JPS62269502A - Manufacture of strip line - Google Patents
Manufacture of strip lineInfo
- Publication number
- JPS62269502A JPS62269502A JP61114418A JP11441886A JPS62269502A JP S62269502 A JPS62269502 A JP S62269502A JP 61114418 A JP61114418 A JP 61114418A JP 11441886 A JP11441886 A JP 11441886A JP S62269502 A JPS62269502 A JP S62269502A
- Authority
- JP
- Japan
- Prior art keywords
- board
- strip line
- conductor
- ground conductor
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 230000003014 reinforcing effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は高周波回路における伝送線路としてのストリ
ップ線路に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a strip line as a transmission line in a high frequency circuit.
従来よりストリップ線路の構造として高次モードの発生
を抑圧するための構造としてス) IJノブ線路の基板
幅を制限したストリップ線路が使用されており、この構
造として、ストリップ線路自体を収容するための接地導
体幅と同じ幅の溝をケースに作り、ストリップ線路自体
をケースに収容する方法、あるいは上蓋に溝を作りスト
リップ線路基板上を覆う方法等がある。Conventionally, a strip line with a limited board width of the IJ knob line has been used as a structure for suppressing the generation of higher-order modes as a strip line structure, and this structure has a structure to suppress the generation of higher-order modes. There are methods such as making a groove in the case with the same width as the ground conductor width and housing the strip line itself in the case, or making a groove in the top cover and covering the strip line board.
〔発明が解決しようとしている問題点〕レン等の基板を
用いてストリップ線路を構成した場合、導体の金属箔た
とえば銅箔の張力の不均衡の影響で、両面銅張基板にソ
リあるいは変形等が起りやすく、通常は補強キャリヤを
接地導体面に取り付けて用いる構造をとっている。[Problem to be solved by the invention] When a strip line is constructed using a substrate such as wire, the double-sided copper-clad substrate may warp or deform due to the imbalance of tension in the conductor metal foil, such as copper foil. Usually, a reinforcing carrier is attached to the ground conductor surface.
このキャリヤに取り付けるために基板を所定の幅に切断
すると、さらに著しいソリと変形が現われ半田付が不充
分になり、プリント基板とキャリヤの密着が悪くなり部
分的にこのキャリヤと基板接地導体面に隙間がある状態
となりやすい。又、変形等により所定の位置にスl−I
Jツブ線路が配置されないという欠点があり、特に!
マイクロ波帯等の高い周波数ではmの悪化の原因になっ
ていた。When the board is cut to a predetermined width in order to be attached to this carrier, even more severe warping and deformation appear, resulting in insufficient soldering and poor adhesion between the printed circuit board and the carrier, resulting in partial contact between the carrier and the ground conductor surface of the board. This tends to leave gaps. In addition, due to deformation etc., the l-I
There is a drawback that the J Tsubu line is not located, especially! At high frequencies such as the microwave band, m is a cause of deterioration.
上記の問題を解決するために、この発明はストリップ線
路の接地導体面にも切断する基板幅と同じ幅の接地導体
面のみを接地導体として残し、他の導体部分をエツチン
グ等により除いた構造のプリントパターン基板にする。In order to solve the above problem, the present invention has a structure in which only the ground conductor surface of the strip line with the same width as the width of the board to be cut is left as a ground conductor, and other conductor parts are removed by etching etc. Make it into a printed pattern board.
さらにこのプリント基板の裏面をリフ口等により半田付
すれば導体パターンの残っている部分のみの半田付が行
なわれる。このキャリヤの付いた基板を基板上面の目印
にそって切断すれば必要な部分のみの基板幅制限型のス
トリップ線路を作ることが出来る。Furthermore, if the back side of this printed circuit board is soldered using a refill port or the like, only the portion where the conductor pattern remains will be soldered. By cutting the substrate with this carrier attached along the marks on the top surface of the substrate, it is possible to create a strip line with limited substrate width only in the necessary portion.
上記の構造のス) IJツブ線路であれば基板の上下の
導体部分の面積比を小さくすることが出来るので上下の
基板張力差による歪が小さくなる。よって裏面の必要な
導体部分全面に一様に半田付されるので接地導体面電位
を高周波的に等電位にすることが出来る。したがって特
性インピーダンスの不連続性が少なくなり良好なストリ
ップ線路にすることが出来る。又基板の変形等がないた
め所定の位置にストリップ線路を取り付けることが出来
るので入出力端のコネクタ位置とストリップ線路の中心
導体の位置を正確に合わせることが出来る。If the above structure is an IJ tube line, the area ratio of the upper and lower conductor portions of the board can be reduced, so the distortion due to the difference in tension between the upper and lower boards can be reduced. Therefore, since the necessary conductor portions on the back surface are uniformly soldered, the ground conductor surface potential can be made equal to the potential at high frequencies. Therefore, discontinuity in characteristic impedance is reduced, and a good strip line can be obtained. In addition, since there is no deformation of the board, the strip line can be attached at a predetermined position, and the position of the connector at the input/output end can be accurately aligned with the position of the center conductor of the strip line.
以下、実施例を示す添付図面によって詳細に説明する。 Hereinafter, embodiments will be described in detail with reference to the accompanying drawings showing examples.
第1図乃至第2図はこの発明の一実施例を示すものであ
る。第1図は部品実装面パターン図、第2図は裏面パタ
ーン図である。第1図において1.はスl−’Jツブ線
路の導体パターン、2.は基板幅切断用目印、3.は基
板母材である。第2図の4.のハツチング部は接地導体
のパターン図である。第3図は第1図乃至第2図のパタ
ーンの基板を補強用のキャリヤにリフ口で半田付した図
面であり、5.はこの補強用キャリヤである。第3図に
おいて、キャリヤにストリップ線路パターンをもったプ
リント基板をリフ口によって半田付した後、第1図の2
、の目印に沿って一点鎖線の如くカッタ等により切断し
た図が第4図の基板幅制限型のストリップ線路である。1 and 2 show one embodiment of the present invention. FIG. 1 is a pattern diagram of the component mounting surface, and FIG. 2 is a pattern diagram of the back surface. In Figure 1, 1. is the conductor pattern of the subl-'J tube line, 2. is a mark for cutting the board width, 3. is the substrate base material. 4 in Figure 2. The hatched part is a pattern diagram of a ground conductor. FIG. 3 is a drawing in which the circuit board having the pattern shown in FIGS. 1 and 2 is soldered to a reinforcing carrier with a rift opening, and 5. is this reinforcing carrier. In Figure 3, after a printed circuit board with a strip line pattern is soldered to the carrier using the rift opening,
The board width limited type strip line shown in FIG. 4 is a diagram cut with a cutter or the like along the dashed line along the marks .
以上のようにプリント基板の上下面に必要な導体パター
ンを作ることにより、基板のソリ、変形等を少なくする
ことが出来るので電気的に安定なスl−IJツブ線路構
造とすることが出来もAs described above, by creating the necessary conductor patterns on the top and bottom surfaces of the printed circuit board, it is possible to reduce warping, deformation, etc. of the printed circuit board, making it possible to create an electrically stable slug-IJ tube line structure.
第1図は本発明による実装面のパターン図第2図は本発
明による裏面のパターン図第3図は基板を補強キャリヤ
に取り付けた構造図
第4図は基板を補強キャリヤに取り付けた後不要部分を
切断した基板幅制限型ストリップ線路の構造図である。
1、・・・導体パターン図
2、・・・基板幅切断用目印
3、・・・基板母材
4・・・裏面接地導体パターン図
5、・・・基板補強用キャリャ
第1図 第2図
3. 5.4゜Fig. 1 is a pattern of the mounting surface according to the present invention. Fig. 2 is a pattern of the back side according to the present invention. Fig. 3 is a structural diagram of the board attached to the reinforcing carrier. Fig. 4 is an unnecessary portion after the board is attached to the reinforcing carrier. FIG. 2 is a structural diagram of a substrate width-limited strip line cut away. 1, Conductor pattern diagram 2, Board width cutting mark 3, Board base material 4, Back ground conductor pattern diagram 5, Board reinforcement carrier, Figure 1, Figure 2 3. 5.4°
Claims (1)
法において、プリント基板の切断により必要とする部分
と同一形状のパターンをプリント基板の裏面に接地導体
として作成し、その後該裏面にプリント基板補強用キャ
リヤに取付け、つづいて裏面パターンに沿ってプリント
基板を切断することを特徴とするストリップ線路の製造
方法。(1) In a method for manufacturing a strip line with a limited board width structure, a pattern with the same shape as the required part is created on the back side of the printed circuit board as a ground conductor by cutting the printed circuit board, and then the printed board is reinforced on the back side. 1. A method for manufacturing a strip line, which comprises mounting the printed circuit board on a carrier, and then cutting the printed circuit board along the pattern on the back side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61114418A JPS62269502A (en) | 1986-05-19 | 1986-05-19 | Manufacture of strip line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61114418A JPS62269502A (en) | 1986-05-19 | 1986-05-19 | Manufacture of strip line |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62269502A true JPS62269502A (en) | 1987-11-24 |
Family
ID=14637206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61114418A Pending JPS62269502A (en) | 1986-05-19 | 1986-05-19 | Manufacture of strip line |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62269502A (en) |
-
1986
- 1986-05-19 JP JP61114418A patent/JPS62269502A/en active Pending
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