JPS62241394A - Soldering apparatus - Google Patents
Soldering apparatusInfo
- Publication number
- JPS62241394A JPS62241394A JP8382986A JP8382986A JPS62241394A JP S62241394 A JPS62241394 A JP S62241394A JP 8382986 A JP8382986 A JP 8382986A JP 8382986 A JP8382986 A JP 8382986A JP S62241394 A JPS62241394 A JP S62241394A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- soldering
- container
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 19
- 239000004020 conductor Substances 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は例えば各種電子機器に使用される印刷配線板
にフラットパッケージ形集積回路を搭載するのに好適す
る半田付装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a soldering device suitable for mounting flat package integrated circuits on printed wiring boards used, for example, in various electronic devices.
（従来の技術）
周知のように、フラットパッケージ形集積回路（以下、
ＩＣと記す）は例えば第４図に水子ようにパッケージ１
０に対して複数の接続用リード１０ａが所定の間隔を有
して四方向に延出されている。そこで、このようなＩＣ
を印刷配線板に搭載する場合は、その各リード１０ａを
印刷配線板の所定の導体パターンに一本づつ半田付する
ことで行なわれている。(Prior art) As is well known, flat package integrated circuits (hereinafter referred to as
IC) is package 1 as shown in Figure 4, for example.
0, a plurality of connection leads 10a extend in four directions with predetermined intervals. Therefore, such an IC
When mounted on a printed wiring board, each lead 10a is soldered one by one to a predetermined conductor pattern on the printed wiring board.
ところが、上記ＩＣは、その複数のリードＩＱａが狭い
間隔で配置される構成上、印刷配線板の導体パターンに
対して半田付する際に、その位置決めが非常に難しく、
しかも、その作業が非常に面倒なために、ブリッジが生
じ易く、短絡が生じるという問題を有していた。However, since the above-mentioned IC has a structure in which the plurality of leads IQa are arranged at narrow intervals, it is very difficult to position them when soldering them to the conductor pattern of the printed wiring board.
Moreover, since the work is very troublesome, there are problems in that bridges are likely to occur and short circuits occur.
（発明が解決しようとする問題点）
この発明は上記の事情に鑑みてなされたもので、簡易な
構成を確保したうえで、作業性の向上を図り得、しかも
高精度な半田付を実現し得るようにした半田付装置を提
供することを目的とする。(Problems to be Solved by the Invention) This invention was made in view of the above circumstances, and it is possible to improve workability while ensuring a simple configuration, and to achieve high-precision soldering. It is an object of the present invention to provide a soldering device that achieves the desired results.
（問題点を解決するため手段及び作用）この発明は印刷
配線板に搭載したフラットパッケージ形集積回路上に被
せられる耐熱フィルムと、前記集積回路上に前記耐熱フ
ィルムの被せた前記印刷配線板が収容される容器と、こ
の容器内を略真空に吸引して前記耐熱フィルムを前記印
刷配線板の導体パターン間に密着させて介挿する吸引手
段と、この吸引手段で吸引した前記容器を加熱して前記
集積回路のリードを前記印刷配線板の半田部に半田付す
る加熱手段とを備えることにより、前記集積回路のリー
ドを前記耐熱フィルムにより位置決めした状態で、前記
印刷配線板の複数の導体パターンに形成される半田部に
半田付するようにしたものである。(Means and effects for solving the problems) The present invention includes a heat-resistant film that is placed over a flat package integrated circuit mounted on a printed wiring board, and a printed wiring board that is covered with the heat-resistant film on the integrated circuit. a container in which a vacuum is applied, a suction means for sucking the inside of the container to a substantially vacuum state and inserting the heat-resistant film in close contact between the conductor patterns of the printed wiring board, and heating the container sucked by the suction means. and heating means for soldering the leads of the integrated circuit to the solder portions of the printed wiring board, so that the leads of the integrated circuit can be attached to the plurality of conductor patterns of the printed wiring board while the leads of the integrated circuit are positioned by the heat-resistant film. The solder portion is soldered to the formed solder portion.
（実施例）
以下、この発明の実施例について、図面を参照して詳細
に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第１図はこの発明の一実施例に係る半田付装置を余すも
ので、図中１１は半田付用加熱装置で、その恒温Ｆｆｊ
１２には例えば複数の容器１３が装着される。この容器
１３は第２図に示すようにプラテンと称する基台１４に
１００μ程度のシリコンゴム等のフィルムで形成される
外囲部１５が密閉状に形成され、この外囲部１５内には
ガラスフェルト等で形成される通風・クッション用のブ
リーダと称する内壁部１６が取着される。そして、上記
基台１４には真空吸引用の吸引弁１７が設けられ、この
吸引弁１７には真空ポンプ等の吸引装置１８がチューブ
等の連結部材１９を介して着脱自在に連結される。この
吸引弁１７はその吸引装置１８による容器１３内の吸引
が完了して連結部材１９が離脱れると、自動的に閉塞状
態となされる。FIG. 1 shows the remainder of a soldering device according to an embodiment of the present invention, in which reference numeral 11 denotes a soldering heating device whose constant temperature Ffj
For example, a plurality of containers 13 are attached to the container 12 . As shown in FIG. 2, this container 13 has a base 14 called a platen, and a sealed outer envelope 15 made of a film of silicone rubber or the like with a thickness of about 100 μm. An inner wall portion 16 called a bleeder for ventilation and cushioning is attached, which is made of felt or the like. The base 14 is provided with a suction valve 17 for vacuum suction, and a suction device 18 such as a vacuum pump is detachably connected to the suction valve 17 via a connecting member 19 such as a tube. The suction valve 17 is automatically closed when the suction device 18 completes suctioning the inside of the container 13 and the connecting member 19 is removed.
また、上記容器１３内には例えば２枚の印刷配線板２０
が収容される。この印刷配線板２０はそれぞれ複数の導
体パターン２０ａが形成され、この導体パターン２０ａ
にはそれぞれ例えばフラックスの含存された低温用の半
田が取着された接続用半田部２１が上述したＩＣのり−
ド１０ａに対応して設けられる。この印刷配線板２０に
は上記ＩＣがそのリード１０ａを導体パターン２０ａの
半田部２１に例えば熱によりガス化する接着材を用いて
接着した状態で搭載され、このＩＣ上にはナイロンキャ
ストフィルム、ポリイミドフィルム等の耐熱性を有する
耐熱フィルム２２が被せられる。そして、この耐熱フィ
ルム２２をＩＣ上に被せた印刷配線板２０は一対のアル
ミニュウム製の度付は台２３及びシリコンゴム製の押え
治具２４を用いて２枚が上記容器１３内に収容される。Further, in the container 13, there are, for example, two printed wiring boards 20.
is accommodated. Each printed wiring board 20 has a plurality of conductor patterns 20a formed thereon, and the conductor patterns 20a
The connection solder portions 21 each have a low-temperature solder containing flux, for example, attached to the above-mentioned IC glue.
It is provided corresponding to the card 10a. The above-mentioned IC is mounted on this printed wiring board 20 with its leads 10a adhered to the solder portions 21 of the conductor pattern 20a using, for example, an adhesive that gasifies when heated. A heat-resistant film 22 having heat resistance such as a film is covered. Then, two pieces of the printed wiring board 20 with the heat-resistant film 22 placed on the IC are housed in the container 13 using a pair of aluminum pads 23 and a silicone rubber holding jig 24. .
この場合、取付は台２３と印刷配線板２０との間には例
えば５０〜１００μの耐熱性を有した剥離フィルム２５
が介在され、その最上部の押え治具２４上には押え部材
２６が設置される。In this case, a release film 25 with a heat resistance of 50 to 100μ, for example, is installed between the base 23 and the printed wiring board 20.
is interposed therebetween, and a presser member 26 is installed on the uppermost presser jig 24.
上記構成において、半田付する場合は、先ずＩＣのリー
ド１０ａを印刷配線板２０の半田部２１に接着材を用い
て接着して位置決めして、耐熱フィルム２２を被せると
共に、剥離フィルム２５、取付は台２３及び押え部材２
４を用いて容器１３内に収容させる。次に、容器１３の
吸引弁１７に対して吸引装置１８の連結部材１９を取着
して内部を略真空状に吸引する。すると、印刷配線板２
０に搭載した耐熱フィルム２２は第３図に示すように印
刷配線板２０の導体パターン２０ａ間に密着状態に介挿
されて各導体パターン２０ａを隔離する。ここで、上記
容器１３はその吸引弁１７から吸引装置１８の連結部材
１９が離脱されて第１図に示すように加熱装置１１の恒
温槽１２に収容され、例えば２００＠Ｃ程度に加熱され
る。In the above configuration, when soldering, the IC leads 10a are first bonded and positioned to the solder portions 21 of the printed wiring board 20 using an adhesive, and the heat-resistant film 22 is covered, and the release film 25 is attached. Stand 23 and presser member 2
4 to accommodate it in the container 13. Next, the connecting member 19 of the suction device 18 is attached to the suction valve 17 of the container 13, and the inside is suctioned into a substantially vacuum state. Then, printed wiring board 2
As shown in FIG. 3, the heat-resistant film 22 mounted on the printed circuit board 20 is closely inserted between the conductor patterns 20a of the printed wiring board 20, thereby isolating each conductor pattern 20a. Here, the connecting member 19 of the suction device 18 is detached from the suction valve 17 of the container 13, and as shown in FIG. .
これにより、印刷配線板２０はその半田部２１が溶解さ
れてＩＣのリード１０ａと導体パターン２０ａが半田付
される。この際、半田部にＩＣのリードを接着した接着
材は加熱装置１１により加熱されることでガス化されて
半田付に影響を与えることがない。As a result, the solder portions 21 of the printed wiring board 20 are melted, and the IC leads 10a and the conductive patterns 20a are soldered. At this time, the adhesive that adheres the IC leads to the solder portion is heated by the heating device 11 and gasified, so that it does not affect the soldering.
このように、上記半田付装置は印刷配線板２０の導体パ
ターン２０ａの半田部２１にＩＣのり一ド１０ａを対向
させて耐熱フィルム２２を被せた状態で容器１３に収容
し、この容器上ユ内を略真空状に吸引して耐熱フィルム
２２を上記導体パターン２０ａ間に密着する如く介挿さ
せた後、容器１３を加熱して導体パターン２０ａとＩＣ
のり−ド１０ａを半田付するように構成したので、従来
のような半田ブリッジが確実に防止されると共に、導体
パターン２Ｏａ間の短絡が確実に防止されることで、半
田付の信頼性が向上される。また、これによれば、ＩＣ
の複数のり−ド１０ａが印刷配線板２０の導体パターン
２０ａの半田部２１に対して同時に半田付されることで
、その作業性の向上も図ることができる。In this manner, the soldering apparatus is housed in the container 13 with the IC glue 10a facing the solder portion 21 of the conductor pattern 20a of the printed wiring board 20 and covered with the heat-resistant film 22. After the heat-resistant film 22 is inserted between the conductor patterns 20a so as to be in close contact with each other by suctioning the conductor pattern 20a into a substantially vacuum state, the container 13 is heated to separate the conductor patterns 20a and the IC.
Since the glue wire 10a is configured to be soldered, solder bridges as in the conventional case are reliably prevented, and short circuits between the conductor patterns 2Oa are reliably prevented, thereby improving the reliability of soldering. be done. Also, according to this, the IC
By simultaneously soldering the plurality of glues 10a to the solder portions 21 of the conductor pattern 20a of the printed wiring board 20, it is possible to improve the workability.
なお、この発明は上記実施例に限ることなく、その他、
この発明の要旨を逸脱しな範囲で、種々の変形を実施し
得ることはいうまでもないことである。Note that this invention is not limited to the above embodiments, but also includes
It goes without saying that various modifications can be made without departing from the scope of the invention.
（発明の効果）
以上詳述したように、この発明によれば、簡易な構成を
確保したうえで、作業性の向上を図り得、しかも高精度
な半田付を実現し得るようにした半田付装置を提供する
ことができる。(Effects of the Invention) As described in detail above, according to the present invention, a soldering method is provided that ensures a simple configuration, improves workability, and realizes high-precision soldering. equipment can be provided.
第１図はこの発明の一実施例に係る半田付装置を示す構
成説明図、第２図は第１図の要部を示す詳細構成図、第
３図は第２図の動作を説明するために示した動作状態図
、第４図はこの発明の適用されるフラットパッケージ形
集積回路を示す構成図である。
１０・・・パッケージ、１０ａ・・・リード、１１・・
・加熱装置、１２・・・恒温槽、１３・・・容器、１４
・・・基台、１５・・・外囲部、１６・・・内壁部、１
７・・・吸引弁、１８・・・吸引装置、１９・・・連結
部材、２０・・・印刷配線板、２０ａ・・・導体パター
ン、２１・・・半田部、２２・・・耐熱フィルム、２３
・・・取付は台、２４・・・押え治具、２５・・・剥離
フィルム、２６・・・押え部材。FIG. 1 is a configuration explanatory diagram showing a soldering device according to an embodiment of the present invention, FIG. 2 is a detailed configuration diagram showing the main parts of FIG. 1, and FIG. 3 is for explaining the operation of FIG. 2. FIG. 4 is a configuration diagram showing a flat package integrated circuit to which the present invention is applied. 10...Package, 10a...Lead, 11...
・Heating device, 12... constant temperature bath, 13... container, 14
...Base, 15...Outer enclosure, 16...Inner wall, 1
7... Suction valve, 18... Suction device, 19... Connecting member, 20... Printed wiring board, 20a... Conductor pattern, 21... Solder part, 22... Heat resistant film, 23
... Mounting is a stand, 24... Holding jig, 25... Peeling film, 26... Holding member.
Claims (1)
の複数の導体パターンに形成される半田部に半田付する
装置であって、前記集積回路上に被せられる耐熱フィル
ムと、前記集積回路上に前記耐熱フィルムの被せた前記
印刷配線板が収容される容器と、この容器内を略真空に
吸引して前記耐熱フィルムを前記印刷配線板の導体パタ
ーン間に密着させて介挿する吸引手段と、この吸引手段
で吸引した前記容器を加熱して前記集積回路のリードを
前記印刷配線板の半田部に半田付する加熱手段とを具備
したことを特徴とする半田付装置。An apparatus for soldering leads of a flat package integrated circuit to solder portions formed on a plurality of conductor patterns of a printed wiring board, the apparatus comprising: a heat-resistant film placed over the integrated circuit; and a heat-resistant film placed over the integrated circuit. a container in which the printed wiring board covered with is housed; a suction means for sucking the inside of the container to a substantially vacuum state and inserting the heat-resistant film in close contact between the conductor patterns of the printed wiring board; and the suction means. 1. A soldering device comprising: heating means for heating the container sucked by the vacuum cleaner and soldering the leads of the integrated circuit to the solder portions of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8382986A JPS62241394A (en) | 1986-04-11 | 1986-04-11 | Soldering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8382986A JPS62241394A (en) | 1986-04-11 | 1986-04-11 | Soldering apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62241394A true JPS62241394A (en) | 1987-10-22 |
Family
ID=13813582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8382986A Pending JPS62241394A (en) | 1986-04-11 | 1986-04-11 | Soldering apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62241394A (en) |
-
1986
- 1986-04-11 JP JP8382986A patent/JPS62241394A/en active Pending
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