JP2005012096A

JP2005012096A - Housing of electronic apparatus and substrate fixing structure

Info

Publication number: JP2005012096A
Application number: JP2003176730A
Authority: JP
Inventors: Shiga Hatayama; 志我畑山
Original assignee: Fuji Xerox Co Ltd
Current assignee: Fujifilm Business Innovation Corp
Priority date: 2003-06-20
Filing date: 2003-06-20
Publication date: 2005-01-13

Abstract

<P>PROBLEM TO BE SOLVED: To provide a housing of an electronic apparatus whose stroke required for fixing is short and enables a substrate to be fixed without using a fixing component. <P>SOLUTION: A housing 1 of an electronic apparatus which enables a substrate 2 to be fixed has a holding member 3 which is constituted to be inserted to an opening part 5 formed in the substrate 2 and to hold a circumferential edge of the opening part 5 of the substrate 2 when the substrate 2 is slid in a fixing direction 14. It also has a holding member 13 which is constituted to hold a sliding direction lowermost part 12 of the substrate 2 when the substrate 2 is slid in the fixing direction 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電子機器の筐体および基板取付構造に関する。
【０００２】
【従来の技術】
従来、電子機器に用いるプリント基板の固定構造においては、例えば矩形形状のプリント基板の場合、四隅に設けた孔と筐体に立てた基板取り付け部にネジなどにより固定して、プリント基板の孔の周囲にプリント基板のグランドパターンと電気的につながったグランドパッドを設け、グランドパッドと導通性のある筐体の基板取り付け部とが接触し、ネジにて締結することにより接触を確実に行うようにしていた（従来例１）。
【０００３】
また、以下に示すような他の従来技術が提案されている。特許文献１記載の基板固定構造は、プリント基板の載置部及び切欠部を有する支持体を、筺体の底面に立設し、切欠部及び係合部を有するプリント基板を、その切欠部に本体上部を通すようにして、本体下部に載せた後、これを前方へスライドすることにより切欠部と係合部とを係合させ、筺体に設けられた押圧体によってプリント基板を前方に押圧することによって係合状態を保持するというものである。
【０００４】
また、特許文献２記載の基板固定方法は、基板が取り付けられる機器本体の所定の位置に取り付けられた一対の固定部材および一対のクランプ部材から構成される。固定部材は略Ｌ字状に延在する係合片を有しており、クランプ部材は押えツメと係止突起が有している。基板の一端部の挿通穴を係合片に通した状態で機器本体側に倒し、基板の他端部がクランプ部材の係止突起と押えツメとにより係止するというものである。
【０００５】
また、特許文献３記載の基板取付方法は、シャーシ内に一方はプリント基板の差込み方向に対して前後に動作し、他方は差込み方向に対して上下に動作する２種類の異なったヒンジを設ける。この２つのヒンジを組み合せることによりネジや別部品を使用することなくプリント基板を固定することができるので、プリント基板の取り付けおよび取り外しを簡単に行うことができるというものである。
【０００６】
また、特許文献４記載のプリント基板取付機構は、プリント基板をケース部材に保持させる場合、一端を係止させ、もう一端を締結し、基板係止部においてフック部及び突起部を介して電気的導通を確保する事が出来る。これによって、確実なプリント基板の保持と電気的導通機能を維持可能な構成としつつ、使用部品点数を低減さることができるというものである。
【０００７】
【特許文献１】
特開平６−２８３８７２号公報
【特許文献２】
特開平９−１７２２７４号公報
【特許文献３】
特開平１１−６８３５１号公報
【特許文献４】
特開２０００−３４９４６１号公報
【発明が解決しようとする課題】
しかしながら、上記従来例１では、基板を筐体などに電気的接触性を保ったまま固定する場合、例えばクランプやネジ類等の取り付け用の部品が必要であった。
【０００８】
また、特許文献１記載の基板固定構造では、プリント基板を前方へスライドすることにより係合させ、筺体に設けられた押圧体によってプリント基板を前方に押圧することによって係合状態を保持するようにしているため、取り付けに際して工具は必要ないが、取り付けに要するストロークが広くなってしまうという問題がある。また、基板の構造が複雑になる。また、フレームグランドと接触させることができないという問題もある。
【０００９】
特許文献２記載の基板固定方法では、固定に際してクランプ部材が必要となるため、追加の部品が必要となるという問題がある。また、フレームグランドとの接触性が悪いという問題がある。
【００１０】
特許文献３記載の基板取付方法では、ネジや別部品を使用することなくプリント基板を固定することができるが、基板抜き方向に基板の大きさ以上の広いストロークが必要となるという問題がある。
【００１１】
特許文献４記載の基板取付機構では、取り付けに際して別部品となるネジを使わなければならないという問題がある。また、基板の一辺しかフック構造にできないという問題がある。さらに、面接地箇所が少ないという問題もある。
【００１２】
本発明は、上記問題点に鑑みてなされたもので、取り付けに要するストロークが短く、かつ取り付け用の部品を用いることなく基板を取り付けできる電子機器の筐体及び基板取付構造を提供することを目的とする。
【００１３】
【課題を解決するための手段】
上記課題を解決するために、請求項１記載の電子機器の筐体は、基板を取り付けできる電子機器の筐体において、前記基板に形成された開口部に挿入され、前記基板を固定方向にスライドさせた際に、前記基板の開口部周縁を保持するように構成された保持部材を有することを特徴とする。
【００１４】
請求項１記載の発明によれば、基板に形成された開口部に挿入されて、基板を固定方向にスライドさせた際に、基板の開口部周縁を保持するように構成されているので、別部品や工具を一切用いることなく、基板を取り付けることができる。また、取り付けに要するストロークも短い。
【００１５】
また、請求項２記載の電子機器の筐体は、請求項１記載の電子機器の筐体において、更に、前記基板を固定方向にスライドさせた際に、前記基板周縁部を保持するように構成された保持部材を有することを特徴とする。請求項２記載の発明によれば、基板を固定方向にスライドさせた際に、基板周縁部を保持するように構成されているので、別部品や工具を一切用いることなく、基板を取り付けることができる。
【００１６】
また、本発明は、請求項３に記載のように、請求項１又は請求項２記載の電子機器の筐体において、前記保持部材は、前記基板の一方の面から接触する第１保持部と、前記基板の他方の面から接触し、前記第１保持部とともに前記基板を挟んだ状態で保持する第２保持部とを有することを特徴とする。
【００１７】
請求項３記載の発明によれば、第１保持部が基板の一方の面から接触し、第２保持部材が基板の他方の面から接触し、第１保持部とともに基板を挟んだ状態で保持するので、別部品や工具を一切用いることなく、基板を取り付けることができる。
【００１８】
また、本発明は、請求項４に記載のように、請求項１から請求項３のいずれか一項に記載の電子機器の筐体において、前記第１保持部材又は前記第２保持部材は、前記基板の開口部周縁を保持する際に、前記基板の所定箇所に嵌合される嵌合部材を有することを特徴とする。請求項４記載の発明によれば、第１保持部材又は第２保持部材に形成された嵌合部材により、基板の抜けを防止することができる。
【００１９】
また、請求項５記載の基板取付構造は、電子機器の筐体に基板を取り付ける基板取付構造において、前記基板には、開口部が形成され、前記電子機器の筐体には、前記基板の開口部に一部が挿入される保持部材が形成され、前記電子機器の筐体の保持部材を、前記基板の開口部に挿入し、前記基板を固定方向にスライドさせて、前記基板の開口部周縁を保持することを特徴とする。
【００２０】
請求項５記載の発明によれば、電子機器の筐体の保持部材を、基板の開口部に挿入し、基板を固定方向にスライドさせて、基板の開口部周縁を保持するようにしたので、別部品や工具を一切用いることなく、基板を取り付けることができる。また、取り付けに要するストロークも短い。
【００２１】
また、本発明は、請求項６に記載のように、請求項５記載の基板取付構造において、前記電子機器の筐体は更に、前記基板を固定方向にスライドさせた際に、前記基板周縁部を保持する保持部材を有することを特徴とする。請求項６記載の発明によれば、基板を固定方向にスライドさせた際に、基板周縁部を保持するので、別部品や工具を一切用いることなく、基板を取り付けることができる。
【００２２】
また、本発明は、請求項７に記載のように、請求項５又は請求項６記載の基板取付構造において、前記基板は、前記電子機器の筐体が接触する箇所に、グランドパッドが設けられていることを特徴とする。請求項７記載の発明によれば、基板を筐体に電気的に接触させることができる。
【００２３】
【発明の実施の形態】
以下、本発明を適用した一実施形態について説明する。図１は、本実施の形態に係るプリント基板を筐体に取り付けた状態を示す斜視図である。図２は、図１の破線Ｓ１で示すプリント基板の取り付け箇所の拡大図である。図３は、図２の破線Ｓ２で示す筐体の保持部材の詳細斜視図である。
【００２４】
図４は、プリント基板の開口部周辺の斜視図である。図５は、図１に示すＰ１方向から筐体のプリント基板の取り付け部を見た図である。図６は、図１の破線Ｓ３で示すプリント基板２のスライド方向最下部を示す図である。図１に示したプリント基板２の取付機構は、板金素材にてプレス成形された筐体１にプリント基板２が取り付けられる機構の電子機器の一例を示している。
【００２５】
図１において、符号１は筐体、２はプリント基板、２Ａはプリント基板２の基板部品面、２Ｂはプリント基板２の基板半田面、３は保持部材、５は第１保持部挿入穴、３２は保持部材３の第２保持部をそれぞれ示している。
【００２６】
また、符号１３はプリント基板２の取り外し方向、符号１４はプリント基板２の固定方向を示し、プリント基板２を固定方向１４にスライドさせると、プリント基板２を筐体１に固定することができる。一方、プリント基板２の固定位置からプリント基板２を取り外し方向１３にスライドさせると、筐体１からプリント基板２を取り外すことができる。
【００２７】
筐体１は、板金等で形成され、プリント基板２を支持する４つの保持部材３を有する。図３に示すように、筐体１の保持部材３は、筐体１から垂直に折り曲げられた基部３１から筐体１に平行に折り曲げられた第１保持部３２と、第１保持部３２から第１保持部３２に対してプリント基板２を挟み込む間隔を隔てて第１保持部３２と平行に折り曲げられた２つの第２保持部３３、３４を有する。
【００２８】
第１保持部３２は、取り付け状態において、プリント基板２の基板部品面２Ａ側に位置し、プリント基板２のラッチ用穴９にラッチされるラッチ用突起８を有する。なお、図３では、このラッチ用突起８を点線で示しているが、実際には、点線で示した面と反対側の面に、このラッチ用突起８は、形成されている。ラッチ用突起８が嵌合部材に相当する。
【００２９】
第２保持部３３、３４は、取り付け状態において、プリント基板２の基板半田面２Ｂ側に位置し、第１保持部３２と共に、プリント基板２を挟んだ状態で保持するように構成されている。なお、図３の点線で示すように、第２保持部３３、３４に、ラッチ用突起８を形成するようにしてもよい。
【００３０】
図１に示すように、プリント基板２は、上段の２つの保持部材３の第１保持部３２に対応して、開口部５が形成されている。この詳細な構成を図４に示す。
【００３１】
図４に示すように、プリント基板２は、上段の２つの保持部材３に対応して、保持部材３の第１保持部３２が挿入される開口部５と、この開口部５の隣接箇所に設けられたグランドパッド１０と、グランドパッド１０に対応する位置に設けられたラッチ用穴９を有する。
【００３２】
開口部５は、保持部材３の第１保持部３２が挿入される開口部である。この開口部５は、基板取り外し方向１３及び基板固定方向１４に向けて長辺がくるように矩形に形成されている。グランドパッド１０は、例えば半田メッキなどの電気的導通素材にて覆われており、一般的にはプリント基板２のグランドパターン等と電気的につながっている。
【００３３】
取り付け時に、基板部品面２Ａ側に位置する保持部材３の第１保持部３２と、基板半田面２Ｂ側に位置する保持部材３の第２保持部３３、３４とを有する筐体１は、板金を用いた部材であるため、表面は良好な導通性能を持っている。従って、プリント基板２を保持位置にセットした状態では、グランドパッド１０と筐体１とは電気的に導通する状態となる。これにより、面接地箇所を確保できる。
【００３４】
ラッチ用穴９は、取り付け時に保持部材３の第１保持部３２に形成されたラッチ用突起８が嵌合する。
【００３５】
また、図６に示すように、プリント基板２のスライド方向最下部１２には、下段の２つの保持部材３に対応して、グランドパッド１０と、グランドパッド１０の位置に対応して設けられたラッチ用穴９を有する。ラッチ用穴９は、取り付け時に保持部材３の第１保持部３２に形成されたラッチ用突起８が嵌合する。
【００３６】
グランドパッド１０は、例えば半田メッキなどの電気的導通素材にて覆われており、一般的にはプリント基板２のグランドパターン等と電気的につながっている。取り付け時に、基板部品面２Ａ側に位置する保持部材３の第１保持部３２と基板半田面２Ｂ側に位置する保持部材３の第２保持部３３、３４を有する筐体１は、板金を用いた部材であるため、表面は良好な導通性能を持っている。従って、プリント基板２を保持位置にセットした状態では、グランドパッド１０と筐体１とは電気的に導通する状態となる。
【００３７】
次に、図５を参照しながら、図１で示したＰ方向から見たプリント基板２の取付構造について説明する。図５において、１は筐体、２は基板、８は保持部材３の第１保持部３２に形成されたラッチ用突起、９は基板２に形成されたラッチ用穴、１１は基板２の裏面に形成されたグランドパッド、３３は保持部材３の第２保持部、３４は保持部３の第２保持部をそれぞれ示している。図５に示した構成により、基板２のグランドパッド１０は、保持部材３の第１保持部３２、第２保持部３３、３４を介して、筐体１と電気的に同通する状態となる。
【００３８】
以上のように構成された筐体１に、プリント基板２を取り付ける場合は、筐体１の保持部材３の第１保持部３２を、プリント基板２の開口部５に入れ、ラッチ用突起８がラッチ用穴９に嵌合されるまで固定方向１４にプリント基板２をスライドさせる。これにより、プリント基板２は、筐体１に固定される。プリント基板２を筐体１から取り外す場合は、外し方向１３にプリント基板２をスライドさせて、保持部材３の第１保持部３２が基板２の開口部５から外れるようにする。
【００３９】
本実施の形態によれば、プリント基板２を電機機器の筐体１などに電気的接触性を保ったまま固定する場合、クランプやネジ類等の取り付け用の部品が一切不要なため、部品コストが不要となる。また、取り付け、取り外しが容易なため製造工数、保守工数も低減できる。また、プリント基板２と電子機器の筐体１を接触させる保持部材３の面積を自由に設計できるので、面積を広くすることで、ＥＭＥ的に有利になる。
【００４０】
また、電気的接触が不要な箇所にもクランプの代わりに使うことにより、部品費を低減できる。また、プリント基板２の取り付けに要するストロークが短いという従来例にはない効果を有する。
【００４１】
以上本発明の好ましい実施の形態について詳述したが、本発明は係る特定の実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。
【００４２】
例えば、本実施の形態では、例えば、プリント基板２の開口部５は、口型状の穴に形成されているが、口型の穴ではなく、コの字型の切りかきがプリント基板２の端に形成されていても良い。また、図１、図４及び図６に示したスライド方向最下部１２のラッチ用穴９とグランドパッド１０、１１は、プリント基板２の横方向の端にあっても良い。
【００４３】
また、本実施の形態では、図３に示したように、筐体１の保持部材３の第２保持部３３、３４は、両側に設けるようにしているが、これに限らず片側だけの構成でも良い。ラッチ用突起８は絞りでない突起でも良い。
【００４４】
また、本実施の形態では、図４及び図６に示すように、プリント基板２のラッチ用穴９は円形に形成するようにしているが、本発明ではこれに限定されることなく、ラッチ用穴９は円形で無くても良い。
【００４５】
また、本実施の形態では、図３に示すように、ラッチ用突起８は、取付時に基板部品面２Ａ側に位置する保持部材３の第１保持部３３に形成されているが、本発明ではこれに限定されることなく、ラッチ用突起８は、図３の点線で示すように、取り付け時に基板半田面２Ｂ側に位置する保持部材３の第２保持部３３、３４に設けても良い。なお、その場合は、プリント基板２にも、保持部材３の第２保持部３３、３４に設けたラッチ用突起に対応させてラッチ用穴を設ける必要がある。
【００４６】
また、本実施の形態では、スクリューなどを一切使用しない例について説明したが、スクリューなどを併用しても良い。さらに、保持部材３の第２保持部３３、３４は、切り起こしではなく絞り等で高さを確保できれば何でも良い。
【００４７】
【発明の効果】
以上説明したように、本発明によれば、取り付けに要するストロークが短く、かつ取り付け用の部品を用いることなく基板を取り付けできる電子機器の筐体及び基板取付構造を提供できる。
【図面の簡単な説明】
【図１】本実施の形態に係るプリント基板を筐体に取り付けた状態を示す斜視図である。
【図２】図１の破線Ｓ１で示すプリント基板の取り付け箇所の拡大図である。
【図３】図２の破線Ｓ２で示す筐体の保持部材の詳細斜視図である。
【図４】プリント基板の開口部周辺の斜視図である。
【図５】図１のＰ１で示す方向から筐体のプリント基板の取り付け部を見た図である。
【図６】図１の破線Ｓ３で示すプリント基板のスライド方向最下部を示す図である。
【符号の説明】
１筐体
２プリント基板
３保持部
３１基部
３２第１保持部
３３、３４第２保持部
５開口部
８ラッチ用突起
９ラッチ用穴
１０、１１グランドパッド[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a housing and a board mounting structure of an electronic device.
[0002]
[Prior art]
Conventionally, in a printed circuit board fixing structure used in an electronic device, for example, in the case of a rectangular printed circuit board, the holes provided in the four corners and the substrate mounting part standing on the housing are fixed with screws, etc. A ground pad that is electrically connected to the ground pattern of the printed circuit board is provided around it, and the ground pad and the board mounting part of the conductive housing are in contact with each other, and the contact is ensured by fastening with screws. (Conventional example 1).
[0003]
In addition, other conventional techniques as described below have been proposed. In the substrate fixing structure described in Patent Document 1, a support body having a printed circuit board mounting portion and a notch portion is erected on the bottom surface of the casing, and the printed circuit board having the notch portion and the engagement portion is provided as a main body in the notch portion. After passing the upper part and placing it on the lower part of the main body, sliding the front part to engage the notch part and the engaging part, and pressing the printed board forward by the pressing body provided on the housing The engagement state is maintained by.
[0004]
Moreover, the board | substrate fixing method of patent document 2 is comprised from a pair of fixing member and a pair of clamp member which were attached to the predetermined position of the apparatus main body to which a board | substrate is attached. The fixing member has an engagement piece extending in a substantially L shape, and the clamp member has a presser claw and a locking projection. The insertion hole of one end of the board is tilted toward the device main body while passing through the engagement piece, and the other end of the board is locked by the locking protrusion of the clamp member and the presser claw.
[0005]
In the board mounting method described in Patent Document 3, two different hinges are provided in the chassis, one of which moves back and forth in the insertion direction of the printed circuit board and the other which moves up and down in the insertion direction. By combining the two hinges, the printed circuit board can be fixed without using screws or other parts, so that the printed circuit board can be easily attached and detached.
[0006]
In addition, when the printed circuit board mounting mechanism described in Patent Document 4 holds the printed circuit board on the case member, one end is locked and the other end is fastened. Continuity can be secured. As a result, the number of components used can be reduced while maintaining a reliable printed circuit board retention and electrical conduction function.
[0007]
[Patent Document 1]
Japanese Patent Laid-Open No. 6-283787 [Patent Document 2]
Japanese Patent Laid-Open No. 9-172274 [Patent Document 3]
JP-A-11-68351 [Patent Document 4]
JP, 2000-349461, A [Problems to be solved by the invention]
However, in the above-mentioned conventional example 1, when the substrate is fixed to the housing or the like while maintaining electrical contact, mounting parts such as clamps and screws are necessary.
[0008]
Further, in the board fixing structure described in Patent Document 1, the printed circuit board is engaged by sliding forward, and the engaged state is maintained by pressing the printed circuit board forward by a pressing body provided on the housing. Therefore, no tool is required for attachment, but there is a problem that the stroke required for attachment becomes wide. In addition, the structure of the substrate becomes complicated. There is also a problem that it cannot be brought into contact with the frame ground.
[0009]
The substrate fixing method described in Patent Document 2 has a problem in that an additional component is required because a clamp member is required for fixing. In addition, there is a problem of poor contact with the frame ground.
[0010]
Although the printed circuit board can be fixed without using screws or other parts in the substrate mounting method described in Patent Document 3, there is a problem that a wide stroke larger than the size of the substrate is required in the substrate removal direction.
[0011]
In the board mounting mechanism described in Patent Document 4, there is a problem that a screw that is a separate part must be used for mounting. There is also a problem that only one side of the substrate can be a hook structure. Furthermore, there is a problem that there are few surface contact points.
[0012]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a housing for an electronic device and a board mounting structure capable of mounting a board without using a mounting part with a short stroke required for mounting. And
[0013]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the housing of the electronic device according to claim 1 is inserted into an opening formed in the substrate in the housing of the electronic device to which the substrate can be attached, and the substrate is slid in the fixing direction. And a holding member configured to hold the periphery of the opening of the substrate.
[0014]
According to the first aspect of the present invention, when the substrate is inserted into the opening formed in the substrate and slid in the fixing direction, the periphery of the opening of the substrate is held. The board can be attached without using any parts or tools. Moreover, the stroke required for attachment is also short.
[0015]
According to a second aspect of the present invention, there is provided the electronic device casing according to the first aspect, wherein the electronic device casing further holds the peripheral edge of the substrate when the substrate is slid in a fixing direction. It is characterized by having a holding member. According to the second aspect of the present invention, when the substrate is slid in the fixing direction, it is configured to hold the peripheral portion of the substrate, so that the substrate can be attached without using any separate parts or tools. it can.
[0016]
According to a third aspect of the present invention, in the electronic device casing according to the first or second aspect, the holding member includes a first holding portion that contacts from one surface of the substrate. And a second holding portion that is in contact with the other surface of the substrate and holds the substrate together with the first holding portion.
[0017]
According to the third aspect of the present invention, the first holding portion is in contact with one surface of the substrate, the second holding member is in contact with the other surface of the substrate, and is held in a state where the substrate is sandwiched with the first holding portion. Therefore, the substrate can be attached without using any separate parts or tools.
[0018]
Moreover, as for this invention, as for Claim 4, in the housing | casing of the electronic device as described in any one of Claims 1-3, in the said 1st holding member or the said 2nd holding member, When holding the periphery of the opening of the substrate, it has a fitting member that is fitted into a predetermined portion of the substrate. According to the fourth aspect of the present invention, it is possible to prevent the substrate from coming off by the fitting member formed on the first holding member or the second holding member.
[0019]
According to a fifth aspect of the present invention, there is provided a substrate mounting structure in which an opening is formed in the substrate, and an opening of the substrate is formed in the casing of the electronic device. A holding member that is partially inserted into the part is formed, and the holding member of the housing of the electronic device is inserted into the opening of the substrate, and the substrate is slid in a fixing direction, and the periphery of the opening of the substrate It is characterized by holding.
[0020]
According to the invention of claim 5, the holding member of the housing of the electronic device is inserted into the opening of the substrate, and the substrate is slid in the fixing direction to hold the periphery of the opening of the substrate. The substrate can be attached without using any separate parts or tools. Moreover, the stroke required for attachment is also short.
[0021]
Further, according to the present invention, as described in claim 6, in the substrate mounting structure according to claim 5, the casing of the electronic device further includes a peripheral portion of the substrate when the substrate is slid in a fixing direction. It has the holding member which hold | maintains. According to the sixth aspect of the present invention, since the peripheral edge of the substrate is held when the substrate is slid in the fixing direction, the substrate can be attached without using any separate parts or tools.
[0022]
According to a seventh aspect of the present invention, in the substrate mounting structure according to the fifth or sixth aspect, a ground pad is provided at a location where the housing of the electronic device contacts. It is characterized by. According to the seventh aspect of the present invention, the substrate can be brought into electrical contact with the housing.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment to which the present invention is applied will be described. FIG. 1 is a perspective view showing a state in which a printed circuit board according to the present embodiment is attached to a housing. FIG. 2 is an enlarged view of a printed circuit board mounting location indicated by a broken line S1 in FIG. FIG. 3 is a detailed perspective view of the holding member of the housing indicated by a broken line S2 in FIG.
[0024]
FIG. 4 is a perspective view around the opening of the printed circuit board. FIG. 5 is a view of the printed circuit board mounting portion of the housing viewed from the P1 direction shown in FIG. FIG. 6 is a diagram showing the lowermost part in the sliding direction of the printed circuit board 2 indicated by a broken line S3 in FIG. The attachment mechanism of the printed circuit board 2 shown in FIG. 1 shows an example of an electronic device having a mechanism in which the printed circuit board 2 is attached to the casing 1 press-molded with a sheet metal material.
[0025]
In FIG. 1, reference numeral 1 is a housing, 2 is a printed circuit board, 2A is a substrate component surface of the printed circuit board 2, 2B is a substrate solder surface of the printed circuit board 2, 3 is a holding member, 5 is a first holding portion insertion hole, 32 Indicates a second holding portion of the holding member 3.
[0026]
Reference numeral 13 denotes a removal direction of the printed circuit board 2, and reference numeral 14 denotes a fixing direction of the printed circuit board 2. When the printed circuit board 2 is slid in the fixing direction 14, the printed circuit board 2 can be fixed to the housing 1. On the other hand, when the printed circuit board 2 is slid in the removal direction 13 from the fixed position of the printed circuit board 2, the printed circuit board 2 can be removed from the housing 1.
[0027]
The housing 1 is formed of sheet metal or the like and has four holding members 3 that support the printed circuit board 2. As shown in FIG. 3, the holding member 3 of the housing 1 includes a first holding portion 32 bent in parallel to the housing 1 from a base portion 31 bent vertically from the housing 1, and a first holding portion 32. The first holding unit 32 includes two second holding units 33 and 34 that are bent in parallel with the first holding unit 32 with an interval between which the printed circuit board 2 is sandwiched.
[0028]
The first holding part 32 has a latching protrusion 8 that is positioned on the board component surface 2 </ b> A side of the printed circuit board 2 and is latched in the latch hole 9 of the printed circuit board 2 in the attached state. In FIG. 3, the latching protrusion 8 is indicated by a dotted line, but actually, the latching protrusion 8 is formed on a surface opposite to the surface indicated by the dotted line. The latch protrusion 8 corresponds to a fitting member.
[0029]
The second holding portions 33 and 34 are positioned on the board solder surface 2B side of the printed board 2 in the attached state, and are configured to hold the printed board 2 with the first holding section 32 therebetween. Note that, as indicated by the dotted lines in FIG. 3, the latching protrusions 8 may be formed on the second holding portions 33 and 34.
[0030]
As shown in FIG. 1, the printed circuit board 2 has openings 5 corresponding to the first holding portions 32 of the upper two holding members 3. This detailed configuration is shown in FIG.
[0031]
As shown in FIG. 4, the printed circuit board 2 corresponds to the upper two holding members 3, the opening 5 into which the first holding portion 32 of the holding member 3 is inserted, and the adjacent portion of the opening 5. A ground pad 10 provided and a latch hole 9 provided at a position corresponding to the ground pad 10 are provided.
[0032]
The opening 5 is an opening into which the first holding part 32 of the holding member 3 is inserted. The opening 5 is formed in a rectangular shape so that the long side comes toward the substrate removal direction 13 and the substrate fixing direction 14. The ground pad 10 is covered with an electrically conductive material such as solder plating, and is generally electrically connected to the ground pattern or the like of the printed circuit board 2.
[0033]
The housing 1 having the first holding part 32 of the holding member 3 located on the board component surface 2A side and the second holding parts 33 and 34 of the holding member 3 located on the board solder surface 2B side during mounting is a sheet metal Since the member is made of, the surface has good conduction performance. Accordingly, when the printed circuit board 2 is set at the holding position, the ground pad 10 and the housing 1 are electrically connected. Thereby, a surface ground location can be ensured.
[0034]
The latch hole 9 is fitted with the latch protrusion 8 formed in the first holding portion 32 of the holding member 3 at the time of attachment.
[0035]
Further, as shown in FIG. 6, the bottom portion 12 in the sliding direction of the printed circuit board 2 is provided corresponding to the two lower holding members 3 and corresponding to the positions of the ground pads 10 and the ground pads 10. It has a latch hole 9. The latch hole 9 is fitted with the latch protrusion 8 formed in the first holding portion 32 of the holding member 3 at the time of attachment.
[0036]
The ground pad 10 is covered with an electrically conductive material such as solder plating, and is generally electrically connected to the ground pattern or the like of the printed circuit board 2. The housing 1 having the first holding portion 32 of the holding member 3 located on the board component surface 2A side and the second holding portions 33 and 34 of the holding member 3 located on the board solder surface 2B side at the time of attachment uses sheet metal. Because of this member, the surface has good conduction performance. Accordingly, when the printed circuit board 2 is set at the holding position, the ground pad 10 and the housing 1 are electrically connected.
[0037]
Next, the mounting structure of the printed circuit board 2 viewed from the P direction shown in FIG. 1 will be described with reference to FIG. In FIG. 5, 1 is a housing, 2 is a substrate, 8 is a latching protrusion formed in the first holding portion 32 of the holding member 3, 9 is a latching hole formed in the substrate 2, and 11 is a back surface of the substrate 2. The reference numeral 33 denotes a ground pad, 33 denotes a second holding part of the holding member 3, and 34 denotes a second holding part of the holding part 3. With the configuration illustrated in FIG. 5, the ground pad 10 of the substrate 2 is in electrical communication with the housing 1 via the first holding portion 32 and the second holding portions 33 and 34 of the holding member 3. .
[0038]
When the printed circuit board 2 is attached to the housing 1 configured as described above, the first holding portion 32 of the holding member 3 of the housing 1 is inserted into the opening 5 of the printed circuit board 2, and the latch protrusion 8 is provided. The printed circuit board 2 is slid in the fixing direction 14 until it is fitted in the latch hole 9. Thereby, the printed circuit board 2 is fixed to the housing 1. When removing the printed circuit board 2 from the housing 1, the printed circuit board 2 is slid in the removing direction 13 so that the first holding part 32 of the holding member 3 is detached from the opening 5 of the board 2.
[0039]
According to the present embodiment, when the printed circuit board 2 is fixed to the casing 1 of the electrical equipment while maintaining electrical contact, no parts for mounting such as clamps and screws are required, so the component cost Is no longer necessary. In addition, since it is easy to attach and detach, manufacturing man-hours and maintenance man-hours can be reduced. In addition, since the area of the holding member 3 that contacts the printed circuit board 2 and the housing 1 of the electronic device can be freely designed, it is advantageous in terms of EME by increasing the area.
[0040]
In addition, the cost of parts can be reduced by using a place where electrical contact is not necessary instead of the clamp. In addition, there is an effect not found in the conventional example that a stroke required for mounting the printed circuit board 2 is short.
[0041]
Although the preferred embodiment of the present invention has been described in detail above, the present invention is not limited to the specific embodiment, and various modifications are possible within the scope of the gist of the present invention described in the claims.・ Change is possible.
[0042]
For example, in the present embodiment, for example, the opening 5 of the printed circuit board 2 is formed in a mouth-shaped hole, but a U-shaped notch is used instead of the mouth-shaped hole. It may be formed at the end. Further, the latch hole 9 and the ground pads 10 and 11 in the lowermost sliding direction 12 shown in FIGS. 1, 4, and 6 may be at the lateral ends of the printed circuit board 2.
[0043]
Moreover, in this Embodiment, as shown in FIG. 3, although the 2nd holding | maintenance parts 33 and 34 of the holding member 3 of the housing | casing 1 are provided in both sides, not only this but the structure of only one side But it ’s okay. The latching protrusion 8 may be a protrusion that is not an aperture.
[0044]
In the present embodiment, as shown in FIGS. 4 and 6, the latch hole 9 of the printed circuit board 2 is formed in a circular shape. However, the present invention is not limited to this, and the latch hole 9 is not limited thereto. The hole 9 may not be circular.
[0045]
In the present embodiment, as shown in FIG. 3, the latching protrusion 8 is formed on the first holding portion 33 of the holding member 3 located on the board component surface 2A side at the time of attachment. Without being limited to this, the latching protrusions 8 may be provided on the second holding portions 33 and 34 of the holding member 3 located on the board solder surface 2B side at the time of attachment, as shown by the dotted lines in FIG. In this case, it is necessary to provide a latching hole in the printed circuit board 2 so as to correspond to the latching protrusion provided in the second holding portions 33 and 34 of the holding member 3.
[0046]
In this embodiment, an example in which no screw or the like is used has been described, but a screw or the like may be used in combination. Furthermore, the second holding portions 33 and 34 of the holding member 3 may be anything as long as the height can be secured by a diaphragm or the like instead of cutting and raising.
[0047]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a housing and a substrate mounting structure for an electronic device that can be mounted on a substrate without using a mounting component with a short stroke.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a state in which a printed circuit board according to an embodiment is attached to a housing.
FIG. 2 is an enlarged view of a printed circuit board mounting location indicated by a broken line S1 in FIG.
FIG. 3 is a detailed perspective view of a holding member of the housing indicated by a broken line S2 in FIG.
FIG. 4 is a perspective view around the opening of the printed circuit board.
FIG. 5 is a view of a printed circuit board mounting portion of a housing as viewed from a direction indicated by P1 in FIG.
6 is a diagram showing a lowermost part in the sliding direction of the printed board indicated by a broken line S3 in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Housing | casing 2 Printed circuit board 3 Holding | maintenance part 31 Base 32 1st holding | maintenance part 33 and 34 2nd holding | maintenance part 5 Opening part 8 Latching protrusion 9 Latching holes 10 and 11 Ground pad

Claims

In the case of electronic equipment that can be mounted on a board,
An electronic apparatus comprising: a holding member configured to hold an edge of the opening of the substrate when the substrate is slid in a fixing direction and inserted into the opening formed in the substrate. Enclosure.

2. The electronic device according to claim 1, further comprising a holding member configured to hold the periphery of the substrate when the substrate is slid in a fixing direction. Enclosure.

The holding member includes a first holding unit that contacts from one surface of the substrate, a second holding unit that contacts from the other surface of the substrate, and holds the substrate together with the first holding unit. The housing of the electronic device according to claim 1, wherein the housing of the electronic device is provided.

The said 1st holding member or the said 2nd holding member has a fitting member fitted to the predetermined location of the said board | substrate when hold | maintaining the opening part periphery of the said board | substrate. Item 4. The electronic device casing according to any one of Items 3 to 3.

In the board mounting structure that attaches the board to the housing of the electronic device,
An opening is formed in the substrate,
A holding member that is partially inserted into the opening of the substrate is formed in the casing of the electronic device,
A substrate mounting structure, wherein a holding member of a housing of the electronic device is inserted into an opening of the substrate and the substrate is slid in a fixing direction to hold a periphery of the opening of the substrate.

6. The board mounting structure according to claim 5, wherein the housing of the electronic device further includes a holding member that holds the peripheral edge of the board when the board is slid in a fixing direction.

7. The substrate mounting structure according to claim 5, wherein a ground pad is provided at a location where the housing of the electronic device contacts the substrate.