JPS622586A - Substrate for supporting electronic device element - Google Patents

Substrate for supporting electronic device element

Info

Publication number
JPS622586A
JPS622586A JP14084685A JP14084685A JPS622586A JP S622586 A JPS622586 A JP S622586A JP 14084685 A JP14084685 A JP 14084685A JP 14084685 A JP14084685 A JP 14084685A JP S622586 A JPS622586 A JP S622586A
Authority
JP
Japan
Prior art keywords
electronic device
substrate
wiring board
hole
device element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14084685A
Other languages
Japanese (ja)
Inventor
弘志 生島
上西 謙次
薫 志水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14084685A priority Critical patent/JPS622586A/en
Publication of JPS622586A publication Critical patent/JPS622586A/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、印刷配線板に関するものであり、特に、電子
デバイス素子支持用基板に係る。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to printed wiring boards, and particularly to substrates for supporting electronic device elements.

従来の技術 絶縁性基板上に、電子部品や電子デバイス素子を装着さ
せたり電子回路を接続するための、導体形成がなされて
いるものは印刷配線板として既に良く知られている。他
方、前記電子部品やデバイス素子の収納を兼ねた支持用
基板としては、DIL(Dual In Line P
ackage )等の絶縁性容器やTO−6等の金属製
缶タイプのもの等が既に広く知られている。
2. Description of the Related Art Printed wiring boards are well-known as printed wiring boards, which have conductors formed on an insulating substrate for mounting electronic parts or electronic device elements or for connecting electronic circuits. On the other hand, DIL (Dual In Line
Insulating containers such as ackage) and metal can types such as TO-6 are already widely known.

発明が解決しようとする問題点 上記従来例には、しかし、これらを電子デバイス素子一
般の収納を兼ねた支持用基板として考えた場合、次のよ
うな問題がある。即ち、1)従来の印刷配線板には、本
来、前記素子の収納を兼ねた支持用基板としての構成が
なされていない。例えば、上記配線板は通常表裏両面に
印刷面を持つが、裏面の主要部に接地用高導電膜(例:
銅箔)が印刷工程を経て形成され、前記素子を収納する
ケースの底面として、上記裏面が機能するものは全くな
く、かつそのような構造や機能性を教唆する要素も開示
されていない。上記印刷配線板上に前記素子が支持々い
し装着される場合、通常は、金属等の高導電性物質から
成るシールドケースの上蓋と下蓋とによって、前記配線
板が挾持される構造をとる。この際、前記素子と外部の
デバイスや機器との接続用リードピンは、前記下蓋を貫
通して、下方に取り出されていた。但し、前記リードピ
ンの配設は以下の如くなされる。即ち、前記配線板部分
は、単に表裏貫通されていて、貫通孔及びその周縁部に
は高導電性物質のものは一切装着されていす、かつ前記
下蓋から外部下方へ取り出されるには、ハーメチックシ
ールを介して行われており、材料、工程の両面から高価
なものとなる。
Problems to be Solved by the Invention The above-mentioned conventional examples, however, have the following problems when considered as supporting substrates that also serve as housing for electronic device elements in general. That is, 1) A conventional printed wiring board is not originally configured as a support substrate that also serves as a housing for the above-mentioned elements. For example, the wiring board mentioned above usually has printed surfaces on both the front and back sides, but the main part of the back side has a highly conductive grounding film (e.g.
Copper foil) is formed through a printing process, and there is nothing in which the back surface functions as the bottom surface of a case that houses the device, and there is no disclosure of any elements that suggest such a structure or functionality. When the element is supported or mounted on the printed wiring board, the wiring board is usually held between an upper cover and a lower cover of a shield case made of a highly conductive material such as metal. At this time, lead pins for connecting the element to external devices and equipment penetrate the lower cover and are taken out below. However, the lead pins are arranged as follows. That is, the wiring board portion is simply penetrated from the front and back, and no highly conductive material is attached to the through hole or its periphery. This is done through a seal, which is expensive in terms of both materials and processes.

2)一方、DILやTO−5等の従来からの電子デバイ
ス素子の支持用基板は、上記素子の動作回路端子を外部
へ取り出す為の電気的接続線が、DILの場合には上下
もしくは左右対称に一様に配設されてあり、To−s等
の金属缶タイプのものでは一様に底面から下方に抽き出
されてあり、いずれも電子回路基板に装着する際には専
用ソケットヲ使用するのが常である。缶パツケージ型で
は、時にソケットヲ用いずに前記基板に装着することも
あるが、円型であれ、角型であれ、取付面から前記缶パ
ッケージ底面迄相当の空隙を生じることは免れ得なかっ
た。
2) On the other hand, in conventional support substrates for electronic device elements such as DIL and TO-5, the electrical connection lines for taking out the operating circuit terminals of the elements to the outside are vertically or horizontally symmetrical in the case of DIL. For metal can type products such as To-S, they are uniformly extracted from the bottom surface, and in both cases, a special socket is used when installing it on an electronic circuit board. It is usual. The can package cage type is sometimes mounted on the board without using a socket, but whether it is circular or square, it is inevitable that a considerable gap will be created from the mounting surface to the bottom of the can package.

本発明は、上記問題点を解決した電子デバイス素子支持
用基板を提供するものである。
The present invention provides an electronic device element supporting substrate that solves the above problems.

問題点を解決するための手段 上記問題点を解決するために、本発明に基づく電子デバ
イス素子支持用基板は、平板状の印刷配線板に、電子デ
バイス素子の端子と前記デバイス以外の他のデバイスや
機器の端子との接続用リードピン配設の為のスルーホー
ルが形成されてあシ、かつ素子装着側の裏面上で、前記
スルーホールの内の能動端子用ホールの周縁を除いた全
面に、シールド用高導電膜が被着されて前記デバイス素
子収納用ケースの底板金兼ねるよう構成されている。
Means for Solving the Problems In order to solve the above-mentioned problems, an electronic device element supporting substrate based on the present invention is provided with terminals of electronic device elements and other devices other than the above-mentioned devices on a flat printed wiring board. A through hole is formed for arranging a lead pin for connection with a terminal of a device or a device, and on the back side of the element mounting side, the entire surface of the through hole excluding the periphery of the hole for the active terminal, A highly conductive shielding film is adhered thereto so that it also serves as the bottom metal plate of the device element housing case.

作用 本発明は、上記の構成によって、電子デバイスを動作さ
せるための給配電用導電線路としてのリードピンが、上
記デバイスを収納するケースの底板全兼ねる印刷配線板
の底面から、スルーホールを介して、そのま\下方に取
り出されているため、ハーメチックシール等の部材を使
わない分だけ、材料、工程の両面から安価な電子デバイ
ス素子装着用基板を提供できる。又、前記配線板の裏面
主要部分が接地用高導電膜で被覆されているため、金属
製上蓋を使うだけで、前記素子収納用ケースを形成しう
る。更に、前記リードピン配役用スルーホールの形成が
印刷配線板上で行われる為、予め、外部電子回路基板上
の挿入箇所との位置合せが容易であり、前記基板の前記
配線板取付面と上記配線板底面との空隙を十分に小さく
できる。上記の結果として、安価で回路基板への取付け
が容易外電子デバイス素子支持用の基板を、本発明は提
供しうろことになる。
Effect of the present invention With the above configuration, the lead pin as a conductive line for power supply and distribution for operating an electronic device is passed through a through hole from the bottom surface of a printed wiring board that also serves as the bottom plate of a case that houses the device. Since it is taken out as it is from below, it is possible to provide a substrate for mounting electronic device elements that is inexpensive in terms of both materials and processes since no members such as hermetic seals are used. Moreover, since the main part of the back surface of the wiring board is covered with a highly conductive film for grounding, the element housing case can be formed simply by using a metal top cover. Furthermore, since the lead pin placement through holes are formed on the printed wiring board, it is easy to align them with the insertion points on the external electronic circuit board in advance, and the wiring board mounting surface of the board and the wiring The gap between the plate and the bottom surface can be made sufficiently small. As a result of the above, the present invention provides a substrate for supporting external electronic device elements that is inexpensive and easy to attach to a circuit board.

実施例 以下、本発明に基づく電子デバイス素子支持用基板の構
成と作用並びに従来例に優る利点を、図面に基づいて具
体的に説明する。第1図は本発明に基づく電子デバイス
素子支持用基板の構成の一例を示す上面図を、同じく第
2図はその裏面をそれぞれ表わす。1は紙フェノール樹
脂やガラスエポキシ樹脂で代表される絶縁性樹脂から成
る非可撓性の平板状基板を表わし、第1図ではその図示
が略されているが、銅箔等で代表される高導電性膜から
成る電気回路のパターンが通常の印刷技術によって形成
されていることから、一般に印刷配線板と呼ばれる。白
丸で表わされた2は前記1上に装着された電子デバイス
素子の能動的な機能に対応する動作端子用のスルーホー
ル金、斜線のある丸印3は同じくその受動的な機能に対
応する接地端子用のスルーホールをそれぞれ意味する。
EXAMPLES Hereinafter, the structure and operation of the electronic device element supporting substrate according to the present invention, as well as its advantages over the conventional example, will be explained in detail with reference to the drawings. FIG. 1 is a top view showing an example of the structure of an electronic device element supporting substrate according to the present invention, and FIG. 2 is a back view thereof. 1 represents a non-flexible flat board made of insulating resin such as paper phenolic resin or glass epoxy resin, and although its illustration is omitted in Fig. It is generally called a printed wiring board because the electrical circuit pattern made of a conductive film is formed by conventional printing techniques. 2 represented by a white circle corresponds to the active function of the electronic device element mounted on the above 1, and the through-hole metal for the operating terminal corresponds to the passive function. Each means a through hole for a ground terminal.

第2図では、前記2,3に各々プライム(′印)が付さ
れて表わされている。このプライムの意味する所は、前
記基板を厚み方向に貫通するスルーホールとしては第1
図と同じであるが、斜線で表わされた4の接地用高導電
膜と、その周縁部が接していて直流的に短絡しているか
いないか等、第1図に表わされた穴とは全く同一とは言
えない点である。当然、二重丸で表わされる2′は前記
4とは接せず、−重九の3′は逆に4と接している。前
記40作用は、それが接地端子と直結され易いので、シ
ールド機能を有し得るということである。従って、前記
印刷配線板1上に装着された電子デバイス素子に対して
、金属製の上蓋ケースと協力して上記素子収納用ケース
の底板とも成シ得るのである。
In FIG. 2, 2 and 3 are each shown with a prime (' mark) attached thereto. This prime means that it is the first through hole that penetrates the board in the thickness direction.
Although it is the same as the figure, check whether the high conductive grounding film shown in Figure 4 and its peripheral edge are in contact with each other and are short-circuited in terms of direct current. cannot be said to be completely the same. Naturally, 2', represented by a double circle, does not touch 4, and 3', represented by a double nine, does, on the contrary, touch 4. The 40 function is that it can have a shielding function because it is easily connected directly to the ground terminal. Therefore, for the electronic device elements mounted on the printed wiring board 1, the bottom plate of the element storage case can also be formed in cooperation with the metal top cover case.

上記は、一つの実施例であるが、前記スルーホール間の
距離が、集積回路素子(以下:IGと略称)のリードピ
ンの間隔(例えば、1!10吋又は1/2o吋等)と等
しい構成にすることも可能である。具体的には、第1図
、第2図に共通に以下の式を満す構成をとればよい。即
ち、7!1 =:= ml di +++ ++・(1
)  t  Wj == nj dj・・+ +++ 
(”)但し、両式に共通に、m、nは自然数、dは上記
ICのリードピンの間隔、添字1.jは前記スルーホー
ルの番地を表わす数字である。尚、!。
Although the above is one example, the distance between the through holes is equal to the interval between lead pins of an integrated circuit element (hereinafter abbreviated as IG) (for example, 1! 10 inches or 1/2 degrees). It is also possible to Specifically, a configuration that satisfies the following formula in common to FIGS. 1 and 2 may be adopted. That is, 7!1 =:= ml di +++ ++・(1
) t Wj == nj dj...+ +++
('') However, in both formulas, m and n are natural numbers, d is the interval between the lead pins of the above IC, and the subscript 1.j is a number representing the address of the through hole.

Wの測られた方向は第1図では直交しているが、必ずし
もこの関係は限定されない。このような構成のものでは
、外部のIC又はIC装着用回路基板との接続も滑らか
に行われ得るものである。更に、このような基板を、そ
の素子の支持基板とする電子デバイスを、電子回路基板
に装着する際、専用ソケットヲ用いず容易にこれを行な
うことができ、取付面である前記回路基板との空隙も殆
んど生ずることなく、上記回路基板に密着することがで
きる。
Although the measured directions of W are orthogonal in FIG. 1, this relationship is not necessarily limited. With such a configuration, connection with an external IC or an IC mounting circuit board can be made smoothly. Furthermore, when an electronic device using such a board as a supporting board for its elements is mounted on an electronic circuit board, this can be easily done without using a dedicated socket, and there is no gap between the mounting surface and the circuit board. It is possible to adhere closely to the circuit board with almost no occurrence of any problems.

本発明に基づく電子デバイス素子支持用基板の材質及び
形状は、それらが非可撓性の絶縁性樹脂から成る平板状
のものである限シ、他に特別な制限を受けるものではな
い。更に、第1図、第2図では長方形の平板が代表的に
示されているが、その形状は長方形に限定されるもので
ない。ICパッケージやTo−5型の金属製容器のよう
に、角型や丸型に限定されるものでもない。
The material and shape of the electronic device element supporting substrate according to the present invention are not particularly limited as long as they are made of a non-flexible insulating resin and have a flat plate shape. Furthermore, although a rectangular flat plate is typically shown in FIGS. 1 and 2, the shape is not limited to a rectangle. It is not limited to a square or round shape like an IC package or a To-5 type metal container.

発明の効果 以上、本発明は、印刷配線板に、電子デバイス素子の動
作端子と上記素子以外のデバイスとを接続させる為のリ
ードピン用スルーホールが形成され、かつ素子装着面の
裏面上で、能動端子用ホールの周!7を除いた全面に高
導電膜が被着されることにより、従来の配線板が有して
いなかった機能を持ち、更に従来のデバイス素子収納容
器の有していた問題点を解決すると共に、各種電子回路
基板や機器への上記デバイスの装着もしくは搭載を容易
ならしめる安価な電子デバイス素子支持用基板を提供し
うるものである。
In addition to the effects of the invention, the present invention provides lead pin through-holes for connecting the operating terminals of electronic device elements and devices other than the above-mentioned elements in a printed wiring board, and active holes on the back side of the element mounting surface. Around the terminal hole! By having a highly conductive film coated on the entire surface except for 7, it has functions that conventional wiring boards did not have, and also solves the problems that conventional device element storage containers had. It is possible to provide an inexpensive electronic device element support substrate that facilitates mounting or mounting of the above-mentioned device on various electronic circuit boards and equipment.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明に基づく電子デバイス素子支持用基板
の要部構成を示す上面図、第2図はその裏面図である。 1・・・・・・印刷配線板、2,2′・・・・・・動作
端子用スルーホール、3.3’・・・・・・接地端子用
スルーホール、4・・・・・・高導電膜。
FIG. 1 is a top view showing the main structure of an electronic device element supporting substrate according to the present invention, and FIG. 2 is a back view thereof. 1...Printed wiring board, 2, 2'...Through hole for operating terminal, 3.3'...Through hole for ground terminal, 4... Highly conductive film.

Claims (2)

【特許請求の範囲】[Claims] (1)平板状の印刷配線板に、前記配線板上で支持され
ている電子デバイス素子の動作回路端子と上記デバイス
以外の他のデバイスや機器の動作端子との電気的接続用
リードピンを前記配線板上に設ける為のスルーホールが
形成されてあり、前記配線板の両面の内、前記素子が支
持ないし装着されている側の裏面上で、前記スルーホー
ルの内の能動端子用ホールの周りを除いた全面に、シー
ルド用高導電膜が被着され、それにより、前記デバイス
素子収納用ケースの底板を兼ね得る構成を有する電子デ
バイス素子支持用基板。
(1) On a flat printed wiring board, the lead pins for electrical connection between the operating circuit terminals of the electronic device elements supported on the wiring board and the operating terminals of other devices and equipment other than the above-mentioned devices are wired. A through hole is formed to be provided on the board, and on the back side of the side on which the element is supported or mounted among both sides of the wiring board, the area around the active terminal hole in the through hole is formed. A substrate for supporting an electronic device element has a structure in which a highly conductive film for shielding is adhered to the entire surface except for the substrate, so that the substrate can also serve as a bottom plate of the case for housing the device element.
(2)スルーホール間の互いに直交する軸方向の間隔が
、ICで代表される電子デバイス等の外部端子の間隔に
等しい特許請求の範囲第(1)項記載の電子デバイス素
子支持用基板。
(2) The substrate for supporting an electronic device element according to claim (1), wherein the distance between the through holes in the axial direction perpendicular to each other is equal to the distance between external terminals of an electronic device such as an IC.
JP14084685A 1985-06-27 1985-06-27 Substrate for supporting electronic device element Pending JPS622586A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14084685A JPS622586A (en) 1985-06-27 1985-06-27 Substrate for supporting electronic device element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14084685A JPS622586A (en) 1985-06-27 1985-06-27 Substrate for supporting electronic device element

Publications (1)

Publication Number Publication Date
JPS622586A true JPS622586A (en) 1987-01-08

Family

ID=15278080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14084685A Pending JPS622586A (en) 1985-06-27 1985-06-27 Substrate for supporting electronic device element

Country Status (1)

Country Link
JP (1) JPS622586A (en)

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