JPH03125499A - Armor case - Google Patents

Abstract

PURPOSE:To show an excellent shield effect of an electromagnetic wave by adding fibers or whiskers having conductivity to thermoplastic resin further providing a conductive coating on the surface of thermoplastic resin in an armor case whose material consists of thermoplastic material. CONSTITUTION:The subject armor case is composed of thermoplastic resin 11, a copper plating layer 12, a nickel plating layer 13 and anchor parts 14, and a material having high strength such as conductive whiskers 15 is added into thermoplastic resin 11. As to an mixing amount, the strength is not sufficient in the case of under 5% while a raw material becomes fragile in the case of exceeding 40% thus to be unbearable for use. Stiffness is heightened by adding fibers or whiskers having conductivity to thermoplastic resin so that the wall thickness of an armor case can be reduced without sacrificing strength of the armor case itself while making a product light and small.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an exterior case for a portable computer, small appliance, wristwatch, etc., which is made of a thermoplastic resin and has a conductive coating on its surface.

[Prior Art] Conventionally, exterior cases for computers that have a conductive coating on the surface made of metal plating, AI vapor deposition, etc. for the purpose of shielding electromagnetic waves have been subject to quality requirements such that the conductive coating must have good adhesion, and Due to quality requirements in terms of appearance, the majority of products were molded from a small number of thermoplastic resins such as ABS resin and polycarbonate resin, but we now have a structure that is strong and covered with a metal coating. For example, it may be possible to mix glass fiber into the material, but the durability is poor due to the peeling phenomenon on the surface.

FIG. 2 is a schematic diagram showing a cross section of a conventional outer case part.
1 is a thermoplastic resin, 2 is a steel plating layer, and 3 is a nickel plating layer. Grooves are formed on the surface of the thermoplastic resin 1 by etching technology, and the copper plating layer 2 is soaked in by electroless plating. to form an anchor part 4.

[Problems to be Solved by the Invention] Despite the current demand for computers, especially portable computers, to be lighter, thinner, and smaller, conventional technology has been able to reduce the thickness of the outer case without sacrificing strength. It was extremely difficult to make it thin and lightweight.

In addition, although there have been attempts to increase the strength of the material by adding glass fiber, the glass fiber is exposed on the surface of the molded product and the adhesion between the glass fiber and the conductive coating is weak. The conductive coating peeled or came off along the glass fibers, which caused a short circuit phenomenon in the electronic circuit section housed inside the outer case, making it impractical. Furthermore, glass fiber itself also has a serious problem of causing harm to humans (animals) due to pneumoconiosis.

The present invention is intended to solve these problems, and its purpose is to make the product lighter, thinner, and smaller by increasing the strength of the outer case. An object of the present invention is to provide an exterior case for a small portable device that has excellent adhesion to the body, an information processing device carried on the arm attached to the body, such as a computer, etc.

[Means for Solving the Problems] The present invention provides an exterior case made of a thermoplastic resin, in which 5 to 40% by weight of conductive fibers or whiskers are added to the thermoplastic resin, and the It is characterized by providing a conductive film on the surface of the thermoplastic resin.

[Example] Fig. 1 is a sectional view of the exterior part according to the present invention, in which 11 is a thermoplastic resin, 12 is a steel plating layer, 13 is a nickel plating layer, 14 is a part of an anchor, 15 is a conductive whisker, etc. A material that is physically strong is added to 11 thermoplastic resins. 15 is a conductive material, so 15 a, 15 b,
15c, 15d, and 15e are in close contact with the copper plating layer 12 and become a material that is strong and can withstand external magnetic fields. Examples of the material No. 15 include conductive materials such as titanium, carbon, copper, and iron. In particular, in the case of carbon-based materials, the material itself is lightweight, so the finished exterior material itself is light, and high value-added information products can be created. Moreover, instead of such a metal material, metal-coated glass fiber may be used.

If the amount is less than 5%, the strength is insufficient, and if it is more than 40%, the material becomes brittle and cannot be used.

As described above, adding conductive fibers or whiskers to thermoplastic resin increases rigidity, making it possible to reduce the thickness of the outer case without sacrificing the strength of the outer case itself. In other words, it is possible to make products lighter, thinner, shorter and smaller. Since the conductive coating is strongly bonded to the conductive fibers or whiskers, the adhesion of the conductive coating is stronger than that of a thermoplastic resin without conductive fibers or whiskers, resulting in improved quality. It is also superior in terms of aspects.

[Effects of the Invention] According to the present invention described above, in addition to the above-described effects, the conductive fibers or whiskers are intricately intertwined within the thermoplastic resin and are conductive to each other, and they themselves also generate electromagnetic waves. It plays the role of a shield, and together with the conductive film formed on the surface of the outer case, it provides even better shielding effects against electromagnetic waves. Therefore, it is extremely effective for small electronic devices.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing a structure according to the present invention, and FIG. 2 is a schematic diagram showing a conventional structure. 11: Thermoplastic resin 12: Copper plating layer 13: Nickel plating layer 14: Anchor part 15: Whisker material or more

Claims (1)

[Claims] In an exterior case made of a thermoplastic resin, 5 to 40% by weight of conductive fibers or whiskers are added to the thermoplastic resin, and a conductive film is further provided on the surface of the thermoplastic resin. An exterior case characterized by: