JPS63107898A - Method for synthesizing diamond with plasma - Google Patents
Method for synthesizing diamond with plasmaInfo
- Publication number
- JPS63107898A JPS63107898A JP61252391A JP25239186A JPS63107898A JP S63107898 A JPS63107898 A JP S63107898A JP 61252391 A JP61252391 A JP 61252391A JP 25239186 A JP25239186 A JP 25239186A JP S63107898 A JPS63107898 A JP S63107898A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- gas
- diamond
- substrate
- discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 36
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims description 23
- 230000002194 synthesizing effect Effects 0.000 title claims description 7
- 239000007789 gas Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000003575 carbonaceous material Substances 0.000 claims abstract description 8
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 7
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 6
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 6
- 239000011261 inert gas Substances 0.000 claims abstract description 5
- 238000001704 evaporation Methods 0.000 claims abstract description 4
- 238000000151 deposition Methods 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 150000002894 organic compounds Chemical class 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 abstract description 10
- 239000001257 hydrogen Substances 0.000 abstract description 5
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 abstract description 4
- 239000008246 gaseous mixture Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 239000012808 vapor phase Substances 0.000 abstract 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 18
- 230000008021 deposition Effects 0.000 description 11
- 229910052786 argon Inorganic materials 0.000 description 9
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- -1 carbon ions Chemical class 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000013626 chemical specie Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011017 operating method Methods 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 1
- 238000004430 X-ray Raman scattering Methods 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- XKRFYHLGVUSROY-OUBTZVSYSA-N argon-41 Chemical compound [41Ar] XKRFYHLGVUSROY-OUBTZVSYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/272—Diamond only using DC, AC or RF discharges
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/25—Diamond
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/25—Diamond
- C01B32/26—Preparation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/274—Diamond only using microwave discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
- C23C16/277—Diamond only using other elements in the gas phase besides carbon and hydrogen; using other elements besides carbon, hydrogen and oxygen in case of use of combustion torches; using other elements besides carbon, hydrogen and inert gas in case of use of plasma jets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
- C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/04—Diamond
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はプラズマを用いるダイヤモンドの合成法に関す
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for synthesizing diamond using plasma.
従来技術
従来、放電を用い熱力学的に準安定領域でダイヤモンド
を合成する方法としては、次のような方法が知られてい
る。Prior Art Conventionally, the following method is known as a method for synthesizing diamond in a thermodynamically metastable region using electric discharge.
1)放電を用い炭素イオンあるいは炭化水素イオンを作
り、これを電位勾配によって加速し、基体表面に衝突さ
せてダイヤモンドを析出させるイオンビーム法、イオン
ブレーティング法。1) Ion beam method or ion brating method in which carbon ions or hydrocarbon ions are created using electric discharge, accelerated by a potential gradient, and collided with the surface of a substrate to deposit diamond.
2)炭化水素と水素の混合ガスを、グロー放電による低
温プラズマにより活性化させ、基体表面に析出させる活
性化気相析出法。2) Activated vapor phase deposition method in which a mixed gas of hydrocarbon and hydrogen is activated by low-temperature plasma generated by glow discharge and deposited on the substrate surface.
しかし1.これらの方法はそれぞれ次のような欠点があ
る。But 1. Each of these methods has the following drawbacks.
1)の方法は、常温で、各種の材料の基体表面へダイヤ
モンド状炭素膜を析出させることができる利点があるが
、加速されたイオンを用いるため、析出したダイヤモン
ドに欠陥が多く結晶性のよいダイヤモンドは得にくく、
またイオンビーム密度を高くできないので、析出速度が
おそい等の欠点があった。Method 1) has the advantage of being able to deposit a diamond-like carbon film on the substrate surface of various materials at room temperature, but because accelerated ions are used, the deposited diamond has many defects and has poor crystallinity. Diamonds are difficult to obtain,
Furthermore, since the ion beam density cannot be increased, there are drawbacks such as a slow deposition rate.
2)の方法は各種の材料の基体上にダイヤモンド微結晶
を得ることができるが、グロー放電による低温プラズマ
を用いるため、ガス圧が通常0.3気圧以下と低くなけ
ればプラズマが発生せず、またイオン、ラジカル等の活
性種濃度も最大10%程度と低いため、ダイヤモンドの
成長速度がおそい(最大数μm/h )欠点があった。Method 2) can obtain diamond microcrystals on substrates made of various materials, but since it uses low-temperature plasma caused by glow discharge, plasma will not be generated unless the gas pressure is low, usually 0.3 atmospheres or less. Furthermore, since the concentration of active species such as ions and radicals is as low as about 10% at most, the growth rate of diamond is slow (up to several μm/h 2 ), which is a drawback.
この低温プラズマでのガス(イオン、原子2分子)温度
は、およそ1600 ” K以下である。The temperature of the gas (ions, two molecules of atoms) in this low-temperature plasma is about 1600''K or less.
また、1)、2)のいずれの方法も基体上にしかダイヤ
モンドを得ることができず、気相中で粉末として得るこ
とは不可能であった。Furthermore, in both methods 1) and 2), diamond could only be obtained on the substrate, and it was impossible to obtain it as a powder in the gas phase.
本出願人はさきに従来法の欠点を改善する方法として直
流、低周波、高周波、マイクロ波を用いて、ガス温度1
700 K以上の高温プラズマを発生させ、このプラズ
マ中で有機化合物または炭素材を分解または蒸発させる
ことにより、ダイヤモンド゛ の成長速度が速く、膜
状のみならず、塊状あるいは粉末状のダイヤモンドを効
率よく合成する方法を開発した。(特願昭60−295
739号参照)この方法によると、高いガス圧、高い活
性種濃度により高速でダイヤモンドを得ることができる
が、プラズマの高い気体温度のため、冷媒による基体あ
るいは基体ホルダーの冷却、あるいはガスまたは冷媒の
吹きつけによる成長空間の温度コントロールが必要であ
る場合が多い。これらの方法による温度制御は基体温度
、成長空間温度の不均一を起こし易く、制御も難しい欠
点があった。The applicant has previously proposed using direct current, low frequency, high frequency, and microwave as a method to improve the shortcomings of the conventional method.
By generating high-temperature plasma of 700 K or higher and decomposing or evaporating organic compounds or carbon materials in this plasma, the growth rate of diamond is fast, and it is possible to efficiently grow not only diamond in the form of a film but also in the form of lumps or powder. We have developed a method to synthesize this. (Special application 1986-295
(Refer to No. 739) According to this method, diamond can be obtained at high speed due to high gas pressure and high concentration of active species. It is often necessary to control the temperature of the growth space by spraying. Temperature control by these methods tends to cause non-uniformity in the substrate temperature and growth space temperature, and has the disadvantage that control is difficult.
発明の目的
本発明はその欠点をなくしようとするものであり、その
目的は、基体温度及び合成空間の温度を容易に均一温度
に制御することができ、これにより性質の均一な膜、塊
状結晶または粒度・性状の揃った微粉末を得る方法を提
供するにある。OBJECT OF THE INVENTION The present invention aims to eliminate this drawback, and its purpose is to easily control the temperature of the substrate and the temperature of the synthesis space to a uniform temperature, thereby producing a film with uniform properties and bulk crystals. Another object of the present invention is to provide a method for obtaining fine powder with uniform particle size and properties.
発明の構成
本発明者は前記目的を達成すべく研究の結果、プラズマ
状態で得られた気体を断熱膨張させると均一な気体の急
冷ができ、基体温度2合成空間の温度を均一に制御し得
られ、前記目的を達成し得られることを知見し得た。こ
の知見に基づいて本発明を完成した。Structure of the Invention As a result of research to achieve the above object, the present inventor found that by adiabatically expanding a gas obtained in a plasma state, the gas can be uniformly rapidly cooled, and the temperature of the substrate temperature 2 synthesis space can be uniformly controlled. It has been found that the above objective can be achieved. The present invention was completed based on this knowledge.
本発明の要旨は、炭化水素ガス、水素ガス及び不活性ガ
スから選ばれた単独ガスまたは混合ガスに、放電により
プラズマを発生させ、該プラズマ中で有機化合物または
炭素材を分解または蒸発させて得られる気体を、断熱膨
張させることにより、ダイヤモンドを基体上あるいは気
相中で析出させることを特徴とするプラズマを用いるダ
イヤモンドの合成法にある。The gist of the present invention is to generate plasma by electric discharge in a single gas or a mixture of gases selected from hydrocarbon gas, hydrogen gas, and inert gas, and to decompose or evaporate organic compounds or carbon materials in the plasma. This method of synthesizing diamond using plasma is characterized in that diamond is precipitated on a substrate or in a gas phase by adiabatically expanding a gas produced by the plasma.
断熱膨張の方法は、前記プラズマ中で有機化合物または
炭素材を分解または蒸発させて得られるプラズマ状態の
気体を、ノズルまたはオリフィスを通じて、より低圧の
空間へ導き、急激な体積膨張させることにより得られる
。The adiabatic expansion method is obtained by guiding a plasma-state gas obtained by decomposing or evaporating an organic compound or carbon material in the plasma to a lower pressure space through a nozzle or orifice, and rapidly expanding the volume. .
本発明の方法において用いるプラズマはグロー放電によ
る低温プラズマでもよいが、高いガス圧、高い活性種温
度の得られる熱プラズマの方が断熱膨張の効果が大きく
てよい。ここに言う熱プラズマとは、プラズマ中に化学
種の励起が電場により加速された電子との衝突による機
構に、化学種同志の熱運動中の衝突による機構が加わっ
た状態のプラズマであり、ガス温度はおよそ1700
K以上である。The plasma used in the method of the present invention may be a low-temperature plasma generated by glow discharge, but a thermal plasma with a high gas pressure and a high active species temperature may have a greater adiabatic expansion effect. Thermal plasma referred to here is a plasma in which the excitation of chemical species in the plasma collides with electrons accelerated by an electric field, and the mechanism resulting from collisions during thermal motion between chemical species is added. The temperature is approximately 1700
K or higher.
プラズマの発生は電気的放電によって行われ、その電源
は直流、低周波交流、高周波、マ・イクロ波いずれでも
よく、また有電極、無電極いずれの方法でもよい。本発
明で用いるプラズマ発生用ガスとしては、炭化水素ガス
、アルゴン、ヘリウム等の不活性ガス、あるいは水素ガ
スを単独または混合ガスとして用いる。Plasma is generated by electrical discharge, and the power source may be direct current, low frequency alternating current, high frequency, or microwave, and either electroded or electrodeless methods may be used. As the plasma generating gas used in the present invention, a hydrocarbon gas, an inert gas such as argon or helium, or hydrogen gas is used alone or as a mixed gas.
不活性ガス、水素ガスをプラズマ発生用ガスとして用い
る場合は、炭素源として有機化合物あるいは炭素材をプ
ラズマ中に注入する。有機化合物としては、プラズマ中
で分解し、炭素を含むイオン種、ラジカル種を生成し得
るものであれば、ガス状、液状、固体状のいずれでもよ
い。例えば、メタン、エタン、プロパン、ブタン、エチ
レン。When an inert gas or hydrogen gas is used as a plasma generating gas, an organic compound or carbon material is injected into the plasma as a carbon source. The organic compound may be gaseous, liquid, or solid, as long as it can be decomposed in plasma to generate carbon-containing ionic species or radical species. For example, methane, ethane, propane, butane, ethylene.
ベンゼン等の炭化水素、あるいはポリエチレン。Hydrocarbons such as benzene, or polyethylene.
ンの有機化合物であってもよい。It may also be a natural organic compound.
また、水素ガスをプラズマ発生用ガスに混合する場合は
一酸化炭素、二酸化炭素のような炭素源を用いてもよい
。また、炭素材としては電極用黒鉛などが用いられる。Furthermore, when hydrogen gas is mixed with the plasma generating gas, a carbon source such as carbon monoxide or carbon dioxide may be used. Further, as the carbon material, graphite for electrodes or the like is used.
プラズマ発生用ガスの圧力は10−4〜5X10”気圧
までの範囲まで用いることができる。低い圧力ではダイ
ヤモンドの析出速度がおそく、高い圧力では容器の取り
扱いに手数がかかる。析出室の圧力は10−6〜10気
圧が用いられるが、膜状のダイヤモンドを得るためには
10−6〜1気圧、粉末状、塊状のダイヤモンドを得る
ためには104〜10気圧であるのが適当である。プラ
ズマ発生室と析出室は作動排気を行うこともできる。The pressure of the plasma generating gas can range from 10-4 to 5 x 10" atmospheres. At low pressures, the rate of diamond deposition is slow, and at high pressures, it is difficult to handle the container. The pressure of the deposition chamber is 10" A pressure of -6 to 10 atm is used, but a suitable pressure is 10 -6 to 1 atm to obtain diamond in the form of a film, and 104 to 10 atm to obtain diamond in the form of powder or lumps.Plasma The generation chamber and the precipitation chamber can also be evacuated.
ノズルまたはオリフィスの寸法はガス流量、−次側ガス
圧、二次側ガス圧によって変化するが、上記圧力範囲で
は、穴径が0.5〜20龍、大損が0.3〜3Qmi+
が適当である。穴の数は1個、あるいは数個を用いる。The dimensions of the nozzle or orifice vary depending on the gas flow rate, negative side gas pressure, and secondary side gas pressure, but in the above pressure range, the hole diameter is 0.5 to 20 mm and the large loss is 0.3 to 3 Qmi+.
is appropriate. One or several holes may be used.
また、ノズルまたはオリフィスは必要に応じて水冷を行
う。基体としては、モリブデン、ステンレスなどの金属
、シリコンなどの半導体、アルミナ等のセラミックス、
ダイヤモンド単結晶等が用いられる。基体温度は400
〜1700℃が望ましい。基体はノズルまたはオリフィ
スから出たガスで加熱されるが、必要に応じてヒーター
などによる補助加熱、あるいは冷媒、ガスなどによる冷
却を併用して温度調節を行うこともできる。In addition, the nozzle or orifice is cooled with water if necessary. Substrates include metals such as molybdenum and stainless steel, semiconductors such as silicon, ceramics such as alumina,
Diamond single crystal etc. are used. Base temperature is 400
~1700°C is desirable. The substrate is heated by the gas emitted from the nozzle or orifice, but if necessary, the temperature can be adjusted using supplementary heating using a heater or the like, or cooling using a refrigerant, gas, or the like.
本発明の方法を実施する装置を図面に基づいて説明する
と、第1〜第4図となる。第1図は直流放電を、第2図
は交流放電を、第3図は高周波放電を、第4図はマイク
ロ波放電を用いた場合の概要図である。The apparatus for carrying out the method of the present invention will be explained based on the drawings as shown in FIGS. 1 to 4. FIG. 1 is a schematic diagram of a case where DC discharge is used, FIG. 2 is an AC discharge, FIG. 3 is a high frequency discharge, and FIG. 4 is a schematic diagram using a microwave discharge.
第1図において、1は直流プラズマトーチ、2は直流電
源、3は基体、4はノズルまたはオリフィス、5はプラ
ズマ発生室、5′は析出室、6は排気装置、8〜8′は
ガス流量調節バルブを示す。In Fig. 1, 1 is a DC plasma torch, 2 is a DC power source, 3 is a substrate, 4 is a nozzle or orifice, 5 is a plasma generation chamber, 5' is a deposition chamber, 6 is an exhaust device, and 8 to 8' are gas flow rates. The control valve is shown.
操作手順はまず排気装置6により析出室5′及びトーチ
部を真空にした後、バルブ8,8′を通じて所定のプラ
ズマ発生用ガス及び有機化合物ガスを供給する。析出室
5′を所定の圧力となした後、プラズマトーチ1に電源
2より電力を供給しプラズマを発生させ、ノズルまたは
オリフィス4を通じて析出室5′に噴出させる。基体3
のホルダーの位置を調節し、基体3上にダイヤモンドを
析出させる。また、第3図に示すように、基体。The operating procedure is as follows: First, the deposition chamber 5' and the torch section are evacuated by the exhaust device 6, and then predetermined plasma generating gas and organic compound gas are supplied through the valves 8, 8'. After the deposition chamber 5' is brought to a predetermined pressure, power is supplied to the plasma torch 1 from the power source 2 to generate plasma, which is ejected through the nozzle or orifice 4 into the deposition chamber 5'. Base body 3
The position of the holder is adjusted, and diamond is deposited on the substrate 3. Moreover, as shown in FIG. 3, a base body.
基体ホルダーを取り除いて気相中でダイヤモンド粉末を
合成することもできる。It is also possible to remove the substrate holder and synthesize diamond powder in the gas phase.
第2図において、11は交流放電用電極で、下方の電極
は中央に穴がおいており、ノズルを兼ねている。12は
交流電源で、他は第1図と同じである。運転の手順は直
流放電の場合と同じであり、ノズルまたはオリフィスを
通じて電極間の放電により生じたプラズマ気体を析出室
5′に噴出させ、基体上あるいは気相中でダイヤモンド
を成長させる。In FIG. 2, 11 is an electrode for AC discharge, and the lower electrode has a hole in the center and also serves as a nozzle. 12 is an AC power supply, and the others are the same as in FIG. The operating procedure is the same as in the case of direct current discharge, in which plasma gas generated by the discharge between the electrodes is ejected into the deposition chamber 5' through a nozzle or orifice, and diamond is grown on the substrate or in the gas phase.
このように有電極放電では一方の電極をノズルまたはオ
リフィスとすることもできる。In this way, in electroded discharge, one electrode can also be used as a nozzle or an orifice.
第3図において、21は高周波プラズマトーチ、22は
高周波電源、23はワークコイル、24は固体液体原料
導入装置、25は生成ダイヤモンド粉体の受は皿で、他
は第1図と同じである。ワークコイル23の代わりに電
極を用い容量結合でプラズマを発生させることもできる
。この場合も発生させたプラズマ気体をノズルまたはオ
リフィスを通じて析出室5′に噴出させてダイヤモンド
微粉末を生成させる。また、第1図に示すように基体を
置くことにより、膜状または塊状のダイヤモンドを得る
ことができる。In Fig. 3, 21 is a high-frequency plasma torch, 22 is a high-frequency power source, 23 is a work coil, 24 is a solid-liquid raw material introduction device, 25 is a tray for receiving the produced diamond powder, and the other parts are the same as in Fig. 1. . Plasma can also be generated by capacitive coupling using electrodes instead of the work coil 23. In this case as well, the generated plasma gas is ejected into the precipitation chamber 5' through a nozzle or orifice to generate fine diamond powder. Furthermore, by placing the substrate as shown in FIG. 1, diamond in the form of a film or a lump can be obtained.
第4図において、31はマイクロ波プラズマトーチ、3
2はマイクロ波発振機、33は導波管で、他は第1図と
同じである。この場合も第1図におけると同様に基体上
あるいは気相中でダイヤモンドを成長させることができ
る。なお、第4図に示す空洞共振器型のプラズマトーチ
の代わりに同軸電極型のプラズマトーチを用いることが
できる。In FIG. 4, 31 is a microwave plasma torch;
2 is a microwave oscillator, 33 is a waveguide, and the others are the same as in FIG. In this case as well, diamond can be grown on the substrate or in the gas phase as in FIG. Note that a coaxial electrode type plasma torch can be used instead of the cavity resonator type plasma torch shown in FIG.
実施例1゜
斗会モミ45V−78Aの放電を10分間行わせ、約9
03のシリコン基板上に厚さ4μ閑のダイヤモンド多結
晶膜を得た。ノズル径はIM、析出室の圧力は8Tor
r、 M仮はアルミナホルダーに乗せただけで、基板温
度は約750℃であった。膜の構造の同定はX線回折お
よびラマン散乱スペクトルで行った。膜厚の均一性は±
2%内に収まっていた。Example 1 Discharge of 45V-78A was carried out for 10 minutes, and approximately 9
A diamond polycrystalline film with a thickness of 4 μm was obtained on a silicon substrate of No. 03. The nozzle diameter is IM, and the pressure in the precipitation chamber is 8 Torr.
R and M were simply placed on an alumina holder, and the substrate temperature was approximately 750°C. The structure of the film was identified by X-ray diffraction and Raman scattering spectra. Uniformity of film thickness is ±
It was within 2%.
実施例2゜
第2図に示す装置を用い、バルブ8よりメタンガス20
0 ml/m、 3 ’よりアルゴン12j!/m、8
′ −より水素86/raを流し、5011z、85V
−9OAの放電を10分間行わせ、モリブデン基板上に
厚さ7μmのダイヤモンド膜を得た。ノズル径は31m
、析出室圧力は0.2気圧、基板温度は920℃であっ
た。Example 2 Using the apparatus shown in FIG. 2, methane gas 20
0 ml/m, argon 12j from 3'! /m, 8
' - Flow hydrogen 86/ra, 5011z, 85V
-9OA discharge was performed for 10 minutes to obtain a 7 μm thick diamond film on the molybdenum substrate. Nozzle diameter is 31m
The deposition chamber pressure was 0.2 atm, and the substrate temperature was 920°C.
実施例3゜
第3図に示す装置(基板ホルダー取付け)を用い、バル
ブ8より0.6 g/mのアルコール蒸気とアルゴン2
1/lsの混合ガス、8′よりアルゴン81/m、8′
よりアルゴン16f/mと水素101/mの混合ガスを
流し、周波数4MH2、真空管プレート人力12kWの
高周波により9分間放電させ、モリブデン基板上に厚さ
18μmのダイヤモンド膜を得た。ノズル径は9.6f
i、析出室圧力は0.6気圧、基板温度は約1100℃
であった。Example 3 Using the apparatus shown in Fig. 3 (substrate holder attached), 0.6 g/m alcohol vapor and argon 2 were supplied from valve 8.
1/ls mixed gas, 8' to argon 81/m, 8'
A mixed gas of 16 f/m of argon and 101/m of hydrogen was flowed, and a high frequency wave with a frequency of 4 MH2 and a vacuum tube plate power of 12 kW was used to discharge for 9 minutes to obtain a diamond film with a thickness of 18 μm on the molybdenum substrate. Nozzle diameter is 9.6f
i, Deposition chamber pressure is 0.6 atm, substrate temperature is approximately 1100°C
Met.
実施例4゜
第3図に示す装置を用い、バルブ8よりプロパン400
ml/mとアルゴン41/mの混合ガス、8′より7
)Ltゴ:/ 12 lim、 8′よりアルゴン25
C/mと水素10j!!/mの混合ガスを流し、真空管
プレート入カフ0kWの放電により、30分間に受は皿
25上に粒径150±20人のダイヤモンド粉末約1g
を得た。ノズル径は2龍、析出室圧力は1気圧、放電室
圧力は約3気圧であった。Example 4 Using the apparatus shown in Figure 3, 400 ml of propane was supplied from valve 8.
Mixed gas of ml/m and argon 41/m, 8' to 7
) Lt go: / 12 lim, argon 25 from 8'
C/m and hydrogen 10j! ! By flowing a mixed gas of /m and discharging at 0 kW through a vacuum tube plate cuff, approximately 1 g of diamond powder with a particle size of 150 ± 20 particles was deposited on the plate 25 in 30 minutes.
I got it. The nozzle diameter was 2 mm, the precipitation chamber pressure was 1 atm, and the discharge chamber pressure was about 3 atm.
実施例5゜
第4図に示す装置を用い、バルブ8よりメタン100
ml/11とアルゴン21/+の混合ガス、8′よりア
ルゴン31/m、8′よりアルゴンIOC/+と水素3
.51/mの混合ガスを流し、2.45 GHz、 4
.7 kHのマイクロ波放電を10分間行い、シリコン
基板上に厚さ7μmのダイヤモンド膜を得た。ノズル径
は3鶴、析出室圧力は0.1気圧、基板温度は890℃
であった。Example 5 Using the apparatus shown in FIG. 4, methane 100
Mixed gas of ml/11 and argon 21/+, argon 31/m from 8', argon IOC/+ and hydrogen 3 from 8'
.. Flowing a mixed gas of 51/m, 2.45 GHz, 4
.. Microwave discharge at 7 kHz was performed for 10 minutes to obtain a diamond film with a thickness of 7 μm on the silicon substrate. The nozzle diameter is 3 cranes, the precipitation chamber pressure is 0.1 atm, and the substrate temperature is 890°C.
Met.
発明の効果
本発明の方法によると、高温のプラズマを用いて、ダイ
ヤモンドを合成する際に、水冷、ガス吹き付は等による
基体の冷却、あるいはガス注入による成長空間の冷却が
不必要となり、成長温度のより均一な分布を得ることが
でき、これにより性質の均一な膜、結晶または粒度、性
状の揃った微粉体が得られる優れた作用効果を奏し得ら
れる。Effects of the Invention According to the method of the present invention, when synthesizing diamond using high-temperature plasma, it is not necessary to cool the substrate by water cooling, gas blowing, etc., or to cool the growth space by gas injection. It is possible to obtain a more uniform temperature distribution, thereby achieving an excellent effect of obtaining a film with uniform properties, crystals, or fine powder with uniform particle size and properties.
図面は本発明の方法を実施する装置の概要図で、第1図
は直流放電、第2図は交流放電、第3図は高周波放電、
第4図はマイクロ波放電を用いてプラズマを発生させて
ダイヤモンドの合成を行う装置の実施態様図である。
1:直流プラズマトーチ、
2:直流電源、 3:基体、
4:ノズルまたはオリフィス、
5:プラズマ発生室、 5′ :析出室、6:排気装置
、 7:ガス供給装置、8.8’、81:バルブ
、
11:電掻、 12:交流電源、21:高周
波プラズマトーチ、
22:高周波電源、 23:ワークコイル、24:
固体、液体原料の導入装置、
25:受は皿、
31:マイクロ波プラズマトーチ、
32:マイクロ波発振機、33:4波管。
第 7 図
第 2 m
第 3 図
第 チ 図゛The drawings are schematic diagrams of the apparatus for carrying out the method of the present invention, in which Fig. 1 shows DC discharge, Fig. 2 shows AC discharge, Fig. 3 shows high-frequency discharge,
FIG. 4 is an embodiment of an apparatus for synthesizing diamond by generating plasma using microwave discharge. 1: DC plasma torch, 2: DC power supply, 3: Substrate, 4: Nozzle or orifice, 5: Plasma generation chamber, 5': Deposition chamber, 6: Exhaust device, 7: Gas supply device, 8.8', 81 : Valve, 11: Electric scraper, 12: AC power supply, 21: High frequency plasma torch, 22: High frequency power supply, 23: Work coil, 24:
Introducing device for solid and liquid raw materials, 25: Receiving dish, 31: Microwave plasma torch, 32: Microwave oscillator, 33: 4-wave tube. Figure 7 Figure 2 m Figure 3 Figure H
Claims (1)
独ガスまたは混合ガスに、放電によりプラズマを発生さ
せ、該プラズマ中で有機化合物または炭素材を分解また
は蒸発させて得られる気体を、断熱膨張させることによ
り、ダイヤモンドを基体上あるいは気相中で析出させる
ことを特徴とするプラズマを用いるダイヤモンドの合成
法。Plasma is generated by electric discharge in a single gas or a mixture of gases selected from hydrocarbon gas, hydrogen gas, and inert gas, and the gas obtained by decomposing or evaporating organic compounds or carbon materials in the plasma is adiabatically expanded. A method of synthesizing diamond using plasma, which is characterized by depositing diamond on a substrate or in a gas phase by
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61252391A JPS63107898A (en) | 1986-10-23 | 1986-10-23 | Method for synthesizing diamond with plasma |
US07/109,509 US4767608A (en) | 1986-10-23 | 1987-10-19 | Method for synthesizing diamond by using plasma |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61252391A JPS63107898A (en) | 1986-10-23 | 1986-10-23 | Method for synthesizing diamond with plasma |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63107898A true JPS63107898A (en) | 1988-05-12 |
JPH0346436B2 JPH0346436B2 (en) | 1991-07-16 |
Family
ID=17236672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61252391A Granted JPS63107898A (en) | 1986-10-23 | 1986-10-23 | Method for synthesizing diamond with plasma |
Country Status (2)
Country | Link |
---|---|
US (1) | US4767608A (en) |
JP (1) | JPS63107898A (en) |
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-
1986
- 1986-10-23 JP JP61252391A patent/JPS63107898A/en active Granted
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1987
- 1987-10-19 US US07/109,509 patent/US4767608A/en not_active Expired - Lifetime
Cited By (4)
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JPH07300394A (en) * | 1988-02-01 | 1995-11-14 | Sumitomo Electric Ind Ltd | Diamond and its vapor-phase synthesis |
JPH07305173A (en) * | 1994-03-17 | 1995-11-21 | Shin Etsu Chem Co Ltd | Production of body having superhard carbon film and device therefor |
JPH0978240A (en) * | 1995-09-12 | 1997-03-25 | Shin Etsu Chem Co Ltd | Hard carbon film forming device and production of hard carbon film forming substrate |
JP2018146668A (en) * | 2017-03-02 | 2018-09-20 | 旭化成株式会社 | Pellicle film and manufacturing method of pellicle film |
Also Published As
Publication number | Publication date |
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JPH0346436B2 (en) | 1991-07-16 |
US4767608A (en) | 1988-08-30 |
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