JPS622586A - Substrate for supporting electronic device element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to printed wiring boards, and particularly to substrates for supporting electronic device elements.

2. Description of the Related Art Printed wiring boards are well-known as printed wiring boards, which have conductors formed on an insulating substrate for mounting electronic parts or electronic device elements or for connecting electronic circuits. On the other hand, DIL (Dual In Line
Insulating containers such as ackage) and metal can types such as TO-6 are already widely known.

Problems to be Solved by the Invention The above-mentioned conventional examples, however, have the following problems when considered as supporting substrates that also serve as housing for electronic device elements in general. That is, 1) A conventional printed wiring board is not originally configured as a support substrate that also serves as a housing for the above-mentioned elements. For example, the wiring board mentioned above usually has printed surfaces on both the front and back sides, but the main part of the back side has a highly conductive grounding film (e.g.
Copper foil) is formed through a printing process, and there is nothing in which the back surface functions as the bottom surface of a case that houses the device, and there is no disclosure of any elements that suggest such a structure or functionality. When the element is supported or mounted on the printed wiring board, the wiring board is usually held between an upper cover and a lower cover of a shield case made of a highly conductive material such as metal. At this time, lead pins for connecting the element to external devices and equipment penetrate the lower cover and are taken out below. However, the lead pins are arranged as follows. That is, the wiring board portion is simply penetrated from the front and back, and no highly conductive material is attached to the through hole or its periphery. This is done through a seal, which is expensive in terms of both materials and processes.

2) On the other hand, in conventional support substrates for electronic device elements such as DIL and TO-5, the electrical connection lines for taking out the operating circuit terminals of the elements to the outside are vertically or horizontally symmetrical in the case of DIL. For metal can type products such as To-S, they are uniformly extracted from the bottom surface, and in both cases, a special socket is used when installing it on an electronic circuit board. It is usual. The can package cage type is sometimes mounted on the board without using a socket, but whether it is circular or square, it is inevitable that a considerable gap will be created from the mounting surface to the bottom of the can package.

The present invention provides an electronic device element supporting substrate that solves the above problems.

Means for Solving the Problems In order to solve the above-mentioned problems, an electronic device element supporting substrate based on the present invention is provided with terminals of electronic device elements and other devices other than the above-mentioned devices on a flat printed wiring board. A through hole is formed for arranging a lead pin for connection with a terminal of a device or a device, and on the back side of the element mounting side, the entire surface of the through hole excluding the periphery of the hole for the active terminal, A highly conductive shielding film is adhered thereto so that it also serves as the bottom metal plate of the device element housing case.

Effect of the present invention With the above configuration, the lead pin as a conductive line for power supply and distribution for operating an electronic device is passed through a through hole from the bottom surface of a printed wiring board that also serves as the bottom plate of a case that houses the device. Since it is taken out as it is from below, it is possible to provide a substrate for mounting electronic device elements that is inexpensive in terms of both materials and processes since no members such as hermetic seals are used. Moreover, since the main part of the back surface of the wiring board is covered with a highly conductive film for grounding, the element housing case can be formed simply by using a metal top cover. Furthermore, since the lead pin placement through holes are formed on the printed wiring board, it is easy to align them with the insertion points on the external electronic circuit board in advance, and the wiring board mounting surface of the board and the wiring The gap between the plate and the bottom surface can be made sufficiently small. As a result of the above, the present invention provides a substrate for supporting external electronic device elements that is inexpensive and easy to attach to a circuit board.

EXAMPLES Hereinafter, the structure and operation of the electronic device element supporting substrate according to the present invention, as well as its advantages over the conventional example, will be explained in detail with reference to the drawings. FIG. 1 is a top view showing an example of the structure of an electronic device element supporting substrate according to the present invention, and FIG. 2 is a back view thereof. 1 represents a non-flexible flat board made of insulating resin such as paper phenolic resin or glass epoxy resin, and although its illustration is omitted in Fig. It is generally called a printed wiring board because the electrical circuit pattern made of a conductive film is formed by conventional printing techniques. 2 represented by a white circle corresponds to the active function of the electronic device element mounted on the above 1, and the through-hole metal for the operating terminal corresponds to the passive function. Each means a through hole for a ground terminal.

In FIG. 2, 2 and 3 are each shown with a prime (' mark) attached thereto. This prime means that it is the first through hole that penetrates the board in the thickness direction.
Although it is the same as the figure, check whether the high conductive grounding film shown in Figure 4 and its peripheral edge are in contact with each other and are short-circuited in terms of direct current. cannot be said to be completely the same. Naturally, 2', represented by a double circle, does not touch 4, and 3', represented by a double nine, does, on the contrary, touch 4. The 40 function is that it can have a shielding function because it is easily connected directly to the ground terminal. Therefore, for the electronic device elements mounted on the printed wiring board 1, the bottom plate of the element storage case can also be formed in cooperation with the metal top cover case.

Although the above is one example, the distance between the through holes is equal to the interval between lead pins of an integrated circuit element (hereinafter abbreviated as IG) (for example, 1! 10 inches or 1/2 degrees). It is also possible to Specifically, a configuration that satisfies the following formula in common to FIGS. 1 and 2 may be adopted. That is, 7!1 =:= ml di +++ ++・(1
) t Wj == nj dj...+ +++
('') However, in both formulas, m and n are natural numbers, d is the interval between the lead pins of the above IC, and the subscript 1.j is a number representing the address of the through hole.

Although the measured directions of W are orthogonal in FIG. 1, this relationship is not necessarily limited. With such a configuration, connection with an external IC or an IC mounting circuit board can be made smoothly. Furthermore, when an electronic device using such a board as a supporting board for its elements is mounted on an electronic circuit board, this can be easily done without using a dedicated socket, and there is no gap between the mounting surface and the circuit board. It is possible to adhere closely to the circuit board with almost no occurrence of any problems.

The material and shape of the electronic device element supporting substrate according to the present invention are not particularly limited as long as they are made of a non-flexible insulating resin and have a flat plate shape. Furthermore, although a rectangular flat plate is typically shown in FIGS. 1 and 2, the shape is not limited to a rectangle. It is not limited to a square or round shape like an IC package or a To-5 type metal container.

In addition to the effects of the invention, the present invention provides lead pin through-holes for connecting the operating terminals of electronic device elements and devices other than the above-mentioned elements in a printed wiring board, and active holes on the back side of the element mounting surface. Around the terminal hole! By having a highly conductive film coated on the entire surface except for 7, it has functions that conventional wiring boards did not have, and also solves the problems that conventional device element storage containers had. It is possible to provide an inexpensive electronic device element support substrate that facilitates mounting or mounting of the above-mentioned device on various electronic circuit boards and equipment.

[Brief explanation of the drawing]

FIG. 1 is a top view showing the main structure of an electronic device element supporting substrate according to the present invention, and FIG. 2 is a back view thereof. 1...Printed wiring board, 2, 2'...Through hole for operating terminal, 3.3'...Through hole for ground terminal, 4... Highly conductive film.

Claims (2)

[Claims] (1) On a flat printed wiring board, the lead pins for electrical connection between the operating circuit terminals of the electronic device elements supported on the wiring board and the operating terminals of other devices and equipment other than the above-mentioned devices are wired. A through hole is formed to be provided on the board, and on the back side of the side on which the element is supported or mounted among both sides of the wiring board, the area around the active terminal hole in the through hole is formed. A substrate for supporting an electronic device element has a structure in which a highly conductive film for shielding is adhered to the entire surface except for the substrate, so that the substrate can also serve as a bottom plate of the case for housing the device element. (2) The substrate for supporting an electronic device element according to claim (1), wherein the distance between the through holes in the axial direction perpendicular to each other is equal to the distance between external terminals of an electronic device such as an IC.