JPS62266806A - Manufacture of thick film resistance element - Google Patents
Manufacture of thick film resistance elementInfo
- Publication number
- JPS62266806A JPS62266806A JP61109674A JP10967486A JPS62266806A JP S62266806 A JPS62266806 A JP S62266806A JP 61109674 A JP61109674 A JP 61109674A JP 10967486 A JP10967486 A JP 10967486A JP S62266806 A JPS62266806 A JP S62266806A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- squeegee
- thick film
- resistance element
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims description 11
- 238000007650 screen-printing Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004020 conductor Substances 0.000 description 17
- 238000009966 trimming Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 3
- 230000008719 thickening Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はトリミング加工による抵抗値の調整が可能な厚
膜抵抗体の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a thick film resistor whose resistance value can be adjusted by trimming.
（従来の技術）
従来、この種の技術として特開昭５９−２２９８５１号
公報に開示されるものがある。この文献に開示された厚
膜抵抗体は第２図に示すように、セラミック基板ｌｌ上
に形成された導体１２間にシート抵抗値の相違する抵抗
ペーストを用いるか又は膜厚に差をつけるか或はこれら
を組み合わせて低抵抗体１３および高抵抗体１４からな
る合成抵抗体１５を形成し、かつ低抵抗体１３側をトリ
ミング加工するようにしたものである。そしてこの厚膜
抵抗体では低抵抗側をトリミング加工することにより、
通常の一種類のシート抵抗値で、均一な膜厚の厚膜抵抗
体のトリミング加工に比べ、トリミング加工部１６の深
さｄが小さくとも抵抗値変動量が大きくできるというも
のであった。ここで一種類のシート抵抗値で上記第３図
の構造の厚膜抵抗体を製をする際、従来の方法ではセラ
ミック基板１１上に４体ノ２を形成した後低抵抗体１３
と高抵抗体１４の両方の個所を一面に抵抗体をスクリー
ン印判法で形成し、さらに低抵抗体Ｉ３の個所のみに前
記スクリーン印刷に用いたものと別のスクリーンマスク
（図示せず）を用いて抵抗積−ストを重ね塗シして、低
抵抗体１３の膜厚を厚くして、高抵抗体１４の膜厚に差
をつけていた。(Prior Art) Conventionally, this type of technology is disclosed in Japanese Patent Laid-Open No. 59-229851. As shown in FIG. 2, the thick film resistor disclosed in this document uses resistor pastes with different sheet resistance values between the conductors 12 formed on the ceramic substrate 11, or makes the film thickness different. Alternatively, a composite resistor 15 consisting of the low-resistance element 13 and the high-resistance element 14 is formed by combining these elements, and the low-resistance element 13 side is trimmed. And by trimming the low resistance side of this thick film resistor,
Compared to the usual trimming of a thick film resistor with one type of sheet resistance and a uniform film thickness, even if the depth d of the trimmed portion 16 is small, the amount of variation in resistance can be increased. When manufacturing a thick film resistor with the structure shown in FIG.
A resistor is formed on one side of both the high-resistance element 14 and the high-resistance element 14 using a screen printing method, and a screen mask (not shown) different from that used for the screen printing is used only on the low-resistance element I3. The resistive layer was coated in layers to increase the thickness of the low-resistance element 13, and to create a difference in the thickness of the high-resistance element 14.
（発明が解決しようとする問題点）
しかしながら、従来の方法では膜厚に差をつけて高抵抗
体と低抵抗体を形成するには二種のスクリーンマスク及
び二回の印刷工程が必要となり部材、工数が余分にかか
るという欠点があった。(Problems to be Solved by the Invention) However, in the conventional method, two types of screen masks and two printing processes are required to form a high-resistance element and a low-resistance element with different film thicknesses. , which had the disadvantage of requiring additional man-hours.
本発明は以上述べた部材、工数が余分にかかるという欠
点を除去し一回の抵抗体印刷工程で簡易に一つの抵抗体
内の膜厚に差をつける厚膜抵抗体の製造方法を提供する
ことを目的とする。The present invention provides a method for manufacturing a thick-film resistor that eliminates the above-mentioned drawbacks such as extra members and man-hours and allows for easily varying the film thickness within one resistor in a single resistor printing process. With the goal.
（問題点を解決するだめの手段）
本発明は前記目的を達成するために、スキージを移動さ
せて行なうスクリーン印刷により基板上に抵抗体を形成
する厚膜抵抗体の製造方法において、前記スキージの移
動方向に平行に且つ前記抵抗体の厚付は部形成位置をは
さむ如く一対の隆起部を前記基板上に設け、前記スキー
ジを移動させながらスクリーン印刷を行なう際、前記ス
キージの移動経路の一部において前記スキージを前記一
対の隆起部上を通過させることにより、薄付は部及び厚
付は部を有する抵抗体を形成するようにしたものである
。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for manufacturing a thick film resistor in which a resistor is formed on a substrate by screen printing performed by moving a squeegee. A pair of raised parts are provided on the substrate parallel to the moving direction and sandwiching the thickening part forming position of the resistor, and when screen printing is performed while moving the squeegee, a part of the moving path of the squeegee is provided. By passing the squeegee over the pair of raised portions, a resistor having a thin portion and a thick portion is formed.
（作用）
本発明によれば前述の如き方法で厚膜抵抗体を形成する
ため、−回のスクリーン印刷工程で薄付は部及び厚付は
部を有する厚膜抵抗体が製造される。(Function) According to the present invention, since a thick film resistor is formed by the method described above, a thick film resistor having a thin part and a thick part is manufactured in -times of screen printing process.
また、このようにして作られた厚膜抵抗体の厚付は部を
トリミング加工することにより抵抗値調整量を大きくで
きる。Further, the amount of resistance value adjustment can be increased by trimming the thick portion of the thick film resistor made in this manner.
（実施例）
第１図（、）は本発明の一実施例を説明するだめの平面
図、第１図（ｂ）は第１図（、）のＡ −Ａ’断面図で
ある。以下、第１図（、） 、 （ｂ）を参照して、本
発明の厚膜抵抗体の製造方法を説明する。(Embodiment) FIG. 1(,) is a plan view for explaining an embodiment of the present invention, and FIG. 1(b) is a sectional view taken along the line AA' in FIG. 1(,). Hereinafter, a method for manufacturing a thick film resistor according to the present invention will be explained with reference to FIGS.
まず、セラミック基板１上に後述する抵抗体４の電極と
なる一対の導体２を互いに平行になる如く形成する。次
いでセラミック基板１上に前記各導体２と平行に誘電体
からなる一対の隆起部３を形成する。この一対の隆起部
３は各導体２及び各導体２間でなす領域をはさむ如く形
成され、その膜厚は導体２に比べ厚く形成される。この
隆起部３の導体２に沿った方向の長さは後述する抵抗体
４の厚付は範囲５に対応する。First, a pair of conductors 2, which will become electrodes of a resistor 4 to be described later, are formed on a ceramic substrate 1 so as to be parallel to each other. Next, a pair of raised portions 3 made of dielectric material are formed on the ceramic substrate 1 in parallel with each of the conductors 2. The pair of raised portions 3 are formed to sandwich each conductor 2 and a region formed between each conductor 2, and are formed thicker than the conductor 2. The length of the raised portion 3 in the direction along the conductor 2 corresponds to a thickness range 5 of the resistor 4, which will be described later.
次いで、抵抗体４をスクリーン印刷で形成するが、この
場合抵抗体印刷方向６は電極２の長尺方向であυ、この
方向６にスキージ（図示せず）を移動させていくと、第
１図（ｂ）に示す如くスキージが隆起部３に接しない個
所では膜厚ｔ１に、スキージが隆起部３に接触する個所
すなわち抵抗厚付範囲５では隆起部３によりスキージが
押し上げられて前述の膜厚ｔ１より厚い膜厚ｔ２になる
如く抵抗体４が形成される。このようにして一つの抵抗
体内の膜厚を変えることが可能となる。Next, the resistor 4 is formed by screen printing. In this case, the resistor printing direction 6 is the longitudinal direction of the electrode 2, and as a squeegee (not shown) is moved in this direction 6, the first As shown in Figure (b), the film thickness is t1 at the locations where the squeegee does not contact the raised portions 3, and the film thickness is reduced to t1 at the locations where the squeegee contacts the raised portions 3, that is, the resistance thickening range 5, where the squeegee is pushed up by the raised portions 3, resulting in the above-mentioned film thickness. The resistor 4 is formed to have a thickness t2 that is greater than the thickness t1. In this way, it is possible to change the film thickness within one resistor.
本実施例では導体２の膜厚を１５μｍ、隆起部としての
誘電体３の膜厚を４０μｍとしたときの抵抗体４の膜厚
は１．が３４μｍ、ｔ２が４４μｍで１０μｍの膜厚差
が得られた。In this embodiment, the thickness of the resistor 4 is 1.5 μm when the thickness of the conductor 2 is 15 μm and the thickness of the dielectric 3 as a raised portion is 40 μm. was 34 μm and t2 was 44 μm, resulting in a film thickness difference of 10 μm.
上述の如くして作られた厚膜抵抗体の厚膜側をトリミン
グ加工することにより、トリミング加工部７の深さが小
さくても抵抗値調整量を大きくできる。By trimming the thick film side of the thick film resistor produced as described above, the amount of resistance value adjustment can be increased even if the depth of the trimming section 7 is small.
本実施列では隆起部に誘電体を使用しだが、これに限定
されるものではなく、この他紙抗体の電極となる導体の
一部を重ね塗シすることによっても隆起部を形成するこ
とができる。In this example, a dielectric material is used for the raised portions, but the dielectric material is not limited to this, and the raised portions can also be formed by overcoating a portion of the conductor that will become the electrode of the paper antibody. can.
また隆起部３の形成を導体２形成前に行うことも当然可
能である。Furthermore, it is naturally possible to form the raised portion 3 before forming the conductor 2.
また一対の隆起部を一対の導体の並び方向に対し垂直な
方向で且つこの一対の導体間の抵抗体形成位置をはさむ
如く設け、スキージを一対の導体の並び方向に垂直な方
向に移動させてスクリーン印刷を行ない厚膜抵抗体を形
成してもスキージの移動方向に対して抵抗体の膜厚を変
えることができる。Further, a pair of raised portions are provided in a direction perpendicular to the direction in which the pair of conductors are arranged, and sandwich the resistor forming position between the pair of conductors, and the squeegee is moved in a direction perpendicular to the direction in which the pair of conductors are arranged. Even if a thick film resistor is formed by screen printing, the film thickness of the resistor can be changed in the direction of movement of the squeegee.
（発明の効果）
以上、詳細に説明したように本発明によれば、抵抗体膜
厚を厚くしだい個所の側に隆起部を形成することにより
、−回の抵抗体印刷で、抵抗体の膜厚に差をつけること
ができ、又この隆起部はクロスオーバー用絶縁体を形成
する時の透電体や、多層導体形成時の導体を利用すれば
特別に工程を増やさずに形成できるのでノ・イブリッド
ＩＣ用基板のトリミング抵抗体に適用可能である。(Effects of the Invention) As described in detail above, according to the present invention, by forming a protrusion on the side of a portion as the thickness of the resistor film becomes thicker, the resistor film can be formed by - times of resistor printing. It is possible to make a difference in thickness, and this raised part can be formed without increasing the number of steps by using a conductor when forming a crossover insulator or a conductor when forming a multilayer conductor. - Applicable to trimming resistors of hybrid IC substrates.
第１図（、）は本発明の一実施例を説明するための平面
図、第１図（ｂ）は第１図（、）のＡ −Ａ’断面図、
第２図は従来の厚膜抵抗体の平面図。
１・・・セラミ、り基板、２・・・導体、３・・・隆起
部、４・・・抵抗体、５・・・抵抗厚付は範囲、６・・
・抵抗体印刷方向、７・・・トリミング加工部。
特許出願人 沖電気工業株式会社
（Ｑ）
＋１））
ツヤ（発明。−プ（方１ヒイ列。↓ヌー日月 ［ゴ第１
図FIG. 1(,) is a plan view for explaining one embodiment of the present invention, FIG. 1(b) is a sectional view taken along line A-A' in FIG. 1(,),
FIG. 2 is a plan view of a conventional thick film resistor. 1... Ceramic substrate, 2... Conductor, 3... Protrusion, 4... Resistor, 5... Resistor thickness range, 6...
- Resistor printing direction, 7...Trimming processing section. Patent applicant: Oki Electric Industry Co., Ltd. (Q)
figure
Claims (1)
板上に抵抗体を形成する厚膜抵抗体の製造方法において
、 前記スキージの移動方向に平行に且つ前記抵抗体の厚付
け部形成位置をはさむ如く一対の隆起部を前記基板上に
、設け、 前記スキージを移動させながらスクリーン印刷を行なう
際、前記スキージの移動経路の一部において前記スキー
ジを前記一対の隆起部上を通過させることにより、薄付
け部及び厚付け部を有する抵抗体を形成するようにした
ことを特徴とする厚膜抵抗体の製造方法。[Scope of Claims] A method for manufacturing a thick film resistor in which a resistor is formed on a substrate by screen printing performed by moving a squeegee, comprising: forming a thickened portion of the resistor parallel to the moving direction of the squeegee; A pair of raised parts are provided on the substrate so as to sandwich the squeegee, and when performing screen printing while moving the squeegee, the squeegee is passed over the pair of raised parts in a part of the movement path of the squeegee. A method for manufacturing a thick film resistor, characterized in that a resistor having a thinned part and a thickened part is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61109674A JPS62266806A (en) | 1986-05-15 | 1986-05-15 | Manufacture of thick film resistance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61109674A JPS62266806A (en) | 1986-05-15 | 1986-05-15 | Manufacture of thick film resistance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62266806A true JPS62266806A (en) | 1987-11-19 |
Family
ID=14516300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61109674A Pending JPS62266806A (en) | 1986-05-15 | 1986-05-15 | Manufacture of thick film resistance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62266806A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59112601A (en) * | 1982-12-17 | 1984-06-29 | 富士通株式会社 | Thick film resistor printing method |
| JPS59229851A (en) * | 1983-05-16 | 1984-12-24 | Hitachi Chem Co Ltd | Thick film printed resistor |
-
1986
- 1986-05-15 JP JP61109674A patent/JPS62266806A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59112601A (en) * | 1982-12-17 | 1984-06-29 | 富士通株式会社 | Thick film resistor printing method |
| JPS59229851A (en) * | 1983-05-16 | 1984-12-24 | Hitachi Chem Co Ltd | Thick film printed resistor |
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