JPS62246897A - Production of diamond-like carbon film - Google Patents
Production of diamond-like carbon filmInfo
- Publication number
- JPS62246897A JPS62246897A JP8607086A JP8607086A JPS62246897A JP S62246897 A JPS62246897 A JP S62246897A JP 8607086 A JP8607086 A JP 8607086A JP 8607086 A JP8607086 A JP 8607086A JP S62246897 A JPS62246897 A JP S62246897A
- Authority
- JP
- Japan
- Prior art keywords
- oxygen
- carbon
- contg
- diamond
- compd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000007789 gas Substances 0.000 claims abstract description 28
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 26
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000001301 oxygen Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 11
- 239000001257 hydrogen Substances 0.000 claims abstract description 10
- 238000000151 deposition Methods 0.000 claims abstract description 3
- 150000001875 compounds Chemical class 0.000 claims description 21
- 239000003085 diluting agent Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 5
- 239000008246 gaseous mixture Substances 0.000 abstract 4
- 238000007865 diluting Methods 0.000 abstract 2
- 239000010408 film Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 11
- -1 cyclohexanone Chemical class 0.000 description 10
- 239000010432 diamond Substances 0.000 description 8
- 229910003460 diamond Inorganic materials 0.000 description 7
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 4
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229910003481 amorphous carbon Inorganic materials 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- IUGYQRQAERSCNH-UHFFFAOYSA-M pivalate Chemical compound CC(C)(C)C([O-])=O IUGYQRQAERSCNH-UHFFFAOYSA-M 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- HDDLVZWGOPWKFW-UHFFFAOYSA-N trimethyl 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound COC(=O)CC(O)(C(=O)OC)CC(=O)OC HDDLVZWGOPWKFW-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- IKECULIHBUCAKR-UHFFFAOYSA-N 2,3-dimethylbutan-2-ol Chemical compound CC(C)C(C)(C)O IKECULIHBUCAKR-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- LGYNIFWIKSEESD-UHFFFAOYSA-N 2-ethylhexanal Chemical compound CCCCC(CC)C=O LGYNIFWIKSEESD-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- DKMROQRQHGEIOW-UHFFFAOYSA-N Diethyl succinate Chemical compound CCOC(=O)CCC(=O)OCC DKMROQRQHGEIOW-UHFFFAOYSA-N 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- RMOUBSOVHSONPZ-UHFFFAOYSA-N Isopropyl formate Chemical compound CC(C)OC=O RMOUBSOVHSONPZ-UHFFFAOYSA-N 0.000 description 1
- 125000000174 L-prolyl group Chemical group [H]N1C([H])([H])C([H])([H])C([H])([H])[C@@]1([H])C(*)=O 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical group CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- LOMVENUNSWAXEN-UHFFFAOYSA-N Methyl oxalate Chemical compound COC(=O)C(=O)OC LOMVENUNSWAXEN-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- LCTONWCANYUPML-UHFFFAOYSA-N Pyruvic acid Chemical compound CC(=O)C(O)=O LCTONWCANYUPML-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DOOTYTYQINUNNV-UHFFFAOYSA-N Triethyl citrate Chemical compound CCOC(=O)CC(O)(C(=O)OCC)CC(=O)OCC DOOTYTYQINUNNV-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- VLLNJDMHDJRNFK-UHFFFAOYSA-N adamantan-1-ol Chemical compound C1C(C2)CC3CC2CC1(O)C3 VLLNJDMHDJRNFK-UHFFFAOYSA-N 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003738 black carbon Substances 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-AATRIKPKSA-N diethyl fumarate Chemical compound CCOC(=O)\C=C\C(=O)OCC IEPRKVQEAMIZSS-AATRIKPKSA-N 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ONEGZZNKSA-N dimethyl fumarate Chemical compound COC(=O)\C=C\C(=O)OC LDCRTTXIJACKKU-ONEGZZNKSA-N 0.000 description 1
- 229960004419 dimethyl fumarate Drugs 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- UKFXDFUAPNAMPJ-UHFFFAOYSA-N ethylmalonic acid Chemical compound CCC(C(O)=O)C(O)=O UKFXDFUAPNAMPJ-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- ZIYVHBGGAOATLY-UHFFFAOYSA-L methylmalonate(2-) Chemical compound [O-]C(=O)C(C)C([O-])=O ZIYVHBGGAOATLY-UHFFFAOYSA-L 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- WSGCRAOTEDLMFQ-UHFFFAOYSA-N nonan-5-one Chemical compound CCCCC(=O)CCCC WSGCRAOTEDLMFQ-UHFFFAOYSA-N 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000001069 triethyl citrate Substances 0.000 description 1
- VMYFZRTXGLUXMZ-UHFFFAOYSA-N triethyl citrate Natural products CCOC(=O)C(O)(C(=O)OCC)C(=O)OCC VMYFZRTXGLUXMZ-UHFFFAOYSA-N 0.000 description 1
- 235000013769 triethyl citrate Nutrition 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は絶縁材料や保護膜等として優れた性質を有する
ダイヤモンド状炭素膜の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for producing a diamond-like carbon film having excellent properties as an insulating material, a protective film, etc.
〈従来の技術〉
従来、メタン等の炭化水素を原料に用いプラズマ反応さ
せ300℃以上の基板上にダイヤモンPを析出させる事
が試みられている(特開昭59−3098号公報)。又
、100〜450℃の温度で炭化水素をプラズマで気相
反応させる事によって基板上に非晶質または微結晶を有
する半非晶質の炭素層を作る事も試みられている(特開
昭58−42473号公報)、。<Prior Art> Conventionally, attempts have been made to deposit diamond P on a substrate at a temperature of 300° C. or higher through a plasma reaction using a hydrocarbon such as methane as a raw material (Japanese Patent Laid-Open No. 59-3098). Additionally, attempts have been made to create an amorphous or semi-amorphous carbon layer with microcrystals on a substrate by causing a gas phase reaction of hydrocarbons with plasma at a temperature of 100 to 450°C (Japanese Patent Application Laid-Open No. 58-42473).
これらの方法においては300℃以下では非晶質になり
やすく硬い膜は得られず、300℃以上の温度では基材
との密着性が悪くなる事や黒色炭素が副生じやすくなる
等の問題があった。In these methods, at temperatures below 300°C, the film tends to become amorphous and hard films cannot be obtained, and at temperatures above 300°C, there are problems such as poor adhesion to the substrate and the tendency for black carbon to form as a by-product. there were.
しかしながら、酸素、炭素及び水素を有する含酸素化合
物と水素ガス等の希釈ガスの混合ガスを100〜300
℃の温度で反応させる事は試みられていない。However, when a mixed gas of an oxygen-containing compound containing oxygen, carbon, and hydrogen and a diluent gas such as hydrogen gas is
No attempt has been made to cause the reaction to occur at a temperature of °C.
〈発明が解決しようとする問題点〉
本発明者等は酸素、炭素及び水素を有する含酸素化合物
を原料に用いる事によって、上記の問題点を解決し九ダ
イヤモンドの製造法を開発し、さらに高分子の表面改質
の研究において、含酸素化合物と希釈ガスとの混合ガス
をプラズマ反応させたところ、100〜300℃という
低い温度で硬いダイヤモンド状炭素膜が生成する事を見
い出し、更に鋭意研究を重ねた結果、本発明に到達した
。<Problems to be solved by the invention> The present inventors solved the above problems by using oxygen-containing compounds containing oxygen, carbon, and hydrogen as raw materials, developed a method for producing nine diamonds, and achieved even higher In research on surface modification of molecules, we discovered that a hard diamond-like carbon film was formed at a low temperature of 100 to 300°C when a mixed gas of an oxygen-containing compound and a diluent gas was subjected to a plasma reaction, and we continued to conduct further research. As a result of repeated efforts, we have arrived at the present invention.
く問題点を解決するための手段〉
すなわち、本発明は酸素、炭素及び水素を有する含酸素
化合物と希釈ガスの混合ガスを反応させ、100〜30
0℃の温度で基材上に析出させる事を特徴とす・るダイ
ヤモンP状炭素膜の製造方法である。Means for Solving the Problems〉 That is, the present invention involves reacting a mixed gas of an oxygen-containing compound containing oxygen, carbon, and hydrogen with a diluent gas, and
This is a method for producing a diamond P-like carbon film, which is characterized by depositing it on a substrate at a temperature of 0°C.
本発明において得られるダイヤモンP状炭素とは、ビッ
カース硬度が2000〜7000 Jrl/m”であシ
、電気抵抗が10”Ωm以上で、炭素を主成物とする膜
である。The diamond P-like carbon obtained in the present invention has a Vickers hardness of 2000 to 7000 Jrl/m", an electrical resistance of 10" Ωm or more, and is a film mainly composed of carbon.
本発明において用いる酸素、炭素及び水素を有する含酸
素化合物は希釈ガスによシ、または減圧状態によシス体
状、固体状、液体状で同伴され、反応系に供給されれば
よいが、きわめて微少状態、できれば気体状態で供給さ
れるものが好ましい。The oxygen-containing compound containing oxygen, carbon, and hydrogen used in the present invention may be entrained in a diluent gas or in a reduced pressure state in a cis-form, solid state, or liquid state, and then supplied to the reaction system. It is preferable to supply it in a minute amount, preferably in a gaseous state.
特に炭素数が30以下の化合物であシ、さらに取シ扱い
やすさから炭素数が15以下の化合物が好ましい。In particular, a compound having 30 or less carbon atoms is preferable, and a compound having 15 or less carbon atoms is more preferable for ease of handling.
これら含酸素化合物は酸素、炭素、水素を有する化合物
であるが、この他に硫黄、窒素、ノSQゲン等を含有し
ていても良い。These oxygen-containing compounds are compounds containing oxygen, carbon, and hydrogen, but may also contain sulfur, nitrogen, nitrogen, and the like.
本発明の含酸素化合物を例示するならば、エタノール、
メタノール、プロ/ぐノール、ブタノール、5ec−i
チルアルコール、tert−fチルアルコール、ペンタ
ノール、ヘキサノール、オクタツール、4−メチル−2
−ペンタノール、アダマンタノール、2.3−ジメチル
−2−ブタノール、フルフリルアルコール、シクロヘキ
サノール等の飽和−価アルコール類、アセトン、アセチ
ルアセトン、メチルプロピルケトン、アセトニルアセト
ン、エチルメチルケトン、ジエチルケトン、ジイソジチ
ルケトン、ジブチルケトン、ジエチルケトン、3゜3−
ジメチル−2−ブタノン、ブチルメチルケトン、メチル
イソゾロビルケトン、イソブチルメチルケトン、シクロ
ヘキサノン等のケトン類、アセトアルデヒP、プロピオ
ンアルデヒP1 ブチルアルデヒド、ホルムアルデヒr
1 プロピオンアルデヒド、2−エチルヘキシルアルデ
ヒド、フロビルアルデヒド等のアルデヒP類、クエン酸
、コハク酸、酢酸、3.3−pメチルグルタル酸、2−
ケトプロピオン酸、7マル酸、プロピオン酸、マレイン
酸、カプロン酸、グルタル酸等のカルぜン酸類、酢酸メ
チル、酢酸エチル、トリメチル酢酸、ギ酸エチル、ギ酸
エチル、ギ酸プロピル、ギ酸イソプロピル、クエン酸ト
リメチル、クエン酸トリエチル、コハク酸ジメチル、コ
ハク酸ジエチル、シュウ酸ジメチル、シュウ酸ジエチル
、メタクリル酸メチル、メタクリル酸エチル、トリメチ
ル酢酸、2−ケトプロピオン酸メチル、フマル酸ジメチ
ル、フマル酸ジエチル、ブローオン酸エチル、ゾロピオ
ン酸メチル、プロピオン酸ブチル、酢酸プロピル、酢酸
イソプロピル、マレイン酸エチル、マレイン酸メチル、
マロン酸ジメチル、マロン酸エチル、マロン酸メチル等
のエステル類、トリエチレングリコール、2−テトラメ
チルエチレングリコール、ブタンジオール、ブチレング
リコール、シクロヘキサンジメタツール等の多価アルコ
ール類等でアシ、又、エーテルアルコール類や、エステ
ルエーテル類、エステルアルコール類、エステルケトン
類、ケトンアルコール類等が含まれ、さらに不飽和化合
物も含まれる。Examples of the oxygen-containing compounds of the present invention include ethanol,
Methanol, pro/gnol, butanol, 5ec-i
Chyl alcohol, tert-f-thyl alcohol, pentanol, hexanol, octatool, 4-methyl-2
- Saturated alcohols such as pentanol, adamantanol, 2,3-dimethyl-2-butanol, furfuryl alcohol, cyclohexanol, acetone, acetylacetone, methylpropyl ketone, acetonyl acetone, ethyl methyl ketone, diethyl ketone, Diisodityl ketone, dibutyl ketone, diethyl ketone, 3゜3-
Dimethyl-2-butanone, butyl methyl ketone, methyl isozorobyl ketone, isobutyl methyl ketone, ketones such as cyclohexanone, acetaldehye P, propionaldehye P1 butyraldehyde, formaldehyde r
1 Aldehyde Ps such as propionaldehyde, 2-ethylhexylaldehyde, flobylaldehyde, citric acid, succinic acid, acetic acid, 3.3-p methylglutaric acid, 2-
Ketopropionic acid, hexamalic acid, propionic acid, maleic acid, caproic acid, calzonic acids such as glutaric acid, methyl acetate, ethyl acetate, trimethyl acetate, ethyl formate, ethyl formate, propyl formate, isopropyl formate, trimethyl citrate , triethyl citrate, dimethyl succinate, diethyl succinate, dimethyl oxalate, diethyl oxalate, methyl methacrylate, ethyl methacrylate, trimethyl acetate, methyl 2-ketopropionate, dimethyl fumarate, diethyl fumarate, ethyl blowionate , methyl zolopionate, butyl propionate, propyl acetate, isopropyl acetate, ethyl maleate, methyl maleate,
Esters such as dimethyl malonate, ethyl malonate, methyl malonate, polyhydric alcohols such as triethylene glycol, 2-tetramethylethylene glycol, butanediol, butylene glycol, cyclohexane dimetatool, etc. Alcohols, ester ethers, ester alcohols, ester ketones, ketone alcohols, etc. are included, and unsaturated compounds are also included.
又、これら含酸素化合物は酸素原子数と炭素原子数の比
(010)が1/1〜1/100である化合物でシ、好
ましい化合物は1/1〜1/30である。Further, these oxygen-containing compounds are compounds in which the ratio (010) of the number of oxygen atoms to the number of carbon atoms is 1/1 to 1/100, preferably 1/1 to 1/30.
又、これら含酸素化合物と基本的に炭素と水素からなる
炭化水素を混合して使用しても良い。その際、使用する
炭化水素は希釈ガスによシ、または減圧状態によシ、気
体状、液体状、固体状で同伴され、反応系に供給されれ
ばよいが、きわめて微小状態、できれば昇華または気体
状態で供給されるものが好ましい。特に炭素数が30以
下の炭化水素であシ、さらに取シ扱いやすさから炭素数
が15以下の炭化水素が好ましい。Further, these oxygen-containing compounds and hydrocarbons basically consisting of carbon and hydrogen may be used in combination. In this case, the hydrocarbons to be used may be entrained in a diluent gas or under reduced pressure in a gaseous, liquid, or solid state and supplied to the reaction system, but in an extremely minute state, preferably by sublimation or Those supplied in a gaseous state are preferred. In particular, hydrocarbons having 30 or less carbon atoms are preferable, and hydrocarbons having 15 or less carbon atoms are more preferable for ease of handling.
本発明において用いる希釈ガスは水素、アルゴン、ヘリ
ウム等が用いられる。Hydrogen, argon, helium, etc. are used as the diluent gas in the present invention.
本発明において混合ガスとは、含酸素化合物が希釈ガス
中にガス状、液体状、固体状で分散されているガスであ
れば良いが、ガス状で分散されている状態が好ましい。In the present invention, the mixed gas may be any gas in which the oxygen-containing compound is dispersed in the diluent gas in a gaseous, liquid, or solid state, but preferably in a gaseous state.
又、混合ガスの含酸素化合物の濃度は希釈ガスに対して
10−’ 〜10−” f/1 テロ ’) 、好1シ
<Ir1xo−s〜1〇−意f/Itである。10−4
f/It以下では成長速度が遅(,10” f/1.
以上では非晶質の炭素が生成しやすくなシ好ましくない
。Also, the concentration of oxygen-containing compounds in the mixed gas is 10-' to 10' f/1 t/It with respect to the diluent gas, and the concentration of oxygen-containing compounds in the mixed gas is 10-' to 10' f/1 t/It. 4
The growth rate is slow below f/It (,10" f/1.
The above is undesirable because amorphous carbon is likely to be produced.
本発明において反応させる手段としては、300KH2
以下の低周波、300 KII、 〜300 MH2の
高周波、300MH,〜1000GHzのマイクロ波に
よってプラズマ化する方法、紫外線等によシ光反応させ
る方法、イオン化した後、1!場で加速し基材に衝突さ
せるイオンビーム法等が用いられる。In the present invention, the means for reacting is 300KH2
A method of plasma generation using the following low frequency waves, 300 KII, high frequency waves of ~300 MH2, microwaves of 300 MHz, ~1000 GHz, a photoreaction method using ultraviolet rays, etc. After ionization, 1! An ion beam method is used in which the ion beam is accelerated in a field and collided with the base material.
本発明において用いる基材は、ポリ・ぞラフェニレンテ
レフタルアミド、ポリメタフェニレンイソ7タルアミr
1ナイロン6、ナイロン66等のイソアミ1;やテレフ
タル酸、p−ヒドロキシ安息香酸、p、p−ビフェノー
ルを重合させたポリマー、ポリエチレンテレフタレート
等のポリエステル、ポリ塩化ビニル、ポリアクリルニト
リル、ポリメチルメタアクリレート、ポリメチルアクリ
レート、ポリペンズイミP1 ポリフェニレンスルフィ
ド、ポリオキシメチレン等の有機ポリマー、石英、単結
晶シリコン、窒化ケイ素、炭化ケイ素等のケイ素化合物
、窒化ホウ素、ガラス、炭素、黒鉛等の無機物、銅、鉄
、モリブデン、アルミニウム チタン、ニッケル、スズ
、゛タングステン等の金属、サファイア、アルミナ、ジ
ルコニア等の酸化物が用いられる。これらの基材は板状
、フィルム状、粒状、粉状、繊維状等種々の形状のもの
が用いられる。The base material used in the present invention is polymethaphenylene terephthalamide, polymetaphenyleneiso7talamyl
Polymers made by polymerizing isoamide 1 such as 1 nylon 6 and nylon 66, terephthalic acid, p-hydroxybenzoic acid, p, p-biphenol, polyesters such as polyethylene terephthalate, polyvinyl chloride, polyacrylonitrile, polymethyl methacrylate , polymethyl acrylate, polypenzimine P1, organic polymers such as polyphenylene sulfide and polyoxymethylene, silicon compounds such as quartz, single crystal silicon, silicon nitride, and silicon carbide, inorganic substances such as boron nitride, glass, carbon, and graphite, copper, iron, Metals such as molybdenum, aluminum, titanium, nickel, tin, and tungsten, and oxides such as sapphire, alumina, and zirconia are used. These base materials can be in various shapes such as plate, film, granule, powder, and fiber.
基材をガスによって加熱したシ、外部又は内部ヒーター
で加熱しても良い。基材の温度は100〜300℃とす
る。100℃以下では非晶質になシやすく、300℃以
上では基材が変形する為か炭素膜がはくシしゃすぐ壜シ
、特殊な基材を用いる必要があシ好ましくない。The substrate may be heated with gas, or may be heated with an external or internal heater. The temperature of the base material is 100 to 300°C. At temperatures below 100° C., the material tends to become amorphous, and at temperatures above 300° C., the carbon film deforms, which may necessitate the use of a special base material.
〈実施例〉
以下、本発明を実施例によって説明するが、本発明はこ
れらに限定されないことはいうまでもない。□
実施例1
第1図に示す装置を用いて、基材としてガラス板を用い
、含酸素化合物としてエタノールを用いた。<Examples> The present invention will be described below with reference to Examples, but it goes without saying that the present invention is not limited thereto. □ Example 1 Using the apparatus shown in FIG. 1, a glass plate was used as the base material, and ethanol was used as the oxygen-containing compound.
まず、反応室(9)内を10−” Torr付近まで真
空排気した後翫ガラス板(7)をヒーター(8)で25
0℃に加熱した0次に1希釈ガス供給源(1)から水素
ガスを100ct/min流し、含酸素供給装置(2)
からエタノールを0.2 fiflの濃度で供給した。First, the inside of the reaction chamber (9) was evacuated to around 10-” Torr, and then the glass plate (7) was heated to 25°C using a heater (8).
Flow hydrogen gas at 100 ct/min from the 0 and 1 diluent gas supply source (1) heated to 0°C, and oxygen-containing supply device (2).
Ethanol was supplied at a concentration of 0.2 fifl.
ガス圧ヲI Torrに調整し、高周波発振機(1o)
から250Wの出力で13.56MHzの高周波を発振
しプラズマを発生させた。Adjust the gas pressure to I Torr, and use a high frequency oscillator (1o)
A high frequency wave of 13.56 MHz was oscillated with an output of 250 W to generate plasma.
1時間後、ガラス板上に厚みが3μmの薄膜が生成した
。ビッカース硬度は6000#/m”であった。After 1 hour, a thin film with a thickness of 3 μm was formed on the glass plate. The Vickers hardness was 6000#/m''.
赤外吸収スペクトルを測定したところ、水酸基、及び−
〇H2−による吸収は観察されなかった。又、x1rA
回折パターンを測定したところ、ダイヤモンドの回折パ
ターンが確認できた。When the infrared absorption spectrum was measured, hydroxyl groups and -
No absorption by H2- was observed. Also, x1rA
When the diffraction pattern was measured, a diamond diffraction pattern was confirmed.
実施例2
第2図に示す装置を用い、含酸素化合物として酢酸メチ
ル、基材としてチタンを用い九。Example 2 Using the apparatus shown in FIG. 2, methyl acetate was used as the oxygen-containing compound and titanium was used as the base material.
まず、反応室(9)内を10−’ Torr付近まで排
気した後、基板(7)を200℃に加熱した。希釈ガス
供給源(1)からアルゴンを流しながら含酸素供給装置
(2)から酢酸メチルを1f/2の濃度で供給し、ガス
圧を0.1 Torrに調節した。電磁石コイル(20
)から500 Gの磁束密度で磁界を発生させながら直
流アーク電源(13)Icよってアーク放電を発生させ
、さらに加熱フィラメントでイオン化しイオン加速電源
(15)fiよって生成したイオンをsoo vの電界
で加速し基板に衝突させ炭素膜を析出させた。First, the inside of the reaction chamber (9) was evacuated to around 10-' Torr, and then the substrate (7) was heated to 200°C. Methyl acetate was supplied at a concentration of 1f/2 from the oxygen-containing supply device (2) while argon was flowing from the dilution gas supply source (1), and the gas pressure was adjusted to 0.1 Torr. Electromagnetic coil (20
) while generating a magnetic field with a magnetic flux density of 500 G, an arc discharge is generated by a DC arc power source (13) Ic, and the ions are further ionized by a heating filament and generated by an ion accelerating power source (15) fi in an electric field of soo v. It was accelerated and collided with the substrate to deposit a carbon film.
炭素膜のビッカース硬度は5500#/+1111”で
あり、X線回折ノぐターンを測定し九ところ、ダイヤモ
ンPの回折パターンが観察された。The Vickers hardness of the carbon film was 5500#/+1111'', and a diamond P diffraction pattern was observed when measuring X-ray diffraction patterns.
実施例3
実施例1と同様にしてアクリル酸メチルを原料として用
い、基材としてガラス板を用いて行った。Example 3 A test was carried out in the same manner as in Example 1 using methyl acrylate as a raw material and a glass plate as a base material.
基板の温度は150℃に加熱し、水素ガスを100at
/win流し、アクリル酸メチルを0.15 f/1の
濃度で供給した。ガス圧は1.5Torrに調整し、2
00Wの出力で高周波を発振し、2時間プラズマを発生
させた。The temperature of the substrate is heated to 150℃, and hydrogen gas is heated to 100at.
/win flow, and methyl acrylate was fed at a concentration of 0.15 f/1. The gas pressure was adjusted to 1.5 Torr, and
A high frequency wave was oscillated with an output of 00 W, and plasma was generated for 2 hours.
炭素膜の硬度は5OOOJef/、2であった。The hardness of the carbon film was 500Jef/2.
比較例1
実施例1と同様にしてメタンを原料に用いて200℃に
加熱し九基材上に炭素膜を析出させた。Comparative Example 1 In the same manner as in Example 1, methane was used as a raw material and heated to 200° C. to deposit a carbon film on the base material.
メタンの供給量は10cc/min、水素150 ee
/ rn xnでガス圧をI Torrに調節し、20
0Wの出力で高周波を発輝しプラズマを2時間発生させ
た。Methane supply rate is 10cc/min, hydrogen 150 ee
/rn xn adjust the gas pressure to I Torr, 20
Plasma was generated for 2 hours by emitting high-frequency waves with an output of 0W.
生成した炭素膜のビッカース硬度は1000#/■2で
あった。又、炭素膜の赤外吸収スペクトルを測定した所
、2800cys−’付近にO−H伸縮振動による吸収
が観察され、X線回折ではダイヤモンPの回折パターン
は観察されなかった。The Vickers hardness of the produced carbon film was 1000 #/■2. Furthermore, when the infrared absorption spectrum of the carbon film was measured, absorption due to O-H stretching vibration was observed near 2800 cys-', and no diamond P diffraction pattern was observed in X-ray diffraction.
〈発明の効果〉
本発明の製造方法によれば、硬く、電気抵抗の高いダイ
ヤモンP状炭素膜が広い面積の種々の基材上に得られ、
得られた炭素膜は保護膜や絶縁膜として工業的に有用で
ある。<Effects of the Invention> According to the production method of the present invention, a hard, high electrical resistance diamond P-shaped carbon film can be obtained on various substrates with a wide area,
The obtained carbon film is industrially useful as a protective film or an insulating film.
【図面の簡単な説明】
第1図、第2図は本実施例において用いた製造装置の1
例である。
1・・・希釈ガス供給装置、2・・・含酸素化合物供給
装置、3・・・流量計、4.苧・・・/々ルブ、6・・
・電視、7・・・基材、8・・・ヒーター、9・・・反
応室、10・・・高周波発生装置、11・・・温度コン
トローラー、12・・・真空ポンプ、13・・・直流ア
ーク電源、14・・・電磁石電源、15・・・イオン加
速電源、16.16’・・・交流電源、17.17’・
・・加熱フィラメント、18・・・シャッター、19・
・・ガスノズル、20・・・電磁石コイ、ル、21・・
・グリッド、22・・・基材支持体。[Brief explanation of the drawings] Figures 1 and 2 show one of the manufacturing equipment used in this example.
This is an example. 1... Dilution gas supply device, 2... Oxygen-containing compound supply device, 3... Flow meter, 4.觧.../terube, 6...
・Electronic vision, 7... Base material, 8... Heater, 9... Reaction chamber, 10... High frequency generator, 11... Temperature controller, 12... Vacuum pump, 13... Direct current Arc power supply, 14... Electromagnet power supply, 15... Ion acceleration power supply, 16.16'... AC power supply, 17.17'.
...Heating filament, 18...Shutter, 19.
...Gas nozzle, 20...Electromagnetic coil, le, 21...
- Grid, 22... Base material support.
Claims (1)
混合ガスを反応させ、100〜300℃の温度で基材上
に析出させる事を特徴とするダイヤモンド状炭素膜の製
造方法A method for producing a diamond-like carbon film, which comprises reacting a mixed gas of an oxygen-containing compound containing oxygen, carbon, and hydrogen with a diluent gas and depositing it on a substrate at a temperature of 100 to 300°C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8607086A JPS62246897A (en) | 1986-04-16 | 1986-04-16 | Production of diamond-like carbon film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8607086A JPS62246897A (en) | 1986-04-16 | 1986-04-16 | Production of diamond-like carbon film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62246897A true JPS62246897A (en) | 1987-10-28 |
Family
ID=13876442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8607086A Pending JPS62246897A (en) | 1986-04-16 | 1986-04-16 | Production of diamond-like carbon film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62246897A (en) |
-
1986
- 1986-04-16 JP JP8607086A patent/JPS62246897A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Deshpandey et al. | Diamond and diamondlike films: Deposition processes and properties | |
JPS63107898A (en) | Method for synthesizing diamond with plasma | |
JP5089898B2 (en) | Carbon nanotube growth method | |
JPS61286299A (en) | Preparation of diamond | |
JPS6136200A (en) | Method for vapor-phase synthesis of diamond | |
JP2002069643A (en) | Method for producing carbon nanotube | |
JPH01230496A (en) | Novel diamond carbon membrane and its production | |
JPS62246897A (en) | Production of diamond-like carbon film | |
JPS6296397A (en) | Production of diamond | |
JPS62265198A (en) | Method for synthesizing diamond | |
JPS6054996A (en) | Synthesis of diamond | |
JPS60210597A (en) | Gas phase synthesizing method of diamond | |
JPS5935092A (en) | Vapor-phase synthesis of diamond | |
JPS62113796A (en) | Production of diamond film | |
JPH0665744A (en) | Production of diamond-like carbon thin film | |
JPH0481552B2 (en) | ||
JP3028121B2 (en) | How to make diamond thin film | |
JPH0448757B2 (en) | ||
JPS63277767A (en) | Method for synthesizing high-pressure phase boron nitride in gaseous phase | |
JPH0667797B2 (en) | Diamond synthesis method | |
JP6944699B2 (en) | Method for manufacturing hexagonal boron nitride film | |
JP2773442B2 (en) | Diamond production method | |
JPS63166798A (en) | Production of diamond film | |
JP2995339B2 (en) | How to make a thin film | |
JPS62113797A (en) | Diamond film |