JPH05191100A - Component insertion check device - Google Patents

Abstract

PURPOSE:To provide a component insertion check device which is able to easily check the insertion state of a component assembled on a circuit board. CONSTITUTION:Light ray projected from a light 6 are made to reach a camera 11 passing through a component insertion hole provided to a circuit board 1. The obtained image is developed into two-dimensional arrangement data in an image memory 12 and analyzed by a CPU 13. By this setup, if a component is not rightly inserted into an insertion hole, the insertion hole is circular or elliptical, so that the insertion state of a component can be detected by processing the obtained image.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device insertion state inspection device in the manufacture of electronic circuit boards.

[0002]

2. Description of the Related Art Conventionally, an inspection of a component insertion state in an electronic circuit board is conducted by (1) contacting a lead portion of an inserted electronic component with a contact probe positioned at a component insertion hole position to obtain a resistance value or an electrostatic capacitance. It has been performed by determining the inserted components by measuring a constant such as (2) or visually observing the appearance of the board.

The inspection device of the above method (1) can be roughly classified into the following two methods. One method is a pin that performs inspection in sequence or in parallel while selecting a contact probe using a dedicated jig (FIG. 1A) in which the contact probe is arranged according to the component insertion position of the board to be inspected. It is a board system. In the other method, contact probes are installed on several sets of three-dimensional tables (Fig. 1).
(B)), the inspection is performed while sequentially moving the contact probe to each component insertion position. The inspection device of the above method (2) uses the image pickup camera, the image memory and the processing unit for the shape, size, and
This was done by detecting and recognizing colors, imprinted characters, etc.

[0004]

The above-mentioned conventional techniques have the following problems in each system.

The pinboard system is a substrate 1 to be inspected.
Since it is necessary to create a dedicated jig for each product type, there is a problem in that production of small lots and recreating a dedicated jig due to design changes increase the production cost and the manufacturing period.

The method using the three-dimensional table has a problem that it takes a lot of time when there are many inspection points because the moving operation is performed when the inspection points are switched.

In the appearance inspection method, since many electronic components have similar shapes and their arrangement is three-dimensional, the inspection determination is difficult and the processing becomes complicated, resulting in an increase in the inspection time. was there.

An object of the present invention is to provide an inspection method which can be performed at a low cost and can be performed at high speed even for a small lot product or a prototype whose design is likely to be changed.

[0009]

In order to achieve the above object, the present invention illuminates a substrate from one side, images the surface from the opposite side, and determines the image shape of a component insertion hole by passing light. The insertion state of the component is detected.

Further, in order to carry out the above-mentioned inspection, information on the position, shape and size of the insertion hole is required in advance. To obtain this, the board on which no component is inserted is illuminated from one side. The information can be obtained from the image shape of the component insertion hole by passing light by imaging the surface from the opposite surface side.

Further, the information necessary for the above-mentioned inspection can be obtained from the component insertion information of the automatic component insertion device.

[0012]

In FIG. 2, when the substrate 1 is illuminated by the illumination 6 shown in FIG. 2A, the light passing through the insertion hole is imaged from the opposite side to obtain an image as shown in FIG. In this image, the shape of the insertion hole collapses at the place 7 where the lead of the component is normally inserted, and the shape of the insertion hole does not collapse at the place 7 ′ where the lead of the component is not normally inserted. Since the insertion hole is usually in the shape of a circle or an ellipse, the determination can be easily made by using a recognition method of image processing. Therefore, from the position of each insertion hole, the same shape and the same size as the insertion hole are searched in advance in the range of 8 and 8 ', and if it is found, the insertion is defective and if it is not found, the insertion is performed. It can be determined to be good.

Further, by performing this search determination processing on the entire surface of the board in which no component is inserted, it is possible to detect the insertion hole position of any size.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. The illumination 6 projects onto the substrate 1 fixed by the positioning guide 10. An image of this is picked up by the camera 11, and the obtained video signal 11 'is developed into two-dimensional array data on the image memory 12. The data on the image memory 12 is processed by the CPU 13, and the processing result can be output to the monitor 15 and the floppy disk 14. Since the imaging symmetry is an insertion hole of about Ф1.0 mm, in order to maintain the detection accuracy, the camera 11 should capture a field of view of about 50 mm,
A resolution of 0.1 m / pixel can be obtained when expanded to a general image memory size of 512 × 480 pixels. The small field of view is I / O
This is solved by progressively scanning the camera 11 using the XY table 17 via the interface 16.

The inspection location, judgment criteria, etc. are obtained by using the uninserted board as described above or by editing the component insertion data from the NC tape reader 18 by using the CPU 13 and storing the data on the floppy disk 14. The model can be changed at high speed by saving and reading.

[0016]

According to the present invention, it is possible to perform a component insertion inspection of an electronic board without using a contact probe. Therefore, it is possible to perform an inexpensive and high-speed inspection for a small lot of boards and prototype boards. Has the effect of

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing two inspection methods performed using a contact probe.

FIG. 2 is an explanatory diagram showing what kind of image the component insertion state appears due to illumination.

FIG. 3 is a block diagram showing a configuration of an apparatus that realizes an exemplary embodiment of the present invention.

[Explanation of symbols]

1 ... Circuit board, 2 ... Electronic component, 3 ... Contact probe, 4 ... Pinboard jig, 5 ... Three-dimensional table (actuator), 6 ... Illumination device, 7, 7 '... Component insertion hole,
8,8 '... Reduced part insertion hole search, 9 ... Board backside (dark part), 10 ... Board positioning guide, 11 ... Camera, 11' ... Video signal, 12 ... Image memory, 13 ... CPU, 14 ... Floppy disk , 15 ... Monitor display, 16 ... I / O interface, 17 ... XY table (actuator), 18
... NC tape reader.

Claims (3)

[Claims] 1. Light emitted from one side of a printed circuit board having an image pickup camera, an illuminating means, an image memory and a processing unit therefor and after insertion of electronic components and before soldering. Is captured by the camera as it passes through the component insertion hole to the other side, and in the image on the obtained image memory, from the image shape within a certain range centered on the component insertion hole position specified in advance, A component insertion inspection device, which inspects whether an electronic component is inserted properly or not. 2. An image obtained by photographing with a camera a state in which light illuminated from one side of the circuit board before insertion of electronic components passes through the component insertion hole to the other side. It has a function to detect the position, shape, and size of the component insertion hole in the image on the memory, and to create the inspection position, range, and component insertion state determination condition based on the result. The component insertion inspection device according to claim 1. 3. The automatic electronic component inserter has a function of creating an inspection position, a range, and a component insertion state determination condition based on component insertion information such as an NC tape used by the automatic electronic component insertion machine. 1. The component insertion inspection device according to 1.