JPS62273745A - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS62273745A
JPS62273745A JP11693386A JP11693386A JPS62273745A JP S62273745 A JPS62273745 A JP S62273745A JP 11693386 A JP11693386 A JP 11693386A JP 11693386 A JP11693386 A JP 11693386A JP S62273745 A JPS62273745 A JP S62273745A
Authority
JP
Japan
Prior art keywords
temperature
bonding
chip
voltage
discrepancy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11693386A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455528B2 (enExample
Inventor
Yoshiyuki Furui
古井　義之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11693386A priority Critical patent/JPS62273745A/ja
Publication of JPS62273745A publication Critical patent/JPS62273745A/ja
Publication of JPH0455528B2 publication Critical patent/JPH0455528B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP11693386A 1986-05-21 1986-05-21 ボンデイング装置 Granted JPS62273745A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11693386A JPS62273745A (ja) 1986-05-21 1986-05-21 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11693386A JPS62273745A (ja) 1986-05-21 1986-05-21 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS62273745A true JPS62273745A (ja) 1987-11-27
JPH0455528B2 JPH0455528B2 (enExample) 1992-09-03

Family

ID=14699289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11693386A Granted JPS62273745A (ja) 1986-05-21 1986-05-21 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS62273745A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317125A (en) * 1990-10-12 1994-05-31 Axis U.S.A., Inc. Fusing apparatus with temperature control
JPH08107126A (ja) * 1994-10-06 1996-04-23 Rohm Co Ltd ワイヤボンディング装置
WO2002069393A1 (en) * 2001-02-24 2002-09-06 Jiwoo Techniques Korea Device for detecting wafer positioning failure on semiconductor processing device and method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317125A (en) * 1990-10-12 1994-05-31 Axis U.S.A., Inc. Fusing apparatus with temperature control
US5418346A (en) * 1990-10-12 1995-05-23 Axis Usa, Inc. Fusing apparatus with temperature control
JPH08107126A (ja) * 1994-10-06 1996-04-23 Rohm Co Ltd ワイヤボンディング装置
WO2002069393A1 (en) * 2001-02-24 2002-09-06 Jiwoo Techniques Korea Device for detecting wafer positioning failure on semiconductor processing device and method thereof

Also Published As

Publication number Publication date
JPH0455528B2 (enExample) 1992-09-03

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