JPS62275727A - Manufacture of electromagnetic wave shielding molded item - Google Patents
Manufacture of electromagnetic wave shielding molded itemInfo
- Publication number
- JPS62275727A JPS62275727A JP11978886A JP11978886A JPS62275727A JP S62275727 A JPS62275727 A JP S62275727A JP 11978886 A JP11978886 A JP 11978886A JP 11978886 A JP11978886 A JP 11978886A JP S62275727 A JPS62275727 A JP S62275727A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- knitted fabric
- electrically
- thermoplastic film
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004744 fabric Substances 0.000 claims abstract description 39
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 24
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 24
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 238000000465 moulding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 11
- 239000004793 Polystyrene Substances 0.000 abstract description 7
- 229920002223 polystyrene Polymers 0.000 abstract description 7
- 239000004952 Polyamide Substances 0.000 abstract description 5
- 229920002647 polyamide Polymers 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000007772 electroless plating Methods 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000007731 hot pressing Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 235000010893 Bischofia javanica Nutrition 0.000 description 1
- 240000005220 Bischofia javanica Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0011—Electromagnetic wave shielding material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】 五 発明の詳細な説明 （産業上の利用分野） 本発明は１を磁波クールド放形品の製造方法に関する。[Detailed description of the invention] V. Detailed description of the invention (Industrial application field) The present invention relates in part 1 to a method for manufacturing a magnetically cooled molded product.
（従来の技術〉
近年、装置の小型化、ｉ量化が進んで、プラスチック成
形品が、各種コンビニータ、デジタル機器等の筐体とし
て使用されており、外部機器への電磁波障害を防止する
ためにプラスチックに対する効果的な電磁波シールド技
術が必要とさｎている。このため、従来から、カーボン
や金属繊維混入の導電性プラスチックが研究さｆ１板状
の成形品では良好なｔｆＢ波７−ルド効果も得ら几てい
る。しかしながら、この方法は、良好な電磁波ンールド
効果全得ろために多量のフィラーを混入しなけｎばなら
ず、外貌が悪くなったり、強度が低下するなどの欠点が
あり之。(Conventional technology) In recent years, as equipment has become smaller and more compact, plastic molded products are being used as housings for various convenience computers, digital devices, etc. There is a need for effective electromagnetic shielding technology against electromagnetic waves.For this reason, conductive plastics containing carbon or metal fibers have been researched, and they have also been shown to have good shielding effects for TFB waves in plate-shaped molded products. However, in this method, a large amount of filler must be mixed in order to obtain the full effect of good electromagnetic wave shielding, which has drawbacks such as poor appearance and reduced strength.
このため、最近では多量のフィラーを混入しないて電磁
波シールド成形品を得ろ方法として、成形品内側に導電
性編地七一体化し九を一部シールド成形品が提案さｎて
いる。Therefore, recently, as a method of obtaining an electromagnetic shielding molded product without mixing a large amount of filler, a partially shielded molded product has been proposed in which a conductive knitted fabric is integrated inside the molded product.
（発明が解決しようとする問題点）
しかしながら、従来提案さｊ、ている４電性編地一体厄
形品は、成形品表面に露出した導電性編地の金属層が編
地とだけ密着しているために、密着性が問題であり、実
用上はがｎた金属片が回路上に脱落して、シラートラ引
き起こすといった事が危惧さｎている。金属層の密層性
を改良する方法としては、導電性編地と熱可塑性フィル
ムをラミネートし友後、導ｉＪｔ性編地が熱可塑性フィ
ルムと成形品との間にはさんだ形で一体底形品を得ろ方
法も提案さ几ているが、熱可塑性フィルム面が絶縁体で
あり、アースの取り出しができないという問題を有して
い友。(Problems to be Solved by the Invention) However, in the conventionally proposed products with integrated four-conductive knitted fabrics, the metal layer of the conductive knitted fabric exposed on the surface of the molded product is in close contact only with the knitted fabric. Because of this, adhesion is a problem, and in practice there is a concern that a piece of metal that has peeled off may fall onto the circuit, causing a backlash problem. One way to improve the layer density of the metal layer is to laminate a conductive knitted fabric and a thermoplastic film, and then create an integrated bottom structure in which the conductive knitted fabric is sandwiched between the thermoplastic film and the molded product. A method has also been proposed to obtain the product, but the problem is that the thermoplastic film surface is an insulator and the ground cannot be taken out.
本発明は導電層の密層性が良好でかつアースの取り出し
も容易である電磁波シールド成形品の製造方法を提供す
るものである。The present invention provides a method for producing an electromagnetic shielding molded product in which the conductive layer has good layer density and the ground connection is easy.
（問題点を解決するための手段）
本発明は、絹地に４道層を形成してなる４電性編地と熱
可塑性フィルムを、前記４を性編地を！Ｒ成している導
電性編地の一部が熱可塑性フィルムに埋没し、かつラミ
ネート面ではない熱ｉｆ’Ｊ塑性フィルム面に該編地の
一部が露出するようにラミネートさｎ之導電性材料を、
熱可塑性フィルム面が成形品内側表面になる！５ｉＣ１
金型に配置した後、金型を閉じて、キャビティに溶融樹
脂金供給することに工り導電層を成形品内側に一体成形
することを特徴とする１！磁波シ一ルド放形品の製造方
法に関する。(Means for Solving the Problems) The present invention provides a four-electrode knitted fabric formed by forming a four-way layer on a silk fabric and a thermoplastic film. The conductive knitted fabric is laminated so that a part of the conductive knitted fabric is buried in the thermoplastic film, and a part of the knitted fabric is exposed on the thermoplastic film surface that is not the laminated surface. material,
The thermoplastic film surface becomes the inner surface of the molded product! 5iC1
After placing the conductive layer in the mold, the mold is closed and molten resin is supplied into the cavity, and the conductive layer is integrally molded inside the molded product.1! The present invention relates to a method of manufacturing a magnetic wave shield released product.
以下、本発明を一実施例を示し次図面に基き説明すると
、第１図は本発明で用いらｊ、ろ導電性材料の断面を示
しｔもので、４を性編地１、およびそれにラミネートさ
ｎｒｃ熱可塑性フィルム２て構成されている。熱可塑性
フィルム２は導電性編地１にめりこむ工うに、ラミネー
トし、該編地１の一部をエラミネート面ではない熱可塑
性フィルム面に露出している。Hereinafter, the present invention will be explained based on one embodiment and the following drawings. Fig. 1 shows a cross section of a conductive material used in the present invention, 4 is a flexible knitted fabric 1, and a laminated thereto. It is composed of NRC thermoplastic film 2. The thermoplastic film 2 is laminated so as to be sunk into the conductive knitted fabric 1, and a part of the knitted fabric 1 is exposed on the thermoplastic film surface other than the laminate surface.
本発明における導電性編地１の編地としては、一般にポ
リアミド、ポリエステル、ポリウレタン等の合成繊維お
よび／ま几は羊毛、絹、木綿等の天然繊維製の編地が用
いらｊ、ろが特に限定するものではない。As the knitted fabric of the conductive knitted fabric 1 in the present invention, synthetic fibers such as polyamide, polyester, and polyurethane and/or knitted fabrics made of natural fibers such as wool, silk, and cotton are generally used. It is not limited.
本発明における４′１を注編地１の導電層は、金層でも
グラスチックでも目的とする導電性を有していｊば、特
に材質は限定するものではないが、一般に無電解めっき
にエラて形成さ几た金Ｍ４が用いらｎ、る。ま之、真空
蒸着、スパッタリング、溶射等の乾式めっきによって形
成さｎ九金属層等も用いろことができろ。The material of the conductive layer of the knitted fabric 1 of 4'1 in the present invention is not particularly limited, as long as it has the desired conductivity, whether it is a gold layer or a glass layer, but generally electroless plating is suitable. A finely formed gold M4 is used. However, a metal layer formed by dry plating such as vacuum evaporation, sputtering, or thermal spraying may also be used.
本発明におけろ熱可塑性フィルム２の素材としては、成
形品の樹脂と接着性が良いものであれば特に限定するも
のではｔ（いが、一般にポリスチレン、ポリ塩化ビニル
、ＡＢＳ、ポリアミド、ポリプロピレン、ポリエチレン
等の熱可塑性樹脂が用いられる。In the present invention, the material for the thermoplastic film 2 is not particularly limited as long as it has good adhesion to the resin of the molded product (although generally polystyrene, polyvinyl chloride, ABS, polyamide, polypropylene, Thermoplastic resin such as polyethylene is used.
ま之、第１図においては、４１！性編地１の片面にだけ
熱可塑性フィルムをラミネートし文例を示しであるが、
同様な方法で両面にラミネート面次ものを用いることが
できる。Well, in Figure 1, it's 41! An example is shown in which a thermoplastic film is laminated only on one side of the knitted fabric 1.
Laminated surfaces can be used on both sides in a similar manner.
かかる構成を有する４１！性材料の製法としては、導電
性編地１と熱可塑性フィルム２の熱プレス融着が用いら
ｎろ。41! having such a configuration! As a manufacturing method for the conductive material, heat press fusion of the conductive knitted fabric 1 and the thermoplastic film 2 is used.
この工うにして得らｎた導１ｉｉ性拐料は、第２図に示
すように導電性編地面がキャビティ側になるようコア型
４表面に配置するとともに金型を閉じ、ゲートエり溶融
樹脂７を供給し一体成形さｊ、る。The conductive material obtained in this manner is placed on the surface of the core mold 4 so that the conductive knitted surface faces the cavity side as shown in FIG. 7 is supplied and integrally molded.
本発明で用いらｎる溶融樹脂７としては、ポリ塩化ビニ
ル、ＡＢＳ、ポリアミド、ポリスチレン、ポリフェニレ
ンオキサイド、ポリプロピレン、ポリエチレン、ポリカ
ーボネートなどの熱可塑性樹脂またはフェノール、エポ
キシ等の熱硬化性樹脂が用いろｎろ。The molten resin 7 used in the present invention may be a thermoplastic resin such as polyvinyl chloride, ABS, polyamide, polystyrene, polyphenylene oxide, polypropylene, polyethylene, polycarbonate, or a thermosetting resin such as phenol or epoxy. reactor.
本発明におけろプラスチックの成形法としては、特に限
定するものではないが、射出底形、圧縮成形、トランス
ファ成形等を用いろことができろ。In the present invention, the plastic molding method is not particularly limited, but injection molding, compression molding, transfer molding, etc. can be used.
（作用〕
本発明に工ｊ、げ、従来提案されている導電性編地一体
成形品のように、底形凸表面に露出した導電性編地の金
属層が編地とだけ密層している場合とは異なり、４を性
編地が熱可塑性フィルムと成形品の間にはさまｎて接着
されているため、金ａ島の密層性は良好であり、かつ熱
可塑性２イルム面からも一部４１！注編地が露出してい
る之め、アースの取り出しも容易である。(Function) The present invention has the advantage that, like the previously proposed conductive knitted fabric integrally molded product, the metal layer of the conductive knitted fabric exposed on the convex bottom surface is densely layered with the knitted fabric. Unlike in the case where the fabric is glued between the thermoplastic film and the molded product, the dense layering properties of the gold a island are good, and the fabric is bonded between the thermoplastic film and the molded product. Since some of the 41! Note knitted fabric is exposed, it is easy to take out the ground.
（実施例）
以下、第１図及び第２図を用いて、実施例により本発明
の詳細な説明する。(Example) Hereinafter, the present invention will be explained in detail by way of an example using FIG. 1 and FIG. 2.
無電解Ｃｕめっぎを施し之ポリアミド製編地１（銅めっ
き膜厚：０．３μｍ）とポリスチレンフィルム２（厚さ
＝６０μｍ）″に熱プレス（１５０℃、１００ｋｇ／ａ
ｎ’）することに工り、ラミネート面ではないポリステ
ノンフィルム２面に、無電解めっき編地１の一部全露出
させた導電性材料３全得た。ついで、該導電性材料３を
、無電解めっき編地１の一部が露出しているポリスチレ
ンフィルム２面がコア型４に接触するＬうに配置し几後
、金型を閉じて、キャビティに溶融樹脂７ＣＡＢＳｍ脂
（高化式７ａ−１Ｑ、０６ｃｃ／ｍｉｎ （２１０℃、
３０ｋｇｆ ／ａＩり ） ）を供給することに工り導
電層を成形品内側に一体成形し交電磁波クールド底形品
８を得た。この工うにして得もｎ几電磁波シールド底形
品８の金属層の密着性は良好で、かつ表面抵抗もＣＬ２
Ω／口であり、アースの取り出しも容易に行うことがで
き友。Electroless Cu-plated polyamide knitted fabric 1 (copper plating film thickness: 0.3 μm) and polystyrene film 2 (thickness = 60 μm) were heat-pressed (150°C, 100 kg/a).
n'), the conductive material 3 was obtained with a part of the electroless plated knitted fabric 1 completely exposed on two sides of the polystenon film that were not the laminate side. Next, the conductive material 3 is placed in such a way that the polystyrene film 2 surface, where a part of the electroless plated knitted fabric 1 is exposed, is in contact with the core mold 4. After cooling, the mold is closed and the conductive material 3 is melted into the cavity. Resin 7CABSm resin (Koka formula 7a-1Q, 06cc/min (210℃,
A conductive layer was integrally molded inside the molded product to obtain an alternating current electromagnetic wave cooled bottom-shaped product 8. With this method, the adhesion of the metal layer of the electromagnetic shield bottom type product 8 is good, and the surface resistance is also CL2.
Ω/mouth, making it easy to take out the ground.
（発明の効果）
以上の説明から明らかなＬうに、本発明に：ｎば従来問
題となっていた電磁波シールド成形品の導′？Ｊ１層の
密着性は、導電層ケ熱可輩注フィルムと成形品の間には
さんで接着しているために、金九層の密着性は良好であ
り、かつ熱可塑性フィルム面からも一部尋゛硫性ｒ＠地
が露出している次めにアースの取り出しも可能となり、
その工業的価値を工極めて大である。(Effects of the Invention) As is clear from the above explanation, the present invention has the following advantages. The adhesion of the J1 layer is that the conductive layer is sandwiched and adhered between the thermoplastic film and the molded product, so the adhesion of the gold 9 layer is good, and it is also very close to the surface of the thermoplastic film. Next, when the sulfuric ground is exposed, it is also possible to take out the ground.
It is important to develop its industrial value.
第１図は、本発明に係る導電性材料の概念断面図、第２
図は、本発明に係る電磁波／−ルド成形品の製造方法の
一実施例を示す概念断面図である。
符号の説明
１ 導電性編地 ２ 熱可塑性フィルム３ 導電
性材料 ４ コア型
５ キャビティ型 ６ ゲート
７ 溶融樹脂 ８ 電磁波シールド成形品
代理人弁理士 廣 瀬 章、″、−
手 続 ネ甫 正 書く方式）昭和６１年８月
１９日
１、事件の表示
昭和６１年特許願 第１．１９７８８号２、発明の名称
を磁波シールド成形品の製造方法
昭和６１年 ７月２９日（発送日）
変更なし）FIG. 1 is a conceptual cross-sectional view of the conductive material according to the present invention, and FIG.
The figure is a conceptual cross-sectional view showing an embodiment of the method for manufacturing an electromagnetic wave/molded product according to the present invention. Explanation of symbols 1 Conductive knitted fabric 2 Thermoplastic film 3 Conductive material 4 Core type 5 Cavity type 6 Gate 7 Molten resin 8 Patent attorney representing electromagnetic shielding molded products Akira Hirose, ″, − Procedure Tadashi Neho Writing method ) August 19, 1985 1, Indication of the incident 1986 Patent Application No. 1. 19788 2, Name of the invention: Method for manufacturing magnetic shield molded products July 29, 1988 (Shipping date) No change)
Claims (1)
フィルムを、前記導電性編地を構成している導電性編地
の一部が熱可塑性フィルムに埋没し、かつラミネート面
ではない熱可塑性フィルム面に、該編地の一部が露出す
るようにラミネートされた導電性材料を、熱可塑性フィ
ルム面が成形品内側表面になるように、金型に配置した
後、キャビティに溶融樹脂を供給することにより、導電
層を成形品内側に一体成形することを特徴とする電磁波
シールド成形品の製造方法。1. A conductive knitted fabric formed by forming a conductive layer on the knitted fabric and a thermoplastic film are combined so that a part of the conductive knitted fabric constituting the conductive knitted fabric is buried in the thermoplastic film, and the laminated surface After placing the conductive material laminated so that a part of the knitted fabric is exposed on the thermoplastic film surface that is not in the mold in a mold so that the thermoplastic film surface becomes the inner surface of the molded product, it is placed in the cavity. A method for producing an electromagnetic shielding molded product, which comprises integrally molding a conductive layer inside the molded product by supplying molten resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11978886A JPS62275727A (en) | 1986-05-23 | 1986-05-23 | Manufacture of electromagnetic wave shielding molded item |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11978886A JPS62275727A (en) | 1986-05-23 | 1986-05-23 | Manufacture of electromagnetic wave shielding molded item |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62275727A true JPS62275727A (en) | 1987-11-30 |
Family
ID=14770235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11978886A Pending JPS62275727A (en) | 1986-05-23 | 1986-05-23 | Manufacture of electromagnetic wave shielding molded item |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62275727A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02279318A (en) * | 1989-04-21 | 1990-11-15 | Daiwa Giken Kogyo Kk | Mold device for synthetic resin molded product and its manufacture |
| US5165985A (en) * | 1991-06-28 | 1992-11-24 | Minnesota Mining And Manufacturing Company | Method of making a flexible, transparent film for electrostatic shielding |
| JPH05315785A (en) * | 1992-05-08 | 1993-11-26 | Suzuki Sogyo Co Ltd | Method for fabricating molded part containing metallic long fibers |
| US5672309A (en) * | 1989-02-10 | 1997-09-30 | Sumitomo Chemical Company, Limited | Method for producing molded article of fiber reinforced thermoplastic resin |
| US6506326B1 (en) | 2000-11-14 | 2003-01-14 | Thermoceramix, Inc. | Method for fabricating composite parts by injection molding |
| JP2009149053A (en) * | 2007-12-20 | 2009-07-09 | Sutech Trading Ltd | Molded article |
-
1986
- 1986-05-23 JP JP11978886A patent/JPS62275727A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672309A (en) * | 1989-02-10 | 1997-09-30 | Sumitomo Chemical Company, Limited | Method for producing molded article of fiber reinforced thermoplastic resin |
| JPH02279318A (en) * | 1989-04-21 | 1990-11-15 | Daiwa Giken Kogyo Kk | Mold device for synthetic resin molded product and its manufacture |
| JPH0688285B2 (en) * | 1989-04-21 | 1994-11-09 | 大和技研工業株式会社 | Method for manufacturing heat insulating member made of synthetic resin |
| US5165985A (en) * | 1991-06-28 | 1992-11-24 | Minnesota Mining And Manufacturing Company | Method of making a flexible, transparent film for electrostatic shielding |
| JPH05315785A (en) * | 1992-05-08 | 1993-11-26 | Suzuki Sogyo Co Ltd | Method for fabricating molded part containing metallic long fibers |
| US6506326B1 (en) | 2000-11-14 | 2003-01-14 | Thermoceramix, Inc. | Method for fabricating composite parts by injection molding |
| JP2009149053A (en) * | 2007-12-20 | 2009-07-09 | Sutech Trading Ltd | Molded article |
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