JPS62262824A - Manufacture of liquid crystal cell - Google Patents

Manufacture of liquid crystal cell

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Publication number
JPS62262824A
JPS62262824A JP10694586A JP10694586A JPS62262824A JP S62262824 A JPS62262824 A JP S62262824A JP 10694586 A JP10694586 A JP 10694586A JP 10694586 A JP10694586 A JP 10694586A JP S62262824 A JPS62262824 A JP S62262824A
Authority
JP
Japan
Prior art keywords
substrate
liquid crystal
electrode
crystal cell
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10694586A
Other languages
Japanese (ja)
Inventor
Tamahiko Nishiki
玲彦 西木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP10694586A priority Critical patent/JPS62262824A/en
Publication of JPS62262824A publication Critical patent/JPS62262824A/en
Pending legal-status Critical Current

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  • Liquid Crystal (AREA)

Abstract

PURPOSE:To obtain the same effect as the case obtained by a multi-chamfered substrate, without executing a manufacture of a liquid crystal cell by the multi-chamfered substrate, by straightening the warp and waviness of substrate, which deteriorate the uniformity of a substrate interval, by pressure, and equalizing the substrate interval. CONSTITUTION:On the first electrode substrate 11, a transparent electrode is formed as an opposed electrode, and thereafter, an orientation processing is executed, and thereafter, a spacer 15 is scattered on the whole surface of a liquid crystal cell, and subsequently, a sealing agent 17 is provided by screen printing on an area being near the center side from the peripheral part of the opposed electrode substrate 11. On the other hand, on the second electrode substrate 13, a TFT being a driving element is formed in every picture element, and thereafter, an orientation processing is performed. Subsequently, the first electrode substrate 11 and the second electrode substrate 13 are stuck by the sealing agent 17, and the sealing agent 17 is heated and hardened under pressure. In such a case, a distortion caused by pressure is concentrated to the peripheral part of the substrate 11 and 13 of the outside peripheral part of the sealing agent 17. Therefore, the peripheral part of the outside from the sealing agent of the substrate 11 is eliminated by removing an area (a) to which the distortion of the peripheral part is concentrated, for instance, by a scriber 21.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明は液晶セルの製造方法、特に液晶セルをより均
一・な基板間隔(セル間隔)で製造するための方法に関
する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a liquid crystal cell, and more particularly to a method for manufacturing a liquid crystal cell with more uniform substrate spacing (cell spacing).

(従来の技術) 従来より、透明電極を具えた、第一及び第二電極基板を
シール剤を用いて対向配置させた構造の液晶セルを製造
するに当り、液晶セルの多面取り基板を用いて複数個の
液晶セルを同時に製造し、よって液晶セルの量産化を図
ることが行なわれている(例えば特開昭57−1155
21号公報に開示される方法)。
(Prior Art) Conventionally, when manufacturing a liquid crystal cell having a structure in which first and second electrode substrates each having a transparent electrode are arranged facing each other using a sealant, a multi-sided substrate of the liquid crystal cell is used. Attempts are being made to manufacture a plurality of liquid crystal cells at the same time, thereby mass producing liquid crystal cells (for example, Japanese Patent Laid-Open No. 57-1155
(method disclosed in Publication No. 21).

多面取り基板による従来の液晶セルの製造方法では、液
晶セル毎に関連させて設けた透明電極を具える2枚の基
板をスペーサを介して互いに離間させて対向配置させる
と共に、これら基板間に介在させたシール剤によって貼
り合せる。その結果シール剤及び基板で画成された複数
の領域がそれぞれ液晶セルの液晶封入領域となる。その
後、基板に圧力を負荷して基板の反りやうねりを矯正し
た状態でシール剤を硬化させ、次いで液晶封入領域に液
晶を注入して封止する。その後、基板を分断することに
よって個別に分割された液晶セルを得る。
In the conventional manufacturing method of liquid crystal cells using multi-panel substrates, two substrates each having a transparent electrode provided in association with each liquid crystal cell are placed facing each other with a spacer interposed therebetween, and an intervening method is employed between these substrates. Attach them using a pre-mixed sealant. As a result, each of the plurality of regions defined by the sealant and the substrate becomes a liquid crystal filled region of the liquid crystal cell. Thereafter, pressure is applied to the substrate to correct the warpage and waviness of the substrate, and the sealant is cured, and then liquid crystal is injected into the liquid crystal filling area to seal it. Thereafter, by dividing the substrate, individually divided liquid crystal cells are obtained.

パネル毎に液晶セルを個別形成するに当り、使用する基
板の反りやうねりは液晶セルの表示特性を犬きく左右す
る基板間隔の均一性を損なうものであるが、このような
多面取り基板による液晶セルの製造方法は生産効率の、
高効率化をもたらすのみならず基板の反りやうねりの影
響を抑えて基板間隔の均一性を得るためにも好適な方法
であることが経験的に知られている。
When forming liquid crystal cells individually for each panel, warping or waviness of the substrate used impairs the uniformity of the spacing between the substrates, which greatly affects the display characteristics of the liquid crystal cell. The cell manufacturing method improves production efficiency,
It has been empirically known that this method is suitable not only for improving efficiency but also for suppressing the effects of warpage and waviness of the substrates and achieving uniform substrate spacing.

(発明が解決しようとする問題点) しかしながら、例えばアクティブマトリクス方式の液晶
セルを640X400ドツト程度の表示面積を有するパ
ネルとして作成する場合、現在のところ製造プロセス上
の制約から液晶セルの多面取りを行なえる程度の大きさ
の基板を液晶セル形成用基板として用いることが出来ず
、これがためパネル毎に個々の基板に液晶セルを作り込
むことが行なわれている。これがため、T P T (
ThinFilm Transistor)或はM I
 M (j!etal−1nsulator−牲eta
l DiOde)その他の駆動素子から成る駆動素子ア
レイを個々の基板に形成すると、その形成に起因して基
板の反りやうねりが生じ、これら反りやうねりによって
セル間隔の均一性が損なわれるという問題点があった。
(Problems to be Solved by the Invention) However, for example, when manufacturing an active matrix type liquid crystal cell as a panel with a display area of about 640 x 400 dots, it is currently not possible to make multiple sides of the liquid crystal cell due to manufacturing process constraints. It is not possible to use a substrate of this size as a substrate for forming a liquid crystal cell, and therefore liquid crystal cells are formed on individual substrates for each panel. For this reason, T P T (
ThinFilm Transistor) or M I
M (j! etal-1nsulator- sacrifice eta
When a drive element array consisting of other drive elements is formed on an individual substrate, the substrate warps and undulates due to the formation, and these warps and undulations impair the uniformity of cell spacing. was there.

この発明の目的は上述した従来の問題点を解決し、液晶
セルの多面取り基板による製造方法を適用出来ない場合
に、例えば駆動素子アレイを形成した事により、反りや
うねりの発生した基板を用いても従来と同等の基板間隔
の均一性が得られる優れた液晶セルの製造方法を提供す
ることにある。
The purpose of the present invention is to solve the above-mentioned conventional problems, and to use a substrate that is warped or undulated due to the formation of a driving element array, for example, in cases where it is not possible to apply the manufacturing method using multi-sided substrates for liquid crystal cells. It is an object of the present invention to provide an excellent method for manufacturing a liquid crystal cell that can obtain uniformity of substrate spacing equivalent to that of the conventional method.

(問題点を解決するための手段) この目的の達成を図るため、この発明の液晶セルの製造
方法によれば、第一及び第二電極基板の双方又はいずれ
か一方の周辺部の領域より中心側の領域でシール剤を用
いて第一及び第二電極基板を貼り合せる工程と、このシ
ール剤を硬化させる工程と、このシール剤の硬化後加圧
を解除した後シール剤の外周部の第一及び第一電極基板
の双方又はいずれか一方の周辺部の領域の少なくとも一
部分を切除する工程とを含む。
(Means for Solving the Problems) In order to achieve this object, according to the method for manufacturing a liquid crystal cell of the present invention, the central area of both or one of the first and second electrode substrates is A process of bonding the first and second electrode substrates using a sealant in the side area, a process of curing this sealant, and a process of releasing the pressure after the sealant hardens, and removing at least a portion of a peripheral region of both or either one of the first electrode substrate and the first electrode substrate.

この場合、例えば基板を、シール剤を設ける位置よりも
外側に10mm程度以上広がった周辺領域を有する基板
とするのが好適である。
In this case, for example, it is preferable that the substrate has a peripheral area that extends outward by about 10 mm or more from the position where the sealant is provided.

(作用) このような液晶セルの製造方法によれば、パネル毎に個
々の基板に液晶セルを作り込む場合であっても、基板間
隔の均一性を損なう基板の反りやうねりを加圧により矯
正し、基板間隔の均一化を図ることが出来る。
(Function) According to this method of manufacturing liquid crystal cells, even when liquid crystal cells are fabricated on individual substrates for each panel, warping and waviness of the substrates that impair the uniformity of the substrate spacing can be corrected by applying pressure. However, the spacing between the substrates can be made uniform.

(実施例) 以下、図を参照してこの発明の一実施例につき説明する
。尚、この図はこの発明が理解出来る程度に概略的に示
しであるにすぎず、従って各構成成分の寸法、形状及び
配置関係は図示例に限定されるものではない。
(Example) Hereinafter, an example of the present invention will be described with reference to the drawings. It should be noted that this figure is merely a schematic representation to the extent that the present invention can be understood, and therefore, the dimensions, shapes, and arrangement relationships of each component are not limited to the illustrated example.

第1図(A)〜(C)は、実施例の説明に供する製造工
程図であり、以下この発明をアクティブマトリクス方式
の液晶セルの製造方法に適用した場合につき説明する。
FIGS. 1(A) to 1(C) are manufacturing process diagrams for explaining embodiments, and the present invention will be described below in the case where it is applied to a method for manufacturing an active matrix type liquid crystal cell.

第1図(A)において11は第−電極基板及び13は第
二電極基板を示しており、この実施例ではこれら電極基
板11及び13は同一の大きさを有する。
In FIG. 1(A), 11 indicates a first electrode substrate and 13 indicates a second electrode substrate, and in this embodiment, these electrode substrates 11 and 13 have the same size.

第一電極基板11上には、対向電極として透明電極を形
成した後配向処理を行ない、その後液晶セルの全面にス
ペーサを散布する。次い饗対向電極基板11の周辺部よ
り中心側に寄った領域、例えば基板の寸法その他の条件
により異なるが例えば10mm程度以上中心側に寄った
領域にシール剤17をスクリーン印刷によって設ける。
After forming a transparent electrode as a counter electrode on the first electrode substrate 11, an alignment treatment is performed, and then spacers are scattered over the entire surface of the liquid crystal cell. Next, a sealant 17 is provided by screen printing on a region of the counter electrode substrate 11 that is closer to the center than the periphery, for example, a region that is about 10 mm or more closer to the center, although this varies depending on the dimensions of the substrate and other conditions.

一方、第二電極基板13上には、画素電極及びこの画素
電極と接続する駆動素子としてのTPTを、各画素毎に
形成した後配向処理を行なう。このとき基板13七に形
成されたTPTは駆動素子アレイを構成する。また、電
極取り出しのために基板間導通用の例えば銀糸接着剤1
8をスクリーン印刷で基板13上の所定位置に設ける。
On the other hand, on the second electrode substrate 13, a pixel electrode and a TPT as a driving element connected to the pixel electrode are formed for each pixel, and then an alignment process is performed. At this time, the TPTs formed on the substrate 137 constitute a driving element array. In addition, for example, a silver thread adhesive 1 for conduction between the boards is used to take out the electrodes.
8 is provided at a predetermined position on the substrate 13 by screen printing.

次に、第1図(B)に示すように第一電極基板11及び
第二電極基板13をそれぞれの電極形成面が向い合う状
態でスペーサを介して対向配置すると共に、これら基板
間に介在させたシール剤17によって貼り合せる。この
結果シール剤17と、基板11及び13とによって画成
された空間領域が液晶封入領域となる。その後、例えば
100g/cm7の加圧丁でシール剤17を刀]1然し
て硬化させる。
Next, as shown in FIG. 1(B), the first electrode substrate 11 and the second electrode substrate 13 are arranged facing each other with the electrode forming surfaces facing each other with a spacer interposed therebetween, and the electrode substrates 13 are interposed between these substrates. They are bonded together using a sealant 17. As a result, the spatial region defined by the sealant 17 and the substrates 11 and 13 becomes a liquid crystal filled region. Thereafter, the sealant 17 is cured by pressing with a pressure knife of 100 g/cm7, for example.

この時、第一電極基板11及び第二電極基板13の基板
間隔はスペーサ15によって−・定間隔に保持されてい
るが、液晶セルとしての基板間隔の均一性を得るために
行なった加圧によるひずみがシール剤17の外周部の基
板11及び13の周辺部に集中している。
At this time, the distance between the first electrode substrate 11 and the second electrode substrate 13 is maintained at a constant distance by the spacer 15, but due to the pressure applied to obtain uniformity of the distance between the substrates as a liquid crystal cell. The strain is concentrated around the outer periphery of the sealant 17 and around the substrates 11 and 13.

よって、シール剤17の硬化後加圧を解除した後シール
剤17の外周部の基板11の周辺部のひずみが集中する
領域(以ド、この領域を切除領域として図中符号aを付
して示す)を例えばスクライバ−21で切除して、基板
11のシール剤より外側の周辺部を除去する。
Therefore, after the pressure is released after the sealant 17 has hardened, the area around the substrate 11 on the outer periphery of the sealant 17 where strain is concentrated (hereinafter, this area is referred to as the ablation area and is designated by reference numeral a in the figure). ) is cut out using, for example, a scriber 21 to remove the peripheral portion of the substrate 11 outside the sealant.

この結果、第1図(C)に示すように第一電極基板11
の周辺部が切除された液晶セルを得る。
As a result, as shown in FIG. 1(C), the first electrode substrate 11
A liquid crystal cell is obtained in which the peripheral portion of the cell is removed.

基板11の切除領域aの切除によって基板間隔を狂わせ
るような新たなひずみを基板に生ずることはなく、最終
的に得られた基板間隔は、予め設定した基板間隔(設定
値)±0.2gmの範囲内の基板間隔を得ることが出来
た。実用上TN方式、GH方式の液晶セルでは最終的に
得られた基板間隔が設足値士(0,2〜0.3)gmの
範囲内に保たれていることが要求されるが、この実施例
で最終的に得た基板間隔は実用り良好な表示特性を得ら
れる基板間隔であった。
The removal of the cut region a of the substrate 11 does not cause any new strain on the substrate that would disturb the substrate spacing, and the final substrate spacing is within the preset substrate spacing (setting value) ±0.2 gm. We were able to obtain the substrate spacing within the range. Practically, in TN mode and GH mode liquid crystal cells, it is required that the final substrate spacing is kept within the range of 0.2 to 0.3 gm. The substrate spacing finally obtained in the example was a substrate spacing that could provide good display characteristics for practical use.

1−述した実施例では電極基板11及び13の矯正のた
めの加圧によって第一電極基板11の周辺部に集中した
基板11のひずみを除去したが、さらにこれと共にシー
ル剤17の外周部で第二電極基板13の周辺部のひずみ
が集中する領域(この領域を切除領域として図中符号す
を付して示す)をも切除すればより基板間隔の均一・化
を図ることが出来、さらに好適である。この発明の実施
に当ってはシール剤の外周部の第一電極基板の周辺部の
みを切除しても良いし、シール剤の外周部の第二電極基
板の周辺部のみを切除しても良いし、或は第一及び第二
電極基板の双方の周辺部を切除しても良い。
1- In the embodiment described above, the strain on the substrate 11 concentrated at the periphery of the first electrode substrate 11 was removed by pressurizing the electrode substrates 11 and 13 for straightening. If the area around the second electrode substrate 13 where strain is concentrated (this area is indicated with a reference numeral in the figure as the ablation area) is also removed, the spacing between the substrates can be made more uniform. suitable. In carrying out this invention, only the peripheral part of the first electrode substrate on the outer periphery of the sealant may be removed, or only the peripheral part of the second electrode substrate on the outer periphery of the sealant may be removed. Alternatively, the peripheral portions of both the first and second electrode substrates may be removed.

また、−L述した実施例では第−電極基板及び第二電極
基板を同一・の大きさとしたが、これら基板の大きさは
互いに異なる大きさとしても良い。さらに、基板の切除
領域としてシール剤よりも外側に広がった基板の周辺領
域は、第一電極基板のみに、或は第二電極基板のみに、
或は第一及び第二電極基板の双方に設けるようにして良
い。
Further, in the embodiment described above, the -L electrode substrate and the second electrode substrate are of the same size, but the sizes of these substrates may be different from each other. Furthermore, the peripheral area of the substrate that extends outside the sealant as the cut area of the substrate is applied only to the first electrode substrate, or only to the second electrode substrate.
Alternatively, it may be provided on both the first and second electrode substrates.

また、シール剤外周部の第一・及び第二電極基板の双方
又はいずれか一方の周辺部を切除するに当っては、この
周辺部の全部を切除しても良いし或は一部分を切除して
も良い。
In addition, when removing the peripheral portion of both or one of the first and second electrode substrates on the outer periphery of the sealant, the peripheral portion may be removed in its entirety or in part. It's okay.

切除領域a或はbは、基板の大きさ、厚みその他の条件
によっても異なるが、例えば基板の大きさを−・辺の長
さ100mmX 100mmの矩形基板とし、基板厚み
を1.1mmとしたガラス基板を第一及び第二電極基板
として用いた場合、基板端よりシール剤まで少なくとも
10mm程度以上を確保するようにすると良い。
The ablation area a or b varies depending on the size, thickness, and other conditions of the substrate, but for example, the size of the substrate is a rectangular substrate with a side length of 100 mm x 100 mm, and a glass substrate with a thickness of 1.1 mm. When the substrate is used as the first and second electrode substrates, it is preferable to ensure at least about 10 mm or more from the edge of the substrate to the sealant.

(発明の効果) に述した説明から明らかなように、この発明の液晶セル
の製造方法によれば、パネル毎に個々の基板に液晶セル
を作り込む場合であっても、基板間隔の均・性を損なう
基板の反りやうねりを加圧により矯正し、基板間隔の均
一・化を図ることが出来る。この結果、多面取り基板に
よる液晶セルの製造を行なわくでも、多面取り基板によ
る場合と同様の効果が得られる。
(Effects of the Invention) As is clear from the explanation given above, according to the method for manufacturing a liquid crystal cell of the present invention, even when manufacturing liquid crystal cells on individual substrates for each panel, it is possible to maintain uniformity of the substrate spacing. By applying pressure, it is possible to correct the warpage and waviness of the substrate that impairs its properties, and to make the spacing between the substrates uniform. As a result, even if a liquid crystal cell is not manufactured using a multi-panel substrate, the same effects as those obtained using a multi-panel substrate can be obtained.

この発明は、アクティブマトリクス方式の液晶セルの製
造に適用して特に好適である。
The present invention is particularly suitable for application to the manufacture of active matrix liquid crystal cells.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(A)〜(C)は、この発[J]の一実施例の説
明に供するための製造り程図である。 11・・・第・電極基板、 13・・・第二電極基板1
5・・・スペーサ、    17・・・シール剤19・
・・銀糸接着剤、  21・・・スクライバ−0特許出
願人   沖電気丁業株式会社 Il:第−電島峯程 13:第二ノCネ)基才及 I5.ズく−サ 貧施砂1つ説明 第1 17:シーlL、Tl 1q:侭系措省副 2fニスクライノ〈− ・。イ幻り策汝将氾 図
FIGS. 1(A) to 1(C) are manufacturing process diagrams for explaining one embodiment of this invention [J]. 11... 1st electrode substrate, 13... 2nd electrode substrate 1
5...Spacer, 17...Sealant 19.
...Silver thread adhesive, 21...Scriver-0 Patent Applicant Oki Electric Co., Ltd. Il: No. 1-Denjima Mine Process 13: No. 2 C Ne) Basics and I5. Zuku-sa poor sand application 1st explanation 1st 17: Sea lL, Tl 1q: Vice-ministerial deputy 2f Niskraino〈-・. Illusionary Plan Thy General Flood Map

Claims (1)

【特許請求の範囲】[Claims] (1)第一電極基板と第二電極基板とをシール剤を用い
て対向配置させた構造の液晶セルを製造するに当り、 前記第一及び第二電極基板の双方又はいずれか一方の周
辺部の領域より中心側の領域でシール剤を用いて前記第
一及び第二電極基板を貼り合せる工程と、 該シール剤を加圧下で硬化させる工程と、 該シール剤の硬化後加圧を解除した後該シール剤の外周
部の第一及び第二電極基板の双方又はいずれか一方の前
記周辺部の領域の少なくとも一部分を切除する工程と を含むことを特徴とする液晶セルの製造方法。
(1) When manufacturing a liquid crystal cell having a structure in which a first electrode substrate and a second electrode substrate are arranged facing each other using a sealant, the peripheral portion of both or one of the first and second electrode substrates. a step of bonding the first and second electrode substrates using a sealant in a region closer to the center than the region; a step of curing the sealant under pressure; and a step of releasing the pressure after the sealant has hardened. A method for manufacturing a liquid crystal cell, the method comprising: cutting off at least a portion of the peripheral region of both or one of the first and second electrode substrates on the outer peripheral portion of the sealant.
JP10694586A 1986-05-10 1986-05-10 Manufacture of liquid crystal cell Pending JPS62262824A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10694586A JPS62262824A (en) 1986-05-10 1986-05-10 Manufacture of liquid crystal cell

Applications Claiming Priority (1)

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JP10694586A JPS62262824A (en) 1986-05-10 1986-05-10 Manufacture of liquid crystal cell

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JPS62262824A true JPS62262824A (en) 1987-11-14

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JP10694586A Pending JPS62262824A (en) 1986-05-10 1986-05-10 Manufacture of liquid crystal cell

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276026A (en) * 1987-05-07 1988-11-14 Matsushita Electric Ind Co Ltd Production of liquid crystal display panel
JPH0545660A (en) * 1991-08-16 1993-02-26 Internatl Business Mach Corp <Ibm> Manufacture of liquid-crystal display unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5573020A (en) * 1978-11-29 1980-06-02 Hitachi Ltd Production of liquid crystal display device
JPS59202434A (en) * 1983-04-30 1984-11-16 Sharp Corp Manufacture of liquid crystal display element
JPS60111223A (en) * 1983-11-22 1985-06-17 Toshiba Corp Manufacture of liquid crystal display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5573020A (en) * 1978-11-29 1980-06-02 Hitachi Ltd Production of liquid crystal display device
JPS59202434A (en) * 1983-04-30 1984-11-16 Sharp Corp Manufacture of liquid crystal display element
JPS60111223A (en) * 1983-11-22 1985-06-17 Toshiba Corp Manufacture of liquid crystal display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276026A (en) * 1987-05-07 1988-11-14 Matsushita Electric Ind Co Ltd Production of liquid crystal display panel
JPH0545660A (en) * 1991-08-16 1993-02-26 Internatl Business Mach Corp <Ibm> Manufacture of liquid-crystal display unit

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