JPS6227743B2 - - Google Patents

Info

Publication number
JPS6227743B2
JPS6227743B2 JP56139204A JP13920481A JPS6227743B2 JP S6227743 B2 JPS6227743 B2 JP S6227743B2 JP 56139204 A JP56139204 A JP 56139204A JP 13920481 A JP13920481 A JP 13920481A JP S6227743 B2 JPS6227743 B2 JP S6227743B2
Authority
JP
Japan
Prior art keywords
wafer
mounting plate
shaft
shafts
arm rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56139204A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5840837A (ja
Inventor
Junji Kutsuzawa
Hisashi Nakane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP56139204A priority Critical patent/JPS5840837A/ja
Publication of JPS5840837A publication Critical patent/JPS5840837A/ja
Publication of JPS6227743B2 publication Critical patent/JPS6227743B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Clamps And Clips (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manipulator (AREA)
  • Weting (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP56139204A 1981-09-02 1981-09-02 クランプ装置 Granted JPS5840837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56139204A JPS5840837A (ja) 1981-09-02 1981-09-02 クランプ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56139204A JPS5840837A (ja) 1981-09-02 1981-09-02 クランプ装置

Publications (2)

Publication Number Publication Date
JPS5840837A JPS5840837A (ja) 1983-03-09
JPS6227743B2 true JPS6227743B2 (enEXAMPLES) 1987-06-16

Family

ID=15239970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56139204A Granted JPS5840837A (ja) 1981-09-02 1981-09-02 クランプ装置

Country Status (1)

Country Link
JP (1) JPS5840837A (enEXAMPLES)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0460591U (enEXAMPLES) * 1990-10-01 1992-05-25

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3695971B2 (ja) * 1998-12-22 2005-09-14 シャープ株式会社 成膜装置および成膜方法
US7667822B2 (en) * 2006-02-14 2010-02-23 Asml Netherlands B.V. Lithographic apparatus and stage apparatus
KR101156902B1 (ko) * 2010-09-01 2012-06-21 삼성전기주식회사 기판 고정용 클램프

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0460591U (enEXAMPLES) * 1990-10-01 1992-05-25

Also Published As

Publication number Publication date
JPS5840837A (ja) 1983-03-09

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