JP3041018U - Electronic device housing structure - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To minimize the fixation between a substrate and an insulating sheet by using a boss that is erected on a housing, and not to limit the position of the boss due to a restriction on the housing, and to surely Provided is a housing structure for an electronic device, which fixes a substrate and an insulating sheet. A boss (4) is erected on a casing (1), and a hole (21) is positioned and fixed to the boss at one end (2A) of a substrate (2).
Is provided, and one end 3A of the insulating sheet 3 is provided with a hole of the substrate and a hole 31 which is positioned and fixed to the boss, and the other end 3B of the insulating sheet is provided with the other end of the substrate. A board surrounding portion 32 that surrounds the corner 23 on the 2B side is extended, and the board surrounding portion is provided with an insertion hole 33 through which the other end of the board is inserted.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a housing structure of an electronic device, and more particularly, to a housing structure of an electronic device that securely fixes an insulating sheet and a substrate.

[0002]

[Prior art]

 As shown in FIG. 2 (a), conventionally, in an electronic device such as an intercom or a telephone, a pattern is printed on the upper surface 20U of the substrate 20 housed in the housing 1, and a short electronic device such as a chip is printed. Components (not shown) are mounted, tall electronic components (not shown) are mounted on the lower surface 20S of the substrate 20, and the upper surface 20U is protected by an insulating sheet 30 such as a synthetic resin film.

Such a conventional electronic device housing structure has four bosses 4 (4A, 4A, 4B, 4B) erected on the housing 1 and positions corresponding to the four bosses 4. It comprises a substrate 20 having four holes 21 formed therein, and an insulating sheet 30 having substantially the same shape as the substrate 20 and having four holes 31 at positions corresponding to the four bosses 4. Each of the four bosses 4 has a screw receiving hole 41 on the side on which the base plate 20 is placed.

In the conventional assembly of the housing structure of the electronic device, the board 20 on which the electronic component is mounted is placed on the four bosses 4, and the insulating sheet 30 is placed on the board 20. The four holes 21 of the substrate 20 and the four holes 31 of the insulating sheet 30 are aligned with the screw receiving holes 41 of the bosses, and the bosses that are erected in the housing 1 are screwed with the screws 5 respectively. The substrate 20 and the insulating sheet 30 are fixed onto the substrate 4.

[0005]

[Problems to be solved by the device]

 By the way, the four bosses 4A, 4A, 4B, and 4B that are erected on the housing 1 are not necessarily erected at the positions corresponding to the four corners of the base plate 20. Due to the restrictions, as shown in FIG. 2 (b), the two bosses 4A and 4A are located at both ends of one side 20A of the substrate 20 and one side 30A of the insulating sheet 30, and the other two bosses 4B. 4B may be erected near the center of the substrate 20 and the insulating sheet 30.

At this time, since the other side 20B of the substrate 20 and the other side 30B of the insulating sheet 30 are not fixed by screws, the insulating sheet 30 is rolled up from the substrate 20 as shown by an arrow Z, and the protection function cannot be achieved. However, there was a problem that it could come into contact with adjacent electronic components. The present invention has been made in order to solve the above-mentioned conventional drawbacks, and minimizes fixing between the substrate 20 and the insulating sheet 30 by using the boss 4 provided upright on the housing 1 so that the housing 1 It is an object of the present invention to provide a housing structure of an electronic device which is not limited to the position of the boss 4 due to side restrictions and which securely fixes the substrate 20 and the insulating sheet 30.

[0007]

[Means for Solving the Problems]

 The housing structure of an electronic device according to the present invention is an electronic device housing structure including an insulating sheet that protects a base plate on which electronic components housed in the housing are mounted, and a boss is provided upright on the housing. A hole for positioning and fixing to the boss is bored at one end of the substrate, and a hole for positioning and fixing to the substrate and the boss is provided at one end of the insulating sheet for insulation. At the other end of the sheet, a board surrounding portion that surrounds the corner on the other end side of the board is extended, and in the board surrounding portion, an insertion hole for inserting the corner on the other end side of the board is inserted. Is provided.

The corner on the other end side of the substrate is inserted into the insertion hole provided in the substrate surrounding portion extended on the other end of the insulating sheet, and the corner on the other end side of the substrate is inserted. Since the surrounding portion surrounds, the boss position is not limited by the restriction on the housing side, and the board and the insulating sheet can be securely fixed.

[0009]

[Embodiment of the invention]

 Embodiments of a housing structure of an electronic device according to the present invention will be described below in detail with reference to the drawings. As shown in FIG. 1A, in the case structure of an electronic device according to the present invention adopted for electronic devices such as intercoms and telephones, a pattern is formed on the upper surface 2 U of the substrate 2 housed in the case 1. Is printed, and short electronic components (not shown) such as chips are mounted, tall electronic components (not shown) are mounted on the lower surface 2S of the substrate 2, and synthetic resin film or the like is mounted on the upper surface 2U. It is protected by the insulating sheet 3.

The housing structure of the electronic device according to the present invention includes four bosses 4 (4A, 4A, 4B, 4B) provided upright on the housing 1 and four bosses 4A, 4A, 4B, 4B. The board 2 has four holes 21 to be positioned and fixed, and the two bosses 4A, 4A and the holes 21 and 21 of the board 2 are positioned and fixed. The holes 31 and 31 are formed of the insulating sheet 3 provided at one end 3A, and both corners 23 and 23 of the other end 2B of the substrate 2 are provided near both ends of the other end 3B of the insulating sheet 3. Base plate surrounding portions 32, 32 surrounding the base plate are extended. Each boss 4 has a screw hole 41.

Although the substrate surrounding portion 32 is illustrated in a large size with emphasis, it is preferable that the substrate surrounding portion 32 be slightly hung down from the corner 23 of the substrate 2. Further, the board surrounding portions 32, 32 are provided with insertion holes 33, 33 through which the corners 23, 23 of the other end 3B of the board 2 are inserted. As shown in FIG. 1 (c), the shape and position of the insertion hole 33 are such that the corner 23 of the other end 2 B of the substrate 2 is easily inserted, and the base plate surrounding portion 32 easily surrounds the corner 23 of the substrate 2. As described above, a laterally long shape is shown at a position corresponding to the corner 23 of the other end 2B of the substrate 2, but other shapes (for example, a circle) are also suitable.

The operation of the electronic device casing structure according to the present invention will be described below. The board 2 on which electronic components are mounted is placed on the four bosses 4, and screws (not shown) are screwed through the two holes 21 and 21 corresponding to the bosses 4B and 4B. Further, both corners 23, 23 of the other end portion 2B of the substrate 2 are inserted into the insertion holes 33 provided in the substrate surrounding portions 32, 32 extending to the other end 3B of the insulating sheet 3, and the insulating sheet 3 is placed. Align the two holes 21 and 21 on one 2A side of the substrate 2 and the two holes 31 and 31 on one 3A side of the insulating sheet 3 with the screw receiving holes 41 of the two bosses 4A and 4A. , And screw them with screws 5, respectively.

Since the corner 23 of the end portion 3B of the other side 2B of the substrate 2 is inserted into the insertion hole 33 of the substrate surrounding portion 32, the other side 3B of the insulating sheet 3 more reliably surrounds the other side 2B of the substrate to ensure insulation. The sheet 3 is more securely fixed with the screw 5. Therefore, the fixing between the substrate 2 and the insulating sheet 3 by using the boss 4 provided upright on the housing 1 is minimized, and the position of the boss 4 is not limited to the position of the housing 1 due to the restriction on the housing 1 side, and moreover, reliably. The substrate 2 and the insulating sheet 3 are fixed to each other, the insulating sheet is prevented from being rolled up, the electronic components on the substrate 2 are surely protected, and the adjacent electronic components are not contacted.

[0014]

[Effect of the invention]

 As is clear from the above embodiments, the housing structure of the electronic device according to the present invention is the housing structure of the electronic device including the insulating sheet that protects the substrate on which the electronic components housed in the housing are mounted. A boss is erected on the housing, a hole for positioning and fixing the boss is formed at one end of the board, and a hole for the board and the boss are formed at one end of the insulating sheet. A hole for positioning and fixing is provided at the other end of the insulating sheet, and a board surrounding portion that surrounds a corner on the other end side of the board is extended to the other end portion of the insulating sheet. Since there is an insertion hole that allows the corner on the edge side to be inserted, the other end of the board can be inserted through the insertion hole, and the board and insulating sheet can be more securely fixed. , The influence of the boss position can be minimized and the insulating sheet can be prevented from rolling from the substrate. .

[Brief description of the drawings]

1A to 1C are views illustrating a housing structure of an electronic device according to the present invention.

2A and 2B are views showing a housing structure of a conventional electronic device.

[Explanation of symbols]

 1 ... Housing 2 ... Board 23 ... Corner of the other end of the board 2A ... One end of the board 2B ... Other end of the board 3 ... Insulating sheet 31 ... Hole 32 ... Board surrounding part 33 ... Insertion hole 3A ・ ・ ・ One end of the insulating sheet 3B ・ ・ ・ The other end of the insulating sheet 4 ・ ・ ・ Boss

Claims (1)

[Utility model registration claims] 1. A casing structure of an electronic device, comprising: an insulating sheet (3) for protecting a substrate (2) having electronic components housed in the casing (1), wherein the casing is a boss. (4) is provided upright, holes (21, 21) for positioning and fixing to the boss are bored in one end (2A) of the substrate, and one end (3A) of the insulating sheet is provided. The holes of the substrate and the holes (31, 3) that are positioned and fixed to the boss.
1) is provided, and the other end portion (3B) of the insulating sheet has a substrate surrounding portion (32, 32) surrounding the corner (23, 23) on the other end portion (2B) side of the substrate. A housing structure for an electronic device, which is extended and provided with insertion holes (33, 33) through which the corners on the other end side of the substrate are inserted in the substrate surrounding portion.