JPS62279963A - Enameled substrate for thermal head - Google Patents
Enameled substrate for thermal headInfo
- Publication number
- JPS62279963A JPS62279963A JP12527086A JP12527086A JPS62279963A JP S62279963 A JPS62279963 A JP S62279963A JP 12527086 A JP12527086 A JP 12527086A JP 12527086 A JP12527086 A JP 12527086A JP S62279963 A JPS62279963 A JP S62279963A
- Authority
- JP
- Japan
- Prior art keywords
- core material
- core member
- heat generating
- generating part
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 22
- 239000011162 core material Substances 0.000 claims description 47
- 210000003298 dental enamel Anatomy 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
［発明の目的］
（産業上の利用分野）
本発明は、感熱記録或は熱転写記録に使用されるサーマ
ルヘッドのホーロー基板に関する。Detailed Description of the Invention 3. Detailed Description of the Invention [Object of the Invention] (Field of Industrial Application) The present invention relates to a hollow substrate of a thermal head used for thermal recording or thermal transfer recording.
（従来の技術）
従来のサーマルヘッドとしては、第５図及び第６図に示
すようなものがある。(Prior Art) Conventional thermal heads include those shown in FIGS. 5 and 6.
第５図に於て、１はホーロー基板であり、金属板１ａと
、この金属板１ａを被覆したエナメル層１ｂとからなっ
ている。ホーロー基板１上には、金属板１ａに電極５で
接続された発熱部７と、該発熱部７に電極６及びワイヤ
ーボンディング１１で接続された駆動回路（ＩＣ＞３と
、該駆動回路３にワイヤーボンディング９で接続された
ＧＮＤ用の電極４とが装着されている。２は基板１を固
定するためのマウントであり、１２は発熱部７を保護す
るための耐摩耗膜である。In FIG. 5, reference numeral 1 denotes a hollow substrate, which consists of a metal plate 1a and an enamel layer 1b covering the metal plate 1a. On the hollow substrate 1, there is a heat generating part 7 connected to the metal plate 1a with an electrode 5, a drive circuit (IC>3) connected to the heat generating part 7 with an electrode 6 and wire bonding 11, and a drive circuit (IC>3) connected to the heat generating part 7 with an electrode 6 and wire bonding 11. A GND electrode 4 connected by wire bonding 9 is attached. 2 is a mount for fixing the substrate 1, and 12 is a wear-resistant film for protecting the heat generating part 7.
第６図に示すものは、マウント２上に設けられたアルミ
ナ基板１上にＩＣでなるドライブ用素子３を形成し、こ
れをシリコーン樹脂１３で覆うことにより、素子３が湿
気によって腐食することを防ぎ、又、前記素子３と外部
接続用コネクタ］５とを接続するフレキシブルケーブル
（ＦＰＣ）１６を、該マウント２及び基板１上に載せ、
マウント２に取付は螺子１７により固定するカバー兼用
のクランパ１８により該フレキシブルケーブル１６を基
板１及びマウント２に対して圧接している。尚、基板１
上には多数の発熱部７及び該発熱部７と素子３とを接続
する電極５やコモン電極が形成されている。In the device shown in FIG. 6, a drive element 3 made of an IC is formed on an alumina substrate 1 provided on a mount 2, and this is covered with a silicone resin 13 to prevent the element 3 from being corroded by moisture. A flexible cable (FPC) 16 for connecting the element 3 and the external connection connector] 5 is placed on the mount 2 and the substrate 1,
When attached to the mount 2, the flexible cable 16 is pressed against the substrate 1 and the mount 2 by a clamper 18 which also serves as a cover and is fixed with a screw 17. Furthermore, board 1
A large number of heat generating parts 7 and electrodes 5 and common electrodes connecting the heat generating parts 7 and the elements 3 are formed on the top.
（発明が解決しようとする問題点）
以上のような従来装置のうち、第５図に示すもののサー
マルヘッド用の基板１は、金属板１ａを電気回路の一部
として使用しているのであるが、一本の信号ラインでし
か用いることが出来ず、駆動回路３のＧＮＤライン用の
大電流回路のための処理として、電極４の実装（或は圧
膜配線、ＦＰＣ等）が必要になる。ところがこのような
大電流配線を行うと、電極４等の実装に伴い部品点数が
増大し、しかもアッセンブル作業が必要になり組立工程
が煩雑化するという問題がある。(Problems to be Solved by the Invention) Among the conventional devices described above, the thermal head substrate 1 shown in FIG. 5 uses a metal plate 1a as a part of the electric circuit. , it can be used with only one signal line, and mounting of the electrode 4 (or thin film wiring, FPC, etc.) is required as processing for the large current circuit for the GND line of the drive circuit 3. However, when such high current wiring is performed, there are problems in that the number of parts increases due to the mounting of the electrodes 4, etc., and furthermore, assembling work is required, making the assembly process complicated.
また、第６図のような従来装置によると、主要部品が基
板１．マウント２．カバー兼クランパ１８、フレキシブ
ルケーブル１６．コネクタ１５′・□を必要とするため
部品点数が多くなるという問題、更にはコモン処理や各
部品の組立工数が増大するという問題を有する。Further, according to the conventional device as shown in FIG. 6, the main components are the board 1. Mount 2. Cover/clamper 18, flexible cable 16. Since the connectors 15' and □ are required, there is a problem that the number of parts increases, and furthermore, there is a problem that the common processing and the number of steps for assembling each part increase.
本発明は上記問題点を解決し、大電流配線を不要にして
、部品数の削減、組立工程の簡素化を図ることを目的と
する。It is an object of the present invention to solve the above problems, eliminate the need for high-current wiring, reduce the number of parts, and simplify the assembly process.
［発明の構成］
（問題点を解決するための手段）
上記目的を達成するため本発明サーマルヘッド用ホーロ
ー基板は、発熱部に印字電圧を供給する第１のコア材と
、該第１のコア材と電気的に独立したＧＮＤライン用の
第２のコア材とを合せて一体に形成した構成とした。[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the hollow substrate for a thermal head of the present invention includes a first core material that supplies a printing voltage to a heat generating part, and a first core material that supplies a printing voltage to a heat generating part. The core material and the second core material for the electrically independent GND line are integrally formed.
（作 用） 本発明は上記の構成としたので、次のように作用する。(for production) Since the present invention has the above configuration, it operates as follows.
即ら、本発明サーマルヘッド用ホーロー基板は、発熱部
に印字電圧を供給する第１のコア材と、該第１のコア材
と電気的に独立したＧＮＤライン用の第２のコア材とを
備えているので、発熱部は第１のコア材に接続し、駆動
回路のＧＮＤラインは第２のコア材に直接接続すること
ができ、従来のような電極４は不要となる。そして第１
のコア材と第２のコア材は合せて一体に形成されている
ので従来のような大電流配線やアッセンブル作業も不要
となる。従って本発明によれば、部品数の削減、組立工
程の簡素化が図られる。しかも部品数が削減され、アッ
センブルも不要になったことにより、コストの低減を図
ることができ、又従来アッセンブルに必要だった接着も
不要となるので、サーマルヘッドの信頼性、寿命の向上
をも図ることができる。That is, the hollow substrate for a thermal head of the present invention includes a first core material that supplies a printing voltage to a heat generating part, and a second core material for a GND line that is electrically independent of the first core material. Therefore, the heat generating part can be connected to the first core material, and the GND line of the drive circuit can be directly connected to the second core material, and the conventional electrode 4 is not required. and the first
Since the core material and the second core material are integrally formed, there is no need for high current wiring or assembling work as in the prior art. Therefore, according to the present invention, the number of parts can be reduced and the assembly process can be simplified. Furthermore, the number of parts has been reduced and assembly is no longer necessary, reducing costs.Also, since the adhesive that was previously required for assembly is no longer required, the reliability and lifespan of the thermal head can be improved. can be achieved.
（実施例） 以下図示の実施例について説明する。(Example) The illustrated embodiment will be described below.
第１図は本発明に係るホーロー基板を用いたサーマルヘ
ッドの断面図であり、第２図はその一部省略平面図であ
る。これらの図に於て従来と同一の部分については同一
の符号が付しである。FIG. 1 is a sectional view of a thermal head using a hollow substrate according to the present invention, and FIG. 2 is a partially omitted plan view thereof. In these figures, the same parts as in the prior art are given the same reference numerals.
２０はホーロー基板であり、発熱部７に印字電圧（例え
ば２４■）を供給する第１のコア材２１と、該第１のコ
ア材２１と電気的に独立したＧＮ’Ｄライン用の第２の
コア材２２とを合せて一体に形成しである。２３はエナ
メル層であり、このエナメル層２３が第１のコア材２１
と第２のコア材２２とを電気的に絶縁している。このよ
うなホーロー基板２０は例えば第４図（ａ＞に示すよう
に段部２４を形成した第１のコア材２１を用意し、かつ
、同図（ｂ）の如く予めエナメル層２３−で被覆した第
２のコア材２２とを用意してあき、同図（Ｃ）に示すよ
うに第１のコア材２１の段部２４に第２のコア材２２を
搭載する。その後同図（ｄ）に示すように全体にエナメ
ル層２３を塗布し、焼成して第１のコア材２１と第２の
コア材２２とを一体的に形成する。コア材としては、Ｃ
の少ないＦｅ、Ｍｏ、ＳＵＳその他の金属を採用するこ
とができ、エナメル層としてはＭＯ，、Ｂａ。Reference numeral 20 denotes a hollow substrate, which includes a first core material 21 that supplies a printing voltage (for example, 24 cm) to the heat generating part 7, and a second core material 21 for the GN'D line that is electrically independent of the first core material 21. It is integrally formed with the core material 22 of. 23 is an enamel layer, and this enamel layer 23 is the first core material 21
and the second core material 22 are electrically insulated. Such a hollow substrate 20 is prepared by preparing a first core material 21 with a step 24 as shown in FIG. The second core material 22 is prepared and opened, and the second core material 22 is mounted on the stepped portion 24 of the first core material 21 as shown in FIG. As shown in the figure, an enamel layer 23 is applied to the entire surface and fired to integrally form the first core material 21 and the second core material 22.As the core material, C.
Fe, Mo, SUS and other metals with a small amount of metal can be used, and the enamel layer can be made of MO, Ba.
Ｂ等の酸化物系材料を採用できる。An oxide material such as B can be used.
ホーロー基板２０の上面先端部には第２図に明示するよ
うに細長く前記エナメル層２３を部分的に除去してスル
ーホール２５が形成されており、このスルーホール２５
を介し薄膜電極２７で第１のコア材２１に発熱部７が接
続されている（第３図参照）。又、上面後部にもスルー
ホール２６が形成されており、このスルーホール２６を
通して、ワイヤーボンディング９により駆動回路３のＧ
ＮＤラインが第２のコア材２２に直接接続されている（
第３図参照）。第２図中２８はビンコネクタを示す。As clearly shown in FIG. 2, an elongated through hole 25 is formed at the top end of the enamel substrate 20 by partially removing the enamel layer 23.
The heat generating part 7 is connected to the first core material 21 via a thin film electrode 27 (see FIG. 3). A through hole 26 is also formed at the rear of the upper surface, and through this through hole 26, the G of the drive circuit 3 is connected by wire bonding 9.
The ND line is directly connected to the second core material 22 (
(See Figure 3). 28 in FIG. 2 indicates a bin connector.
以上のようなホーロー基板は次のような作用効果を奏す
る。即ち、
■ホーロー基板２０は、発熱部７に印字電圧を供給する
第１のコア材２１と、該第１のコア材２１と電気的に独
立したＧＮＤライン用の第２のコア材２２とを備えてい
るので、発熱部７は第１のコア材２１に接続し、駆動回
路３のＧＮＤラインは第２のコア材２２に直接接続する
ことができ、従来のような電極４は不要となる。The hollow substrate as described above has the following effects. That is, (1) The hollow substrate 20 includes a first core material 21 that supplies a printing voltage to the heat generating part 7, and a second core material 22 for a GND line that is electrically independent from the first core material 21. Therefore, the heat generating part 7 can be connected to the first core material 21, and the GND line of the drive circuit 3 can be directly connected to the second core material 22, and the conventional electrode 4 is not required. .
■第１のコア材２１と第２のコア材２２は合せて一体に
形成されているので従来のような大電流配線やアッセン
ブル作業も不要となる。(2) Since the first core material 21 and the second core material 22 are integrally formed, there is no need for high current wiring or assembling work as in the prior art.
■従って本発明によれば、部品数の削減、組立工程の簡
素化が図られ、しかも部品数が削減され、アッセンブル
も不要になったことにより、コストの低減を図ることが
でき、又従来アッセンブルに必要だった接着も不要とな
るので、サーマルヘッドの信頼性、寿命の向上をも図る
ことができる。■Therefore, according to the present invention, the number of parts can be reduced and the assembly process can be simplified. Furthermore, the number of parts has been reduced and assembly is no longer necessary, making it possible to reduce costs. Since the adhesion that was previously required is no longer necessary, it is possible to improve the reliability and lifespan of the thermal head.
■第１のコア材２１には段部２４を設け、この段部２４
に第２のコア材２２を搭載することによりホーロー基板
２０の上面を一平面に形成しているのでホーロー基板２
０の小型化、シンプル化が図られる。■The first core material 21 is provided with a stepped portion 24, and this stepped portion 24
By mounting the second core material 22 on the enamel substrate 20, the upper surface of the enamel substrate 20 is formed into a single plane.
0 can be made smaller and simpler.
以上本発明の一実施例について説明したが、本発明は上
記実施例に限定されるものではなく、本発明の要旨の範
囲内において適宜変形実施可能であることは言うまでも
ない。Although one embodiment of the present invention has been described above, it goes without saying that the present invention is not limited to the above embodiment, and can be modified as appropriate within the scope of the gist of the present invention.
例えば第１のコア材２１には段部２４を設けることなく
、単に第１のコア材２１に第２のコア材２２を搭載して
両者を一体に形成しても良い。For example, the step portion 24 may not be provided on the first core material 21, and the second core material 22 may simply be mounted on the first core material 21 and both may be integrally formed.
［発明の効果］
以上詳述したように本発明によれば、発熱部に印字電圧
を供給する第１のコア材と、該第１のコア材と電気的に
独立したＧＮＤライン用の第２のコア材とを合せて一体
に形成したので、部品数の削減、組立工程の簡素化が図
られる。しかも部品数が削減され、アッセンブルも不要
になったことにより、コストの低減を図ることができ、
又従来アッセンブルに必要だった接着も不要となるので
、サーマルヘッドの信頼性、寿命も向上する。[Effects of the Invention] As described in detail above, according to the present invention, the first core material supplies the printing voltage to the heat generating part, and the second core material for the GND line is electrically independent from the first core material. Since it is integrally formed with the core material, the number of parts can be reduced and the assembly process can be simplified. Moreover, by reducing the number of parts and eliminating the need for assembly, costs can be reduced.
Furthermore, since the adhesive required for conventional assembly is no longer required, the reliability and life of the thermal head are improved.
第１図は本発明に係るホーロー基板を用いたサーマルヘ
ッドの断面図、第２図は同上一部省略平面図、第３図は
同上部分的なブロック図、第４図（ａ＞、（ｂ）、（ｃ
）、（ｄ）はホーロー基板の作成工程例を示す図、第５
図及び第６図は従来サーマルヘッドの断面図である。
７・・・発熱部、 ２０・・・ホーロー基板、２１・・
・第１のコア材、 ２２・・・第２のコア材。
２ｊＰ、Ｖ、（）゛ソ升ボ゛ルテージ゛）第２図FIG. 1 is a sectional view of a thermal head using a hollow substrate according to the present invention, FIG. 2 is a partially omitted plan view of the same as above, FIG. 3 is a partial block diagram of same as above, and FIG. ), (c
), (d) are diagrams showing an example of the manufacturing process of the enamel substrate, 5th
FIG. 6 is a sectional view of a conventional thermal head. 7... Heat generating part, 20... Enamel board, 21...
- 1st core material, 22... 2nd core material. 2jP, V, ()゛Voltage゛) Fig. 2
Claims (1)
コア材と電気的に独立したＧＮＤライン用の第２のコア
材とを合せて一体に形成したことを特徴とするサーマル
ヘッド用ホーロー基板。A thermal device characterized by being integrally formed with a first core material that supplies a printing voltage to a heat generating part, and a second core material for a GND line that is electrically independent of the first core material. Enamel board for head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12527086A JPS62279963A (en) | 1986-05-29 | 1986-05-29 | Enameled substrate for thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12527086A JPS62279963A (en) | 1986-05-29 | 1986-05-29 | Enameled substrate for thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62279963A true JPS62279963A (en) | 1987-12-04 |
Family
ID=14905923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12527086A Pending JPS62279963A (en) | 1986-05-29 | 1986-05-29 | Enameled substrate for thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62279963A (en) |
-
1986
- 1986-05-29 JP JP12527086A patent/JPS62279963A/en active Pending
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