JP2823503B2 - Printed circuit board mounting device - Google Patents

Printed circuit board mounting device

Info

Publication number
JP2823503B2
JP2823503B2 JP5046094A JP5046094A JP2823503B2 JP 2823503 B2 JP2823503 B2 JP 2823503B2 JP 5046094 A JP5046094 A JP 5046094A JP 5046094 A JP5046094 A JP 5046094A JP 2823503 B2 JP2823503 B2 JP 2823503B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
supporting step
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP5046094A
Other languages
Japanese (ja)
Other versions
JPH07263881A (en
Inventor
一敏 頭師
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP5046094A priority Critical patent/JP2823503B2/en
Publication of JPH07263881A publication Critical patent/JPH07263881A/en
Application granted granted Critical
Publication of JP2823503B2 publication Critical patent/JP2823503B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明はプリント基板の取付装置
に関するものであり、特に同一筐体を用いて機能の異な
る2種類の製品に対応することができるような機器のプ
リント基板の取付装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for mounting a printed circuit board, and more particularly to a device for mounting a printed circuit board of an apparatus which can accommodate two kinds of products having different functions by using the same housing. Things.

【0002】[0002]

【従来の技術】従来、このように同一の筐体で、低機能
と高機能の機能の異なる製品に対応する場合には、たと
えば図4に示すように構成される。すなわち図4におい
て、15は機器筐体、16はプリント基板である。プリ
ント基板16は、標準機能機種用と高機能機種用の2種
類が準備され、製品にあわせていずれかの基板がネジ1
7により筐体15に固定される。この従来技術において
は、基板の多くの部分が共通する、2種類の基板を準備
する必要があり、不経済であるという問題がある。
2. Description of the Related Art Conventionally, when the same housing is used to accommodate products having different functions of a low function and a high function, for example, it is configured as shown in FIG. That is, in FIG. 4, reference numeral 15 denotes a device housing, and reference numeral 16 denotes a printed circuit board. Two types of printed circuit boards 16 are prepared for a standard function model and a high function model.
7 to the housing 15. This conventional technique has a problem that it is uneconomical to prepare two types of substrates in which many parts of the substrate are common.

【0003】そこで、図5に示すように、標準機能機種
は標準基板18のみを、また高機能機種は標準基板18
に加えて、追加機能基板19をそれぞれネジ17により
ネジ止めするように構成したものがある。この従来例に
おいては、配置スペースの有効活用とネジ止め箇所の削
減による部品点数、組立工数の削減のため、2枚の基板
を取り付ける場合には、互いに基板の一部を重ね合わせ
て同時にネジ止めされる。
Therefore, as shown in FIG. 5, the standard function model has only the standard board 18 and the high function model has the standard board 18.
In addition to the above, there is a configuration in which the additional function board 19 is screwed with a screw 17. In this conventional example, in order to reduce the number of parts and the number of assembling steps by effectively utilizing the arrangement space and reducing the number of screwing points, when mounting two boards, a part of the boards is overlapped with each other and screwed simultaneously. Is done.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、このよ
うな従来技術においても、基板を固定するネジの数が多
く作業工数、部品点数の増加を招いているという問題点
かある。さらにこの従来技術においては、修理等の際に
重なり合った2枚の基板のうち、下に配置された標準基
板18を取り外す場合にも、上に配置された追加機能基
板19を取り外さなければならず、作業性が悪いという
問題点があった。
However, even in such a conventional technique, there is a problem that the number of screws for fixing the board is large and the number of working steps and the number of parts are increased. Further, in this conventional technique, when the standard board 18 disposed below is removed from the two boards that are overlapped during repair or the like, the additional function board 19 disposed above must be removed. However, there is a problem that workability is poor.

【0005】[0005]

【課題を解決するための手段】上述の従来技術の問題点
を改善するため、本発明によるプリント基板取付装置
は、1つの筐体に2枚のプリント基板のいずれか一方も
しくは両方を固定するとともに両方のプリント基板を固
定する場合には2枚のプリント基板の一部を上下に重ね
て固定するよう構成したプリント基板の固定装置におい
て、前記プリント基板の一辺に夫々一対の切り欠き部を
設け、前記筐体に前記切り欠き部と係合し基板を固定す
る一対の支持部を一体的に形成するとともに、該支持部
は一方のプリント基板の下面に当接する第一の支持段部
と、該第一の支持段部が形成された高さにプリント基板
の厚さを加えた位置よりも僅かに低い位置に形成され一
方の基板の上面を押圧支持する第二の支持段部と、他方
のプリント基板の下面に当接する第三の支持段部と、該
第三の支持段部が形成された高さにプリント基板の厚さ
を加えた位置よりも僅かに低い位置に形成され他方の基
板の上面を押圧支持する第四の支持段部とを有すること
を特徴とするものである。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems of the prior art, a printed circuit board mounting apparatus according to the present invention fixes one or both of two printed boards in a single housing, and In the case of fixing both printed boards, in a printed board fixing apparatus configured to fix a part of the two printed boards on top of one another, a pair of notches are provided on one side of the printed board, respectively. A pair of support portions for engaging the notch portion and fixing the substrate are integrally formed in the housing, and the support portion is provided with a first support step portion abutting on a lower surface of one of the printed circuit boards, A second supporting step formed at a position slightly lower than the position where the thickness of the printed circuit board is added to the height at which the first supporting step is formed, and pressing and supporting the upper surface of one substrate, and the other Under the printed circuit board And a third supporting step which is formed at a position slightly lower than a height obtained by adding the thickness of the printed circuit board to the height at which the third supporting step is formed, and presses the upper surface of the other substrate. And a fourth supporting step for supporting.

【0006】[0006]

【作用】したがって、本発明によるプリント基板の固定
装置では、第一および第二の支持段部により一方のプリ
ント基板が保持されるとともに、この一方にプリント基
板と一部を重なり合わせて、第三および第四の支持段部
により他方のプリント基板が固定される。
Therefore, in the printed circuit board fixing apparatus according to the present invention, one of the printed boards is held by the first and second supporting steps, and the other is partially overlapped with the printed board. The other printed circuit board is fixed by the fourth support step.

【0007】[0007]

【実施例】以下、図面に基づいて本発明を携帯電話機の
車載用アダプタに用いた実施例について説明する。図1
において、1は車載用アダプタの筐体であり、該筐体1
には2つの支持部2が一体形成されるとともに、この支
持部2をはさんでプリント基板を固定するためのネジ止
め用ボス3、弾性係止片4および位置決め用ボス5が一
体的に形成される。6、7は夫々第1、第2のプリント
基板としての標準機能基板および追加機能基板であり、
標準機能基板6は充電器用の基板であり、追加機能基板
7は制御用の基板である。夫々の基板6、7には一対の
係合用切り欠き部8、11が設けらており、これらの係
合用切り欠き部8、11に連続して第2の切り欠き部
9、10が設けられている。10は標準機能基板6に設
けられたネジ穴であり、該ねじ穴10を介してネジ14
によって標準機能基板6は筐体1に固定される。13は
追加機能基板7に設けられた係合用孔であり、追加機能
基板7は該係合用孔13を介して弾性係合片4によって
筐体1に固定される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a vehicle-mounted adapter of a portable telephone will be described below with reference to the drawings. FIG.
In the figure, reference numeral 1 denotes a housing of an in-vehicle adapter.
, Two support parts 2 are integrally formed, and a screw boss 3, an elastic locking piece 4, and a positioning boss 5 for fixing the printed circuit board with the support part 2 interposed therebetween are integrally formed. Is done. Reference numerals 6 and 7 denote a standard functional board and an additional functional board as first and second printed boards, respectively.
The standard function board 6 is a board for a charger, and the additional function board 7 is a board for control. Each of the substrates 6 and 7 is provided with a pair of notches 8 and 11 for engagement, and second notches 9 and 10 are provided continuously with the notches 8 and 11 for engagement. ing. Reference numeral 10 denotes a screw hole provided in the standard function board 6, and a screw 14 is inserted through the screw hole 10.
Thereby, the standard function board 6 is fixed to the housing 1. Reference numeral 13 denotes an engagement hole provided in the additional function substrate 7, and the additional function substrate 7 is fixed to the housing 1 by the elastic engagement piece 4 through the engagement hole 13.

【0008】支持部2は図2に示すような形状をしてい
る。すなわち、該支持部2は標準機能基板6の下面が当
接する第一の支持段部2aと、標準機能基板6の上面が
当接する第二の支持段部2bと、追加機能基板7の下面
が当接する第三の支持段部2cと、追加機能基板7の上
面が当接する第四の支持段部2dを少なくとも有する。
そして、第一の支持段部2aの高さをh1、第二の支持
段部の高さをh2、プリント基板6、7の厚さをTとす
ると、
The support 2 has a shape as shown in FIG. That is, the support portion 2 includes a first support step portion 2a with which the lower surface of the standard function substrate 6 contacts, a second support step portion 2b with which the upper surface of the standard function substrate 6 contacts, and a lower surface of the additional function substrate 7. It has at least a third supporting step 2c to be in contact with and a fourth supporting step 2d to be in contact with the upper surface of the additional function substrate 7.
If the height of the first supporting step 2a is h1, the height of the second supporting step is h2, and the thickness of the printed circuit boards 6, 7 is T,

【0009】[0009]

【数1】 (Equation 1)

【0010】を満足するように寸法が決められる。した
がって、標準機能基板6の係合用切り欠き部8の近傍に
はF1、F2なる力が作用し、この結果、第二の切り欠
き部9により標準機能基板6は弾性的に保持されること
となる。
The dimensions are determined so as to satisfy the following. Accordingly, forces F1 and F2 act on the vicinity of the engagement notch 8 of the standard function board 6, and as a result, the standard function board 6 is elastically held by the second notch 9. Become.

【0011】なお、追加機能基板7も同様に、第三およ
び第四の支持段部2c、2dにより弾性的に保持され
る。さらに、第三の支持段部2cの高さは第二の支持段
部よりも若干高い位置に形成されており、この結果二枚
の基板6、7は隙間を隔てて重なり合う位置に保持され
るため、基板の着脱が容易である。
The additional function substrate 7 is also elastically held by the third and fourth supporting steps 2c and 2d. Further, the height of the third supporting step 2c is formed at a position slightly higher than that of the second supporting step, and as a result, the two substrates 6, 7 are held at positions where they overlap with a gap therebetween. Therefore, attachment and detachment of the substrate are easy.

【0012】また、第一ないし第四の段部2a〜2dは
2つの支持部2、2で互いに対称的に形成される。
The first to fourth step portions 2a to 2d are formed symmetrically with each other by the two support portions 2,2.

【0013】図3は標準機能基板および追加機能基板
6、7の両方を筐体1に固定した、高機能機種を示す図
である。図に示すように、2枚の基板は一端が支持部2
によって互いに重なり合って保持されるとともに、標準
機能基板6はネジ14によって固定され、また追加機能
基板7は弾性係合片4によって固定される。なお、いず
れの基板の固定も互いに独立しており、標準機能基板6
のみを固定する、標準機能機種の場合でも確実な固定が
できる。さらに2枚の基板を固定した場合でも、他方の
基板を取り外すことなくもう一方の基板を取り外すこと
が可能である。
FIG. 3 is a view showing a high-performance model in which both the standard function board and the additional function boards 6 and 7 are fixed to the housing 1. As shown in the figure, one end of the two substrates is
The standard function board 6 is fixed by screws 14, and the additional function board 7 is fixed by the elastic engagement piece 4. The fixing of any of the substrates is independent of each other, and the standard functional substrate 6
Only the standard function model can be fixed securely. Further, even when two substrates are fixed, the other substrate can be removed without removing the other substrate.

【0014】[0014]

【発明の効果】以上説明したように、本発明によるプリ
ント基板取付装置は、同一筐体を用いて機能の異なる2
種類の製品に対応することができるような機器のプリン
ト基板の取付装置において、きわめて簡単な構成で確実
な基板の取付を行うことができるとともに、二枚の基板
を固定した場合でも、他方の基板を取り外すことなくも
う一方の基板を取り外すことができ、サービス時の作業
性がよい。
As described above, the printed circuit board mounting apparatus according to the present invention uses the same housing and has different functions.
In a printed circuit board mounting device for equipment that can handle various types of products, it is possible to securely mount the substrate with a very simple configuration, and even if two substrates are fixed, the other substrate The other substrate can be removed without removing the substrate, and workability during service is good.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明によるプリント基板取付装置を示す分解
斜視図である。
FIG. 1 is an exploded perspective view showing a printed circuit board mounting device according to the present invention.

【図2】本発明によるプリント基板取付装置の要部を示
す断面図である。
FIG. 2 is a cross-sectional view showing a main part of the printed circuit board mounting device according to the present invention.

【図3】本発明によるプリント基板取付装置の要部を示
す斜視図である。
FIG. 3 is a perspective view showing a main part of the printed circuit board mounting apparatus according to the present invention.

【図4】従来技術によるプリント基板の取付装置を示す
図である。
FIG. 4 is a view showing a conventional printed circuit board mounting device.

【図5】従来技術によるプリント基板の取付装置を示す
図である。
FIG. 5 is a diagram showing a printed circuit board mounting device according to the related art.

【符号の説明】[Explanation of symbols]

1 筐体 6 第1のプリント基板 7 第2のプリント基板 8、11 切り欠き部 2 支持部 2a 第一の支持段部 2b 第二の支持段部 2c 第三の支持段部 2d 第四の支持段部 9、12 第二の切り欠き部 DESCRIPTION OF SYMBOLS 1 Housing 6 1st printed circuit board 7 2nd printed circuit board 8, 11 Notch part 2 Support part 2a First support step part 2b Second support step part 2c Third support step part 2d Fourth support Steps 9, 12 Second notch

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 1つの筐体に2枚のプリント基板のいず
れか一方もしくは両方を固定するとともに両方のプリン
ト基板を固定する場合には2枚のプリント基板の一部を
上下に重ねて固定するよう構成したプリント基板取付装
置において、前記プリント基板の一辺に夫々一対の切り
欠き部を設け、前記筐体に前記切り欠き部と係合し基板
を固定する一対の支持部を一体的に形成するとともに、
該支持部は一方のプリント基板の下面に当接する第一の
支持段部と、該第一の支持段部が形成された高さにプリ
ント基板の厚さを加えた位置よりも僅かに低い位置に形
成された一方の基板の上面を押圧支持する第二の支持段
部と、他方のプリント基板の下面に当接する第三の支持
段部と、該第三の支持段部が形成された高さにプリント
基板の厚さを加えた位置よりも僅かに低い位置に形成さ
れ他方の基板の上面を押圧支持する第四の支持段部とを
有することを特徴とするプリント基板取付装置。
When one or both of two printed boards are fixed to one housing and both printed boards are fixed, a part of the two printed boards is vertically fixed. In the printed circuit board mounting device configured as described above, a pair of notches is provided on one side of the printed circuit board, respectively, and a pair of support portions that are engaged with the notches and fix the substrate are integrally formed in the housing. With
The supporting portion is a first supporting step abutting on the lower surface of one of the printed circuit boards, and a position slightly lower than a position obtained by adding the thickness of the printed circuit board to the height at which the first supporting step is formed. A second supporting step that presses and supports the upper surface of one of the substrates, a third supporting step that contacts the lower surface of the other printed circuit board, and a height at which the third supporting step is formed. A fourth supporting step formed at a position slightly lower than a position obtained by adding the thickness of the printed board to the upper surface of the other board.
【請求項2】 請求項1記載のプリント基板取付装置に
おいて、第二の支持段部よりも高い位置に第三の支持段
部を形成したことを特徴とするプリント基板取付装置。
2. The printed circuit board mounting apparatus according to claim 1, wherein a third supporting step is formed at a position higher than the second supporting step.
【請求項3】 請求項1記載もしくは請求項2記載のプ
リント基板取付装置において、前記プリント基板に設け
た切り欠きに連続して第2の切り欠き部を設けたことを
特徴とするプリント基板取付装置。
3. The printed circuit board mounting apparatus according to claim 1, wherein a second cutout portion is provided continuously to the cutout formed on the printed circuit board. apparatus.
JP5046094A 1994-03-22 1994-03-22 Printed circuit board mounting device Expired - Fee Related JP2823503B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5046094A JP2823503B2 (en) 1994-03-22 1994-03-22 Printed circuit board mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5046094A JP2823503B2 (en) 1994-03-22 1994-03-22 Printed circuit board mounting device

Publications (2)

Publication Number Publication Date
JPH07263881A JPH07263881A (en) 1995-10-13
JP2823503B2 true JP2823503B2 (en) 1998-11-11

Family

ID=12859492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5046094A Expired - Fee Related JP2823503B2 (en) 1994-03-22 1994-03-22 Printed circuit board mounting device

Country Status (1)

Country Link
JP (1) JP2823503B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4701117B2 (en) * 2006-03-31 2011-06-15 サクサ株式会社 PCB mounting structure

Also Published As

Publication number Publication date
JPH07263881A (en) 1995-10-13

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