that detects the black line imaged on the pattern of the object to be inspected. )
The detection means detects the black line imaged on the pattern by the illumination means from one direction, and detects the object to be inspected from a direction different from the one direction by a predetermined angle. A pattern detection device comprising: a synthesis means for synthesizing detection signals. 2) The pattern detection device according to claim 1, wherein the table on which the object to be detected is placed is rotated by 90 degrees in order to obtain the two detection signals. 3) Rotate the object to be measured at 90° to obtain the two detection signals.
The pattern detection device according to claim 1, wherein the pattern detection device is rotated. 4) The pattern detection device according to claim 1, wherein a black line mask that illuminates the object to be detected is rotated by 90 degrees in order to obtain the two detection signals. 5) The pattern detection device according to claim 1, wherein the combining means for obtaining the two detection signals is an AND gate circuit.
JP12632386A 1986-05-31 1986-05-31 Pattern detector Pending JPS62282249A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12632386A JPS62282249A (en) 1986-05-31 1986-05-31 Pattern detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12632386A JPS62282249A (en) 1986-05-31 1986-05-31 Pattern detector

Publications (1)

Publication Number Publication Date
JPS62282249A true JPS62282249A (en) 1987-12-08

Family

ID=14932340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12632386A Pending JPS62282249A (en) 1986-05-31 1986-05-31 Pattern detector

Country Status (1)

Country Link
JP (1) JPS62282249A (en)

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