JP3014937B2 - connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for connecting a board on which electronic parts such as ICs are mounted and a mother board.

[0002]

2. Description of the Related Art This type of connector is used not only for mounting electronic components on a printed circuit board via the connector, but also for testing the mounted electronic components or emulating such electronic components. Used for

[0003]

However, when mounting an electronic component with a lead of a surface mount type in which the number of pins is increased and the pin pitch is remarkably reduced, the lead dimensional tolerance,
There are demands for seismic resistance, protection from damage, accurate positioning, etc., and no connector has sufficiently responded to these requirements.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has a frame-shaped socket housing on which another substrate is mounted on a surface, and extends along the inside of the frame of the socket housing. A spring contact for supporting and electrically connecting the board and for making an electrical connection with the mother board, and providing a bolt hole in an appropriate position of the socket housing; and an upper surface of a frame of the socket housing. The present invention provides a connector which is mounted on a mother board and provided with a guide post at an appropriate position and a positioning pin at an appropriate position on the bottom surface of the frame of the socket housing.

[0005]

1 to 3 show one embodiment of a socket housing of a connector according to the present invention. The connector according to the present application is used by being mounted on a mother board 100 (see FIG. 5 described later). This connector has a frame-shaped socket housing 10 on which another board (see printed boards 30 and 40 in FIGS. 5 and 10 described later) is mounted. A spring contact 20 for supporting the board and making an electrical connection with the mother board is implanted along the inside of the frame of the socket housing (see FIG. (See FIG. 10). A bolt hole 11 is provided at an appropriate position of the socket housing, and a guide post 12 is provided at an appropriate position on the upper surface of the frame of the socket housing. Positioning pins 14 are provided at appropriate locations on the bottom surface of the frame of the socket housing. In addition, in the illustrated embodiment, reference numeral 15 denotes a nut.

FIGS. 4 and 5 show a case where the substrate mounted on the upper surface of the frame-shaped socket housing 10 is, for example, a printed circuit board 30 on which an electronic component 200 such as an IC (particularly a surface mount type) is mounted. The following shows an example. In this embodiment, a connector assembly including the above-described connector and a cover 50 that covers the connector is shown. The cover 50 is, as shown in FIGS.
It has a frame shape corresponding to the frame-shaped housing of the connector, has a groove 52 for receiving the guide post 12 of the connector, and has a similar bolt hole 51 at a position corresponding to the bolt hole 11 of the connector. Is provided. The socket housing 10 and the cover 50 are fixed by bolts 55 and the nuts 15.

FIGS. 9 and 10 show an embodiment in which the substrate mounted on the upper surface of the frame-shaped socket housing 10 is an FPC 40. FIG. In this embodiment, a connector assembly including the above-described connector and a cover 50 'to cover the connector is shown. The cover 50 '
As shown in FIGS. 11 and 12, the connector has a frame shape corresponding to the frame-shaped housing, and has a groove 52 'for receiving the guide post 12 of the connector. A similar bolt through hole 51 'is provided at a position corresponding to. Socket housing 10
The cover 50 'is fixed by bolts 55' and the nut 15. In this embodiment, one end of the FPC 40 is fixed to the bottom surface of the cover 50 'by a retaining ring 56 via a reinforcing plate 41. The other end of the FPC is fixed to a cover 50 ″ having a similar structure.
0 "is a cover for another connector assembly. Therefore, the illustrated cover assembly is used to connect two connector assemblies.
Reference numeral 42 denotes an FPC contact pad.

[0008]

As described above, according to the present invention, the I
Since an electronic component such as C is mounted on the mother board, it is possible for gold plating to come into contact with each other, thereby improving environmental characteristics. It can sufficiently respond to lead dimensional tolerance, seismic resistance, protection from damage, accurate positioning, etc. required when mounting electronic components with surface mount type leads with remarkable increase in pins and pin pitch. Electronic components having different external shapes can be mounted. Further, since the cover is formed in a frame shape, the heat radiation effect is large. Further, the connection of the FPC lead is possible, and the interconnection of other similar connector assemblies can be achieved.

[Brief description of the drawings]

FIG. 1 is a plan view of a socket housing of a connector according to the present invention.

FIG. 2 is a side view of the socket housing shown in FIG.

FIG. 3 is a bottom view of the socket housing shown in FIG. 1;

FIG. 4 is a plan view of the connector assembly according to the present invention.

FIG. 5 is a cross-sectional view of the connector assembly shown in FIG. 4 taken along lines AA and BB.

FIG. 6 is a plan view of a cover of the connector assembly shown in FIG. 4;

FIG. 7 is a side view of a cover of the connector assembly shown in FIG. 4;

FIG. 8 is a bottom view of the cover of the connector assembly shown in FIG. 4;

FIG. 9 is a plan view of another connector assembly according to the present invention.

FIG. 10 is a cross-sectional view of the connector assembly shown in FIG. 9 taken along lines AA and BB.

FIG. 11 is a plan view of a cover assembly of the connector assembly shown in FIG. 9;

FIG. 12 is a side view of a cover of the connector assembly shown in FIG. 9;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Socket housing 11 Bolt through hole 12 Guide post 14 Positioning pin 20 Spring contact 30, 40 Board 100 Mother board

────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Mitsuo Takahashi 1-1-1, Showa-cho, Kariya-shi, Aichi Japan Inside Denso Co., Ltd. (72) Inventor Satoshi Nishimura 2-1-5-312 Gonsaka, Hodogaya-ku, Yokohama, Kanagawa (56) reference Patent Sho 52-107589 (JP, a) JP flat 2-126582 (JP, a) JP flat 1-260773 (JP, a) (58 ) investigated the field (Int.Cl. ⁷ , DB name) H01R 12/16 H01R 33/76 H01R 33/97 H05K 1/14

Claims (6)

(57) [Claims] 1. A connector used by being mounted on a mother board 100, wherein the connector has a small surface on its surface.
Place either one of the two types of substrates 30 and 40
And a spring for supporting the substrate and making an electrical connection with the substrate and an electrical connection with the mother substrate along the inside of the frame of the socket housing. implanted contacts 20, and provided with a bolt hole 11 in the corner portion of the socket housing, a guide post 12 provided on the upper surface corner portion of the frame of the socket housing, the corner portion of the bottom surface of the frame of the socket housing A positioning pin 14, and the through hole 11, the guide post
12 and the positioning pin 14 on a common line
A connector , characterized in that it is provided so as not to be arranged in a connector. 2. The connector according to claim 1, wherein the substrate mounted on the upper surface of the frame-shaped socket housing is a printed circuit board 30 on which electronic components are mounted. 3. The connector according to claim 1, wherein the substrate mounted on the upper surface of the frame-shaped socket housing has an FP.
A connector characterized by being C40. 4. A connector assembly comprising the connector according to claim 1 and covers 50, 50 'covering the connector, wherein the cover has a frame shape corresponding to a frame-shaped housing of the connector or a frame thereof. Shaped housing
It has a rectangular shape corresponding to the outer shape and has grooves 52, 52 'for receiving the guide posts 12 of the connector, and similar bolt through holes 51, 51' at positions corresponding to the bolt through holes 11 of the connector. Connector assembly provided with. 5. The connector assembly according to claim 4, wherein the board mounted on the upper surface of the frame-shaped socket housing is a printed board 30 on which electronic components such as ICs are mounted. 6. The connector assembly according to claim 4, wherein the board mounted on the upper surface of the frame-shaped socket housing is an FPC 40.