JP2761458B2 - Board mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for locking a board to a board receiving portion provided on a housing, and more particularly, to a method in which components and wiring patterns mounted on the board come into contact with the board receiving portion. The present invention relates to a method of attaching a substrate to a housing that is prevented from being damaged.

[0002]

2. Description of the Related Art FIGS. 4A and 4B show a state in which a substrate is mounted on a housing, FIG. 4B is a sectional view taken along the line AA, and FIG.
FIG. 5B is a cross-sectional side view, (d) is an enlarged view of a U-shaped protrusion, and (e) is an enlarged view of a substrate mounting portion. Hereinafter, description will be made with reference to the drawings. 1
Is a metal housing for accommodating the printed circuit board 3 and includes a front plate 11 provided with an adjustment knob and the like, a bottom plate 12 provided with a U-shaped projection 2 for locking the printed circuit board 3, and a side plate 13. . The front plate 11 is provided with a mounting hole 11a for an adjustment knob such as a volume. Reference numeral 2 denotes a U-shaped projection. As shown in FIG. 4D, a part of the bottom plate 12 of the housing 1 is formed into a predetermined shape by a press or the like, and then bent upward by 90 ° to form a printed circuit board 3. Support part 2 that supports
A claw portion 22 for locking the printed circuit board 1 and the printed circuit board 3 and a positioning projection 23 for positioning the printed circuit board are formed. still,
An opening 12a is inevitably formed in the bottom plate 12 having the U-shaped protrusion 2 adjacent to the U-shaped protrusion. Reference numeral 3 denotes an upper surface mounted electronic component 31, a lower surface mounted electronic component 32, and a volume 36.
A rectangular engaging hole 33 is provided at a position on the printed circuit board on which is mounted the U-shaped protrusion 2 of the housing 1 corresponding to the claw portion 22. The adjustment shaft 37 of the volume 36 passes through the mounting hole 11 a of the front plate 11 of the housing 1 and is fixed to the front plate 11 with screws 38 and 39.
Note that the side plate 13 is omitted in the AA cross-sectional view.

FIG. 5 is a side sectional view of a housing assembly (see FIG. 4) showing a procedure for attaching a conventional substrate to a housing. Less than,
The method of attaching the printed circuit board to the housing will be described with reference to the drawings. The same numbers as those in FIG. 4 indicate the same configurations. First, the top-mounted electronic component 31 and the bottom-mounted electronic component 3
2. The printed circuit board 3 on which the volume 36 and the like are mounted is inserted substantially horizontally into the bottom plate 12 of the housing 1 from the rear of the housing 1 in the direction of the arrow, and the adjustment shaft 37 for the volume 36 is attached to the front plate 11.
(See FIG. 5A).

Subsequently, the locking engagement hole 33 of the printed circuit board 3 is inserted into the U-shaped projection 2, and the positioning projection 23 and the support portion 21 are brought into contact with the edge of the engagement hole 33. The printed circuit board 3 is held at a predetermined position, and the shaft 37 of the volume 36 is
Is fixed to the front plate 11 using screws 38 and 39. Then, the printed circuit board 3 is locked to the U-shaped protrusion 2 by twisting the claw portion 22 of the U-shaped protrusion 2 in the lateral direction (FIG. 5).
-(B)).

[0005]

Generally, the printed circuit board 3
On the lower surface (the side supported by the U-shaped projection 2 of the housing), there are a wiring pattern, legs (soldering portions) of the upper surface mounted electronic component 31, and the like, and a lower surface mounted electronic component 32 (mainly a chip). Components) may be mounted (double-sided mounting board). In the conventional mounting method shown in FIG. 5, especially when the mounting density on the housing 1 is high, the printed circuit board 3 is often inserted close to the U-shaped protrusion 2 at the time of mounting. In such a case, when the printed board 3 is inserted into the housing 1, the lower surface mounted electronic component 32 or the printed board 3
Of the wiring pattern (not shown) of the U-shaped protrusion 2
There was a risk of contact and damage.

An object of the present invention is to easily attach the printed circuit board 3 to the housing 1 without damaging the lower surface mounted electronic components 32, wiring patterns, and the like mounted on the printed circuit board 3.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, according to the present invention, a claw at the tip of a substrate receiving portion provided in a housing is inserted into an engagement hole of the substrate, and the claw is twisted. In the board mounting method for locking the board to the housing, a protection plate is placed on the claw portion, and the board is moved to a position where the claw portion and the engagement hole of the board face each other on the protection plate. After inserting, the protective plate is pulled out, the claw portion is inserted into the engagement hole of the substrate, and the claw portion is twisted to lock the substrate to the housing. is there.

[0008] Further, a board mounting method for inserting a claw at the tip of a board receiving portion provided in a housing into an engagement hole of the board and twisting the claw to lock the board to the housing. , An opening is provided at the bottom of the housing, and a support base on which a sliding member is disposed at a position higher than the claw portion from a lower portion of the housing through the opening is erected, and the substrate is slidably moved. After inserting the substrate to a position on the member where the claw portion and the engagement hole of the substrate face each other, remove the support base from the opening, insert the claw portion into the engagement hole of the substrate, The substrate is locked to the housing by twisting a claw portion.

Further, the sliding member comprises a rotating member which is rotated by contact with the substrate.

[0010]

The protective plate placed above the claw portion of the housing separates the board from the claw portion, and the board slides on the protection plate.
The components mounted on the board and the wiring pattern do not come into contact with the claws, so that the engaging holes of the board and the claws of the housing can easily match. Thereafter, by pulling out the protection plate, the substrate is lowered to the claw portion, and the claw portion can be inserted into the engagement hole of the substrate without damaging the mounted components and the wiring pattern of the substrate.

Further, by placing the housing on the support base to which the sliding member is attached through the opening of the housing, the sliding member protruding from the opening of the housing becomes higher than the claw portion. In order for the board to slide on the sliding member, the components and wiring patterns mounted on the board do not come into contact with the claws so that the engaging holes of the board and the claws of the housing easily match. it can. Thereafter, by removing the support, the substrate is lowered to the claw portion, and the claw portion can be inserted into the engagement hole of the substrate without damaging the mounted components and the wiring pattern of the substrate.

Further, when the housing is placed on the support base to which the rotating member is attached through the opening of the housing, the rotating member protruding from the opening of the housing becomes higher than the claw portion. Since the substrate moves on the rotating member while rotating the rotating member, the components mounted on the substrate and the wiring pattern do not come into contact with the claws, and the engaging holes of the substrate and the claws of the housing are easily formed. Can be matched. Thereafter, by removing the support, the substrate is lowered to the claw portion, and the claw portion can be inserted into the engagement hole of the substrate without damaging the mounted components and the wiring pattern of the substrate.

[0013]

FIG. 1 is a side sectional view of a housing assembly showing a procedure for mounting a substrate on a housing according to a first embodiment of the present invention. Hereinafter, a method of attaching the printed circuit board to the housing will be described with reference to the drawings. The same numbers as those in FIG. 4 indicate the same configurations. 1
Is a housing for accommodating the printed circuit board 3, which is a front plate 11 provided with an adjusting shaft 37 such as a volume 36, a bottom plate 12 provided with a U-shaped projection 2 for locking the printed circuit board 3, and a side plate ( (Not shown). It should be noted that the U-shaped protrusion 2 is provided between the support portion 21 for supporting the printed board 3 and the printed board 3.
Are formed by claw portions 22 for positioning and positioning protrusions 23. Reference numeral 3 denotes a printed board on which components and the like are mounted, and a rectangular engagement hole 33 is provided at a position corresponding to the U-shaped projection 2 of the housing.

Reference numeral 4 denotes a protective plate made of metal or resin (mixed with carbon or the like as a countermeasure against static electricity and having conductivity) mounted on the U-shaped protrusion 2. The electronic component 32 and the flat portion 41 for preventing the wiring pattern (not shown) from being in contact with the claw portion 22 of the U-shaped protrusion 2 to damage the component and the wiring pattern.
And a handle portion 42 provided so that the protection plate 4 can be easily pulled out after the printed board 3 is inserted.
Note that the side plate 13 is omitted in the AA cross-sectional view.

Next, a method and procedure for attaching the printed circuit board to the housing will be described. The protection plate 4 is inserted from the rear of the housing 1 in the direction of the arrow substantially parallel to the bottom plate 12, and the flat portion 41 is placed on the U-shaped projection 2 (claw portion 22) provided on the housing 1 (FIG. 1-
(A)). The printed circuit board 3 on which electronic components and the like are mounted is inserted from the rear of the housing 1 while sliding on the flat portion 41 of the protection plate 4, and the shaft 37 such as the volume 36 penetrates through the mounting hole 11 a of the front plate 11. (See FIG. 1- (b)). In this case, since the lower surface mounted electronic component 32 and the wiring pattern are separated from the claw portion 22 of the U-shaped projection 2 by the protection plate 4, there is no possibility that the claw portion 22 may be damaged by contact. still,
The substrate 3 may be inserted floating above the protection plate 4, but it is easier to slide the substrate 3 in consideration of workability.

The user holds the handle 42 of the protection plate 4 and pulls out the protection plate 4 to the rear (see FIG. 1- (c)). Since the printed circuit board 3 necessarily descends on the U-shaped protrusion 2, the engagement hole 33 of the printed circuit board 3 is inserted into the U-shaped protrusion 2.
(Approximately coincides when the insertion is completed)
2 is inserted into the engagement hole 33, and the printed board 3 is maintained at a predetermined position by bringing the positioning protrusion 23 and the support portion 21 into contact with the edge of the engagement hole 33, and the shaft 37 of the volume 36
Is fixed to the front plate 11 using screws 38 and 39. Then, the printed circuit board 3 is locked to the U-shaped protrusion 2 by twisting the claw portion 22 of the U-shaped protrusion 2 in the lateral direction (FIG. 1).
-(D) and the enlarged view of Fig. 4- (e)). The mounting is thus completed.

According to the present embodiment, the protection plate 4 provided on the U-shaped projection 2 prevents the lower surface-mounted electronic component 32 and the wiring pattern from coming into contact with the claw portion 22. The printed circuit board 3 can be easily mounted on the device. FIG. 2A is a top view and FIG. 2B is a cross-sectional view taken along the line AA for explaining a ball caster jig used when the substrate according to the second embodiment of the present invention is mounted on a housing. Hereinafter, description will be made with reference to the drawings.

Reference numeral 5 denotes a ball caster jig for preventing the U-shaped projection 2 from contacting the printed circuit board 3 to damage the lower-surface mounted electronic components 32 and the wiring pattern.
Is used when mounting to the housing 1, and the base 51 on which the housing 1 is mounted, and the opening 12 a of the bottom plate 12 of the housing 1 on the base 51.
, And a ball caster 53 provided at the tip of the support post 52. The height from the base 51 to the tip of the ball caster 53 is set higher than the distance from the lower part of the housing 1 (the lower surface of the bottom plate 12) to the tip of the U-shaped projection 2. That is,
When the housing 1 is placed on the base 51, the ball casters 5
3 is located above the tip of the claw 22.

FIG. 3 is a side sectional view (a position corresponding to an AA section in FIG. 2) for explaining a procedure for attaching a substrate to a housing using the ball caster jig according to the second embodiment of the present invention. is there. Hereinafter, a method and procedure for attaching the printed circuit board to the housing will be described with reference to the drawings. 2 and 4 indicate the same configuration. Reference numeral 1 denotes a housing for accommodating the printed circuit board 3, which is a front plate 11 provided with an adjusting shaft 37 such as a volume 36, a bottom plate 12 provided with a U-shaped projection 2 for locking the printed circuit board 3, and a side plate. It consists of. The U-shaped projection 2 includes a support portion 21 for supporting the printed board 3, a claw 22 for locking the printed board 3, and a positioning projection 23. 3 is a printed circuit board on which components are mounted,
A rectangular engaging hole 33 is provided at a position corresponding to the U-shaped protrusion 2 of the housing. Note that the side plate 13 is omitted in the side sectional view.

Next, a method and procedure for attaching the printed circuit board to the housing will be described. The housing 1 is provided on a base 51 of a ball caster jig 5, and an opening 12 a in which a support 52 is provided on a bottom plate 12 (FIG.
(See FIG. 3A). Since the U-shaped protrusion 2 is formed by bending a part of the bottom plate 12 of the housing 1, there is usually an opening 12a adjacent to the U-shaped protrusion 2 (see FIG. 4D). In this state,
The ball caster 5 extends from the upper end of the claw portion 22 of the U-shaped projection 2
The upper end of 3 is located above.

The printed board 3 is inserted by moving the ball caster 53 from the rear of the housing 1 as shown by an arrow, and the shaft 37 of the volume 36 is passed through the mounting hole 11 a of the front plate 11 (FIG. 3B). reference). In this case, the printed circuit board 3 is lifted above the claw portion 22 by the ball caster 53, and the lower surface mounted electronic component 32 and the wiring pattern contact the two claw components 22 of the U-shaped protrusion by the movement of the printed circuit board 3. Since the ball caster 53 is smoothly rotated without performing, there is no possibility that the lower surface mounted electronic component 32 and the wiring pattern are damaged.

Next, the housing 1 is lifted up together with the printed circuit board 3 and removed from the ball caster jig 5. As a result, the printed circuit board 3 is inevitably placed directly on the claw 22 of the U-shaped projection 2 (FIG. 3C).
reference). Subsequently, the engaging hole 33 of the printed circuit board 3 is made to coincide with the U-shaped projection 2 (substantially coincides when the insertion is completed), the claw 22 is inserted into the locking hole 33, and the positioning projection 23 is formed.
The printed circuit board 3 is maintained at a predetermined position by bringing the support portion 21 into contact with the edge of the engagement hole 33, and the shaft 37 of the volume 36 is fixed to the front plate 11 using screws 38 and 39. Then, the printed circuit board 3 is locked to the U-shaped projection 2 by twisting the claw portion 22 of the U-shaped projection 2 in the lateral direction (the enlarged views of FIGS. 3D and 4E). reference). The mounting is thus completed.

According to the present embodiment, the ball casters 53 protruding from the U-shaped projection 2 prevent the lower-surface mounted electronic component 32 and the wiring pattern from coming into contact with the claw portion 22.
The printed circuit board 3 can be easily mounted on the housing 1. In addition to the present embodiment, it is also possible to use a cylindrical roller caster instead of the ball caster (attached so that the roller rotates in the substrate insertion direction), and if the friction is small ( A non-rotating structure such as a ball caster having a smooth surface may be used.

[0024]

As described above in detail, according to the present invention, the claws of the board receiving portion provided on the housing do not come into contact with the board when the board is mounted, so that the components and the wiring patterns mounted on the board are not contacted. The substrate can be attached to the housing without damage.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a procedure for mounting a board according to a first embodiment of the present invention.

FIG. 2 is a top view and a side sectional view showing a jig used for mounting a substrate according to a second embodiment of the present invention.

FIG. 3 is a side sectional view showing a procedure for mounting a board according to a second embodiment of the present invention.

FIG. 4 is a top view showing a state where the board is attached to the housing;
It is an AA side sectional view, a BB side sectional view, an enlarged view of a U-shaped projection, and an enlarged view of a board attachment part.

FIG. 5 is a side sectional view showing a conventional board mounting procedure.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Housing, 12 ... Bottom plate
12a: mounting hole 2: U-shaped projection 22: claw portion 3: printed circuit board 33: engaging hole 4: protective plate 5: ball caster jig , 53 ・ ・ ・ Ball caster

Claims (3)

(57) [Claims] 1. A board mounting method for inserting a claw at a tip of a board receiving portion provided in a housing into an engagement hole of a board, and twisting the claw to lock the board to the housing. In the above, a protective plate is placed on the upper part of the claw portion, and after inserting the substrate on the protective plate until the claw portion and the engagement hole of the substrate face each other, the protective plate is pulled out to remove the claw portion. A board mounting method, wherein the board is inserted into an engagement hole of the board and the claw is twisted to lock the board to the housing. 2. A board mounting method for inserting a claw at a tip of a board receiving portion provided in a housing into an engagement hole of the board and twisting the claw to lock the board to the housing. An opening is provided at the bottom of the housing, and a support base on which a sliding member is disposed at a position higher than the claw portion from a lower portion of the housing through the opening is erected, and the substrate slides. After inserting the board to a position on the member where the claw portion and the engagement hole of the board face each other, remove the support base from the opening,
A method of mounting a substrate, comprising: inserting the claw portion into an engagement hole of the substrate; and twisting the claw portion to lock the substrate to the housing. 3. The method according to claim 2, wherein the sliding member comprises a rotating member that rotates by contact with the substrate.