JPH09311323A - Liquid crystal cell cutting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To properly cut off liquid crystal cells without generating a breaking and an oblique crack in glass substrates by marring a scribe scratch on the surface of a side in which transparent electrodes are formed of two sheets of glass substrates, forming half-cuts at positions corresponding to the scribe scratch of the outside surfaces of an assembly and applying a load on them. SOLUTION: A scribe scratch 11 is marred on the surface of the side in which transparent electrodes 3, 4 are formed at the cut scheduled position of the glass substrate 1 of one side by using a scriber in a scribing process 103. Continuously, an assembly 16 is formed by opposing two sheets of glass substrates 1, 2 in an assembling process 104. Half-cuts 17, 18 are formed at positions corresponding above and below the scribe scratch 11 on the outside surfaces of the upper and lower glass substrates 1, 2 in the assembly 16 in a half-cutting process 105. Thereafter, in a breaking process 106, the load of the vertical direction is applied to reaming parts of the glass substrates 1, 2 by pressing a pressing body 19 onto the parts from the upward to cut off the upper and lower glass substrate 1, 2 simultaneously.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention When manufacturing a liquid crystal panel, the present invention is more than one assembly in which two glass substrates are bonded together through a frame mold so as to form an internal space for liquid crystal injection. A method of cutting a liquid crystal cell.

[0002]

2. Description of the Related Art FIG. 7 shows a conventional liquid crystal cell manufacturing method. First, in the electrode patterning process of step 701, the upper and lower sides of 1.1 mm or less such as 0.7 mm and 0.55 mm in thickness are formed. After forming a plurality of transparent electrodes 33, 34, 35 and 36 in a predetermined array on one surface of the two glass substrates 31 and 32 to be the side, a transparent electrode 33 to 36 of the transparent electrodes 33 to 36 is formed in the alignment treatment process of step 702. Alignment films 37, 38, 39, 4 so that liquid crystal molecules can be regularly arranged on the surface.
0 is formed by printing.

Next, in the assembling process of step 703, the two glass substrates 31 and 32 produced through steps 701 to 702 are spaced at a predetermined interval of about 10 microns so that the transparent electrodes 33 to 36 are inside. A plurality of inner spaces 4 for injecting liquid crystal are formed by adhering the transparent electrodes 33 to 36 facing each other and surrounding them with a plurality of frame dies 41 and 42.
Form an assembly 45 having 3,44.

Then, in the scribing / breaking step of step 704, a plurality of liquid crystal cells 4 are assembled from one assembly 45.
After cutting 6, 67, liquid crystals 48, 49 are filled in the internal spaces 43, 44 through the injection port (not shown) formed in the frame molds 41, 42 of the liquid crystal cells 46, 47 in the liquid crystal injection process of step 705.
Is injected to seal the injection port.

FIG. 8 shows, for example, one assembly 45 to a plurality of liquid crystal cells 46, 4 disclosed in Japanese Patent Laid-Open No. 3-2720.
7 is a method for cutting, and first, in step 801, the lower glass substrate 3 is cut at the planned cutting position between the frame dies 41 and 42.
Put a scribe scratch 50 on the outer surface of 2.

Subsequently, in step 802, the flexible pressurizing body 51 is pressed against the upper glass substrate 31 to concentrate stress on the scribe scratches 50 and cut the lower glass substrate 32.

Next, in step 803, the assembly 45 is turned upside down and a scribe scratch 52 is formed on the outer surface of the lower glass substrate 31 which has been the upper side until now.

After that, in step 804, the pressing body 51 is pressed against the upper glass substrate 32 which has been the lower side until now, whereby stress is concentrated on the scribe scratches 52 and the lower glass substrate 31 is cut. In this way, the two glass substrates 31 and 32 are cut one by one.

[0009]

However, the glass substrate 3
When a thick glass substrate having a thickness of about 2 mm or more is used as 1, 32, in the conventional cutting method, as shown in FIG.
A breakage 53 occurs in the glass substrate 31 or 32 on the side where 1 is pressed, or an oblique crack 54 occurs in the glass substrate 31 or 32 on the cutting side as shown in FIG.

It should be noted that in steps 704 and 705 of FIGS. 7A and 7B and FIGS.
Also, the alignment films 37 to 40 are omitted.

Therefore, the present invention is intended to provide a method capable of properly cutting a plurality of liquid crystal cells from a single assembly having an internal space for injecting liquid crystal between two glass substrates. .

[0012]

According to claim 1, 2
A plurality of transparent electrodes are formed in a predetermined arrangement on one surface of each of the glass substrates, and an alignment film is formed on the surfaces of these transparent electrodes so that the liquid crystal molecules are regularly arranged. At the planned cutting position, scribe scratches are made on the surface of one or both of the two glass substrates on which the transparent electrodes are formed, and these glass substrates are spaced at predetermined intervals so as to form an internal space for liquid crystal injection. To form an assembly in which the transparent electrodes are opposed to each other so as to face the inside and are bonded to each other through a plurality of frame dies having a shape surrounding the transparent electrodes, and outer surfaces of two glass substrates in the assembly. A half cut is formed at a position corresponding to the scribe scratches, and a vertical load is applied to the remaining portion of the glass substrate due to the half cuts and the scribe scratches. According to the method of claim 1, a plurality of liquid crystal cells having an internal space for injecting liquid crystal are cut, and the remaining portion of the glass substrate due to scribe scratches on the inner surface and half cuts on the outer surface is removed. Since the apparent substrate thickness is reduced, by applying a vertical load to the remaining portion, it is possible to properly cut a plurality of liquid crystal cells from one assembly without causing breakage or oblique cracks in the glass substrate. it can.

Further, since the scribe scratches are formed before the assembly is formed and the half cuts are formed after the assembly is formed, it is possible to eliminate the disadvantage that the glass substrate is broken during the formation of the assembly.

According to the invention of claim 2, scribe scratches are formed on the surface of the two glass substrates according to claim 1 on the side where the plurality of transparent electrodes are formed, while the scribe scratches are generated. It is characterized in that half cuts are formed in different steps on the outer surfaces of the two glass substrates in the assembly at positions corresponding to the top and bottom.

According to the second aspect of the present invention, the cut portions are arranged in different steps like the electrode portions of a plurality of liquid crystal cells due to the scribe scratches and the half cuts provided in the two glass substrates in different steps. Even in this case, the two glass substrates can be cut with a small load.

According to the invention of claim 3, scribe scratches are provided on the surfaces of the two glass substrates according to claim 1 on the side where a plurality of transparent electrodes are formed so as to vertically oppose each other. The half-cuts are formed on the outer surfaces of the two glass substrates in the assembly so as to face each other in the vertical direction at positions corresponding to the scribe scratch and the vertical direction.

According to the method of claim 3, the two glass substrates can be cut at the same time by the scribe scratch and the half cut provided on the two glass substrates so as to face each other vertically. A plurality of liquid crystal cells can be efficiently obtained from one assembly.

According to a fourth aspect of the present invention, when forming the half-cut according to any of the first to third aspects, the depth of one cut is set so that the blade of the dicing saw does not bend or break. It is characterized in that the cutting depth is set to a predetermined value and the cutting at the cutting depth is repeated.

According to the method of claim 4, the cutting load per cutting is reduced by repeating the cutting at a cutting depth such that the blade of the dicing saw does not bend or break. The half cut can be appropriately formed on the outer surface of the glass substrate, and the service life of the blade of the dicing saw can be improved.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows the first embodiment. First, in the electrode patterning process of step 101, a plurality of transparent electrodes 3 and 4 are formed on one surface of each of the upper and lower two glass substrates 1 and 2. , 5, 6 are formed in a predetermined arrangement, alignment films 7, 8, 9, 10 are formed on the surfaces of the transparent electrodes 3 to 6 so that the molecules of the liquid crystal can be regularly arranged in the alignment treatment step of step 102. It is formed by printing.

Next, a scriber is used on the surface of the glass substrate 1 on the side where the transparent electrodes 3 and 4 are formed at the planned cutting positions between the transparent electrodes 3 and 4 of the one glass substrate 1 by the scribing process of step 103. Put the scribe scratch 11.

Subsequently, in the assembly process of step 104, the glass substrate 2 completed through the steps 101 to 102 is the lower side, and the glass substrate 1 completed through the steps 101 to 103 is the upper side. The substrates 1 and 2 are faced to each other so that the transparent electrodes 3 to 6 are on the inner side at a predetermined interval of about 10 microns, and the substrates 1 and 2 are bonded by a plurality of frame molds 12 and 13 having a shape surrounding the transparent electrodes 3 to 6. Thus, the assembly 16 having the internal spaces 14 and 15 for injecting the liquid crystal is formed.

Then, in the half-cutting process of step 105, the upper and lower glass substrates 1 and 2 in the assembly 16 are
Half cuts 17 and 18 are formed on the outer side surface of the above with a dicing saw at positions corresponding to the top and bottom of the scribe scratch 11.

In the case of this embodiment, the half cut 17,
The thickness a of the remaining portion of the glass substrates 1 and 2 due to No. 18 is 0.
It is formed to have a thickness of about 3 to 0.5 mm.

After that, in the break step of step 106, the pressing body 19 is pressed from above the half cut 11 of the glass substrate 1 having the scribe scratch 11 to leave the remaining portion of the glass substrate 1 due to the scribe scratch 11 and the half cut 17. A vertical load is applied to each of the remaining portions of the glass substrate 2 by the half-cut 18 to simultaneously cut the upper and lower glass substrates 1 and 2 so that one assembly 16 can be used as shown in step 107. A plurality of liquid crystal cells 2 that individually have internal spaces 14 and 15 for injecting liquid crystal
0 and 21 are formed separately.

Finally, in the liquid crystal injection step of step 108, the liquid crystals 22 and 2 are filled in the inner spaces 14 and 15 of the plurality of liquid crystal cells 20 and 21 through the injection openings (not shown) formed in the frame molds 12 and 13.
3 is injected and the injection port is sealed.

According to the method of this embodiment, even when the glass substrates 1 and 2 are thickened to about 2 mm or more, the assembly 1
The scribe scratches 11 provided on the inner surface of the upper glass substrate 1 of 6 and the half cuts 17 and 18 provided on the outer surfaces of the upper and lower glass substrates 1 and 2 are used to cut the glass substrates 1 and 2. The apparent thickness a can be reduced to prevent breakage, oblique cracking, or the like from occurring at the cut portion, and the assembly 16 can be cut appropriately into a plurality of liquid crystal cells 20 and 21. it can.

Even if the scribe scratches 11 are formed on the inner surface of the upper glass substrate 1 prior to the assembly process, the thickness of the upper and lower glass substrates 1 and 2 is reduced before the half cuts 17 and 18 are formed. Is thick, so glass substrate 1,
2 will not break.

FIG. 2 is a second embodiment showing a step in which cutting has a stepped structure. First, in step 201, the transparent electrodes 3 to 6 and the alignment films 7-1 of the upper and lower glass substrates 1 and 2 are formed.
After the scribe scratches 11 and 24 were staggered on the surface on which 0 was formed, the glass substrates 1 and 2 were attached to the transparent electrodes 3 respectively.
The inner spaces 14 and 15 for injecting the liquid crystal are formed by facing each other so that the inner surfaces of the inner surfaces of the inner surfaces of the inner surfaces of the inner surfaces 14 to 15 are bonded to each other with the frame molds 12 and 13.
Forming an assembly 16 having

Next, in step 202, the scribe scratch 1
Half cuts 17 and 18 are formed on the outer surface of the glass substrates 1 and 2 at positions corresponding to the upper and lower sides of the glass substrates 1 and 24.

Then, in step 203, the pressing body 19 is pressed against the upper glass substrate 1 at a position corresponding to the upper scribe scratch 11 so that the upper scribe scratch 11 is formed.
The stress is concentrated on and the upper glass substrate 1 is cut.

Further, in step 204, the assembly 16 is turned upside down, and the pressing body 19 is applied to the upper glass substrate 2 which has been the lower side at the position corresponding to the upper and lower scribe scratches 24 which have been the lower side until now. Is pressed to concentrate the stress on the upper side scribe scratches 24, which is the lower side until now, to cut the upper glass substrate 2, and as shown in step 205, a plurality of liquid crystal cells 20 are formed from one assembly 16. , 21 are formed separately.

According to the method of this embodiment, the scribe scratches 11 and 24 are provided on the inner surfaces of the upper and lower glass substrates 1 and 2 in different levels, and the scribe scratches 11 and 24 are located at the positions corresponding to the upper and lower sides. With the half cuts 17 and 18 provided on the outer surfaces of the glass substrates 1 and 2 in different steps, the thickness of the glass substrates 1 and 2 at the cut positions is made thin.
Since both can be cut with a small load, even if the cutting places are arranged in different steps like the electrode part and the glass substrates 1 and 2 are cut one by one, the load from the pressurizing body 19 It is possible to prevent breakage from occurring in the glass substrate 1 or 2 on the side that directly receives.

FIG. 3 shows a third embodiment in which the upper and lower glass substrates 1 and 2 are simultaneously cut. First, in step 301, the transparent electrodes 3 to 6 and the alignment film 7 of the glass substrates 1 and 2 are formed. Scribe scratches on the surface where 10 is formed 1
After inserting the glass substrates 1 and 24 so as to face each other vertically, the glass substrates 1 and 2 are faced so that the respective transparent electrodes 3 to 6 are inward and bonded by the frame molds 12 and 13 to thereby inject liquid crystal. To form an assembly 16 having interior spaces 14, 15.

Next, in step 302, half cuts 17 and 18 are formed on the outer surfaces of the glass substrates 1 and 2 at positions corresponding to the top and bottom of the scribe scratches 11 and 24, respectively.

Then, in step 303, the pressing body 19 is pressed from above the half cut 17 of the upper glass substrate 1 to cut the two glass substrates 1 and 2 at the same time. Liquid crystal cells 20, 21
Are formed separately.

According to the method of this embodiment, the scribe scratches 11 and 24 and the half cuts 17 and 18 are provided on the inner and outer surfaces of the upper and lower glass substrates 1 and 2 at positions vertically opposed to each other. Thus, when the cut points correspond to the upper and lower sides like the injection port, the two glass substrates 1 and 2 are
Can be disconnected at the same time.

FIG. 4 shows a fourth embodiment in which the cutting depth b is set once so that the blade 25a of the dicing saw 25 will not be bent or damaged. By repeatedly making the cuts, the two glass substrates 1 and 2 are half-cut 17 and 18 on the outer surfaces of the upper and lower glass substrates 1 and 2 of the assembly 16 bonded by the frame molds 12 and 13. Is formed, and the apparent thickness a of the glass substrates 1 and 2 at the cut portion is formed thin.

In the case of this embodiment, the dicing saw 25
The blade 25a has a thickness t of about 300 μm, and the cutting depth b per cut is set to 0.5 to 0.8 mm.

First, in step 401, the first cut is made by the dicing saw 25 on the outer surface of the upper glass substrate 1 to form the half cut 17 at the cut depth b.

Then, in step 402, the first half-cut 17 is cut by the dicing saw 25 for the second time, and the half-cut 17 is formed so as to have a depth not more than twice the cutting depth b.

Further, in step 403, the second half cut 17 is cut by the dicing saw 25 for the third time, and the half cut 17 is formed to have a depth not more than 3 times the cut depth b.

By repeating such a plurality of cuts, a half cut 17 having a predetermined depth is formed on the outer surface of the upper glass substrate 1, and the apparent thickness a of the upper glass substrate 1 at the cut portion is formed. Is formed to be thin, for example, about 0.3 to 0.5 mm.

Next, in steps 404 to 406, the same dicing saw 25 as described above is repeatedly cut at the cutting depth b, so that the outer surface of the lower glass substrate 2 in the assembly 16 is also predetermined. A half cut 18 having a depth is formed, and an apparent thickness a of the glass substrate 2 below the cut portion is formed.
Is formed to be thin, for example, about 0.3 to 0.5 mm.

According to the method of this embodiment, even when the glass substrates 1 and 2 are thickened to about 2 mm or more, the blade 25a of the dicing saw 25 is bent or broken at the cutting depth b at one time. Not by repeatedly making a plurality of cuts set to a predetermined depth, the cut load per cut is reduced, and the half cuts 17 and 18 can be appropriately formed on the outer surfaces of the glass substrates 1 and 2. At the same time, the useful life of the blade 25a of the dicing saw 25 can be improved.

In the fourth embodiment, the assembly 16 in which the scribe scratches 11 are formed only on the upper glass substrate 1 has been illustrated and described, but the scribe scratches 11, 11 are formed on both the upper and lower glass substrates 1, 2. The same effect can be obtained by applying 24 when formed in a staggered manner, or when forming scribe scratches 11 and 24 on the upper and lower glass substrates 1 and 2 at corresponding positions in the vertical direction. .

FIG. 5 is a comparative example of the fourth embodiment, in which a dicing saw 28 having a new normal shape blade 28a shown in FIG. 6A is used on a rectangular glass substrate 26 having a side of 80 mm. In this case, the half cuts 27 are formed in parallel at a cutting depth of 1 mm or more.

In this comparative example, the half cut 27 was bent at the point A in the course of forming the tens of half cuts 27, and the half cut 27 could not be formed immediately after that.

At point A, the blade 28a of the dicing saw 28 is bent as shown in FIG. 6 (b), and the dicing saw 25 continues to rotate as it is, so that at point B, FIG. 6 (c). The blade 28a of the dicing saw 28 was damaged as shown in FIG.

According to this contrast, since the load is large when the cutting depth is 1 mm or more, it is the limit that about 20 to 30 half cuts 27 are formed on the rectangular glass substrate 26 having a side of 80 mm. .

Further, as in the fourth embodiment, one cutting depth is set to 0.5 to 0.8 mm, and three half cuttings are repeated for one half cut.
When half cuts were formed in parallel on a square glass substrate of mm, it was possible to form up to about 50 half cuts without bending or damage to the blade of the dicing saw.

It should be noted that steps 105 to 108 in FIG. 1, steps 202 to 205 in FIG. 2, and step 302 in FIG.
304 and 401 to 406 in FIG. 5, the electrodes 3 to 6 and the alignment films 7 to 10 are omitted for the sake of simplicity.

[0054]

As described above, according to the present invention, the following effects can be obtained.

According to claim 1, the remaining portion of the glass substrate has an apparent substrate thickness due to scribe scratches formed on the inner surface of one or both of the glass substrates and half cuts formed on the outer surfaces of both the glass substrates. Since it becomes smaller, by applying a vertical load to the remaining portion, it is possible to properly cut a plurality of liquid crystal cells from one assembly without causing breakage or oblique cracks in the glass substrate, and to improve the quality. And the reliability can be improved.

Further, since the scribe scratch is formed before the assembly is formed and the half cut is formed after the assembly is formed, it is possible to eliminate the inconvenience that the glass substrate is broken during the formation of the assembly.

According to the second aspect, even when the cut portions are arranged in different steps like the electrode parts of a plurality of liquid crystal cells due to the scribe scratches and the half cuts which are put in two glass substrates in different steps, It is possible to cut two glass substrates with a small load.

According to the third aspect, the two glass substrates can be cut at the same time by the scribe scratches and the half cuts which are put in the two glass substrates so as to face each other vertically, and thus one assembly can be obtained. More liquid crystal cells can be efficiently obtained.

According to the fourth aspect of the present invention, the cutting load per cutting is reduced by repeating the cutting at the cutting depth at which the blade of the dicing saw does not bend or break, thereby reducing the cutting load per cutting. It is possible to appropriately form a half cut on the outer side surface of the blade and improve the service life of the blade of the dicing saw.

[Brief description of drawings]

FIG. 1 is a process drawing schematically showing a first embodiment of the present invention.

FIG. 2 is a process drawing schematically showing a second embodiment of the present invention.

FIG. 3 is a process drawing schematically showing a third embodiment of the present invention.

FIG. 4 is a process drawing schematically showing a fourth embodiment of the present invention.

FIG. 5 is a schematic diagram showing contrast of the present invention.

FIG. 6 is a schematic diagram showing a change in form of a dicing saw used in contrast to the present invention.

FIG. 7 is a process drawing schematically showing a conventional liquid crystal cell manufacturing method.

FIG. 8 is a process diagram schematically showing a conventional method for cutting a liquid crystal cell.

FIG. 9 is a schematic view showing breakage during conventional cutting.

FIG. 10 is a schematic diagram showing a conventional oblique crack at the time of cutting.

[Explanation of symbols]

 1, glass substrate 3-6 transparent electrode 7-10 alignment film 11,24 scribe scratch 12,13 frame type 14,15 internal space 16 assembly 17,18 half cut 20,21 liquid crystal cell 25 dicing saw 25a blade

Claims (4)

[Claims] 1. A plurality of transparent electrodes are formed in a predetermined arrangement on one surface of each of two glass substrates, and an alignment film is formed on the surfaces of these transparent electrodes so that liquid crystal molecules are regularly arranged. Then, at the planned cutting position between the transparent electrodes, a scribe scratch is made on the surface of one or both of the two glass substrates on which the transparent electrodes are formed, and these glass substrates form an internal space for liquid crystal injection. The transparent electrodes are formed to face each other at a predetermined interval so as to be formed inside, and an assembly is formed by adhering the transparent electrodes via a plurality of frame dies surrounding the transparent electrodes. By forming a half cut on the outer surface of the glass substrate at a position corresponding to the scribe scratch, and applying a vertical load to the remaining portion of the glass substrate due to the half cut and the scribe scratch. A method for cutting a liquid crystal cell, comprising cutting a plurality of liquid crystal cells having an internal space for injecting liquid crystal from the assembly. 2. The scribe scratches are formed on the surface of the two glass substrates on the side where the plurality of transparent electrodes are formed, while the two glass plates in the assembly are located at positions corresponding to the scribe scratches and the upper and lower sides. 2. The method for cutting a liquid crystal cell according to claim 1, wherein half cuts are formed in steps on the outer surface of the substrate. 3. The scribe scratches are placed on the surfaces of the two glass substrates on which the plurality of transparent electrodes are formed so as to vertically oppose each other, and at the positions corresponding to the scribe scratches and the upper and lower sides of the assembly. 2. The method for cutting a liquid crystal cell according to claim 1, wherein half cuts are formed on the outer surfaces of the two glass substrates so as to face each other vertically. 4. When forming the half cut, one cutting depth is set to a depth at which the blade of the dicing saw does not bend or break, and the cutting is repeated at the cutting depth. The method for cutting a liquid crystal cell according to claim 1, wherein the method is performed.