JPS62235480A - Electromagnetic shielding material - Google Patents
Electromagnetic shielding materialInfo
- Publication number
- JPS62235480A JPS62235480A JP7773886A JP7773886A JPS62235480A JP S62235480 A JPS62235480 A JP S62235480A JP 7773886 A JP7773886 A JP 7773886A JP 7773886 A JP7773886 A JP 7773886A JP S62235480 A JPS62235480 A JP S62235480A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- foil
- electromagnetic shielding
- metal
- shielding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 27
- 239000011888 foil Substances 0.000 claims abstract description 24
- 238000005530 etching Methods 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 39
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract description 6
- 238000007650 screen-printing Methods 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 238000005238 degreasing Methods 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 238000005554 pickling Methods 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 abstract 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 abstract 1
- 238000000034 method Methods 0.000 description 21
- 239000000805 composite resin Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、金属箔よりなる、薄く生産性の良い電磁遮蔽
材に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a thin and highly productive electromagnetic shielding material made of metal foil.
〈従来の技術〉
電磁遮蔽材は例えば電子機器の筐体に使用され、外部の
妨害電波から電子回路を保護すると共に、発振回路等か
ら発生する不要な電波が外部に漏洩するのを防止する。<Prior Art> Electromagnetic shielding materials are used, for example, in the housings of electronic devices to protect electronic circuits from external interference radio waves and to prevent unnecessary radio waves generated from oscillation circuits and the like from leaking to the outside.
電子機器が金属製筐体の場合は、開口部、隙間の対策だ
けを考えれば材料そののもののシールド効果という点で
は全く問題ない。しかし、プラスチック筐体の場合は、
何らかのシールド対策が必要になる。If the electronic device has a metal casing, there is no problem at all in terms of the shielding effect of the material itself, as long as measures are taken to prevent openings and gaps. However, in the case of a plastic case,
Some kind of shielding measures will be required.
プラスチック筐体に使用されるシールド方法としては、
導電性塗料あるいは金属を塗布又はメッキする方法、金
属粉、金属フレーク、金属繊維などを混入した導電性複
合樹脂材をもって筐体を一体成形する方法、金属メツシ
ュ、エキスバンドメタル、金属箔ラミネート材を用いる
方法がある。Shielding methods used for plastic casings include:
A method of applying or plating conductive paint or metal, a method of integrally molding the casing using a conductive composite resin material mixed with metal powder, metal flakes, metal fibers, etc., a method of integrally molding the housing with a conductive composite resin material mixed with metal powder, metal flakes, metal fibers, etc., a method of using metal mesh, expanded metal, and metal foil laminate materials. There is a method to use.
これらの方法は、それぞれ用途に応じて使用される。Each of these methods is used depending on the purpose.
導電性塗料あるいは金属を塗布又はメッキする方法は、
シールド方法としては簡単な方法であるが、塗１漠厚さ
などの点でそれほど大きなシールド効果は期待できない
他、剥曙の心配、銅系塗料では酸化に伴う経年変化など
の心配がある。The method of applying or plating conductive paint or metal is
Although this is a simple method for shielding, it cannot be expected to have a great shielding effect due to the thickness of the coating, and there are also concerns about peeling, and with copper-based paints, there are concerns about deterioration over time due to oxidation.
このことから、電子機器の筐体に使用されるシールド方
法としては、導電性複合樹脂材をもって筐体を一体成形
する方法、およびｎｆ記した金属製シールド材を用いる
方法が一般に使用される。For this reason, as a shielding method used for the housing of an electronic device, a method of integrally molding the housing with a conductive composite resin material, and a method of using a metal shielding material as described in nf are generally used.
ここで、導電性複合樹脂材による方法は加工や成形が容
易であるが、電磁遮蔽性が十分でないという欠点がある
。Here, the method using a conductive composite resin material is easy to process and mold, but has the drawback that electromagnetic shielding properties are insufficient.
これに対し、金属製シールド材は優れた電磁遮蔽効果を
有している反面、比重が大きくしかも加工性や成形性に
劣る欠点がある。On the other hand, although metal shielding materials have excellent electromagnetic shielding effects, they have the drawbacks of high specific gravity and poor workability and moldability.
金属製シールド材のＬ記欠点を解決するために、金属を
機械加工により粉末あるいは多孔質とし軽量化、成形性
を良くする方法がある。金属メツシュ、エキスバンドメ
タル、金属箔ラミネート材を用いる方法は結局軽量化を
ねらったものである。In order to solve the disadvantages of metal shielding materials, there is a method of machining the metal into powder or porous material to reduce weight and improve moldability. The methods of using metal mesh, expanded metal, and metal foil laminates are aimed at reducing weight.
しかし、機械加工により粉末あるいは多孔質とし軽量化
する方法では、薄い金属の加工が困難である。また多様
なパターンの作成は金型の費用がかかり、金型の製作期
間に長時間を要する等の面から困難である。However, it is difficult to process thin metals by machining them into powder or porous materials to reduce their weight. Further, it is difficult to create various patterns because the molds are expensive and the manufacturing period of the molds takes a long time.
〈発明か解決しようとする問題点〉
本発明の目的は、首記した従来技術の欠点を解消し、薄
く生産性の良い電磁遮蔽材を提供することにある。<Problems to be Solved by the Invention> An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art and to provide a thin electromagnetic shielding material with good productivity.
〈問題点を解決するための手段〉
すなわち本発明は、導電性金属箔にエツチングレジスト
を塗布し、エツチングにより、小開口部を多数有するパ
ターンを形成してなることを特徴とする電磁遮蔽材を提
供するものである。<Means for Solving the Problems> That is, the present invention provides an electromagnetic shielding material characterized by applying an etching resist to a conductive metal foil and forming a pattern having a large number of small openings by etching. This is what we provide.
ここで而記小開口部の合計面積が、而記パターンの全面
積の３０〜７０％であることが良い。Here, the total area of the small openings is preferably 30 to 70% of the total area of the pattern.
〈発明の構成〉
以下に第１図に示す好適実施例を用いて、本発明を詳述
する。<Configuration of the Invention> The present invention will be described in detail below using a preferred embodiment shown in FIG.
第１図は、小開口部ｌを多数有する金属箔２よりなる本
発明の電磁遮蔽材の１実施例の平面図を示す。FIG. 1 shows a plan view of an embodiment of the electromagnetic shielding material of the present invention, which is made of a metal foil 2 having a large number of small openings l.
金属箔２は導電性の良好な金属であればいかなる金属合
金を用いてもよいが、代表的には、銀、銅、ニッケル等
を挙げることができる。The metal foil 2 may be made of any metal alloy as long as it has good conductivity; typical examples include silver, copper, and nickel.
金属箔２の厚さは、成形性、加工性、軽量性、機械的強
度の点から、３５μ〜５０μが好ましいが、これに限定
されるものではない。The thickness of the metal foil 2 is preferably 35 μm to 50 μm from the viewpoint of moldability, workability, lightness, and mechanical strength, but is not limited thereto.
小開口部１の形状はいかなる形状でもよいが、小開口部
ｌが金属箔２の表面積の３０〜７０％の面積とすること
が好ましい。Although the small opening 1 may have any shape, it is preferable that the small opening 1 has an area of 30 to 70% of the surface area of the metal foil 2.
３０％未満であると、電磁遮蔽効果は良いが成形性が悪
化する。一方７０％超では成形性は良いが電磁遮蔽効果
が劣る。If it is less than 30%, the electromagnetic shielding effect is good, but the moldability deteriorates. On the other hand, if it exceeds 70%, the moldability is good but the electromagnetic shielding effect is poor.
金属箔２に上述の小開口部１を有する所望のパターンを
形成するには、第２図に示すように、エツチングレジス
トをスクリーン印刷を用いて塗布し、以下のようにして
行う。In order to form the desired pattern having the above-mentioned small openings 1 on the metal foil 2, as shown in FIG. 2, an etching resist is applied using screen printing, and the process is carried out as follows.
金属箔２を適切な萌処理後、材料金属に応じたレジスト
インク３をスクリーン印刷を用いて金属Ｔ４２に塗布す
る。After the metal foil 2 has been subjected to an appropriate mowing treatment, a resist ink 3 corresponding to the material metal is applied to the metal T 42 using screen printing.
次にレジストインク３を乾燥後、エツチング剤に浸漬処
理し、あるいはエツチング剤をスプレー塗布するエツチ
ングにより金属露出部を溶解し、レジストインク３を除
去し、乾燥後電磁遮蔽材とする。Next, after drying the resist ink 3, the exposed metal portion is dissolved by etching by immersion in an etching agent or by spraying an etching agent, and the resist ink 3 is removed. After drying, an electromagnetic shielding material is obtained.
面処理条件、レジストインク、エツチング、レジスト除
去、その他の製造条件は材料金属の種類等に応して適切
に選択する。Surface treatment conditions, resist ink, etching, resist removal, and other manufacturing conditions are appropriately selected depending on the type of material metal.
以トの説明では、エツチングレジストをスクリーン印刷
してエツチングを行う場合について説明したがフォトレ
ジストによるフォトマスクを使ったエツチング方法等の
他のエツチング方法を用いてもよい。In the following explanation, etching is performed by screen printing an etching resist, but other etching methods such as an etching method using a photomask made of photoresist may also be used.
〈実施例〉 以下に実施例を用いて更に具体的に説明する。<Example> This will be explained in more detail below using Examples.
厚さ５０μの銅箔に脱脂・酸洗の前処理をした後、必要
部にレジストインク（Ｘ−６６太陽インキ製）をスクリ
ーン印刷、乾燥し、 ＦｅＣｊｌ！３液でスプレーする
エツチングにより不要部を溶解後、５％ＮａＯＨ水溶液
でレジストを剥離し、第１図に示すパターンを形成した
。この電＆ｆｉ遮蔽材の小開口部１の面積比は６０％で
あった。After pre-treating a 50μ thick copper foil by degreasing and pickling, screen print resist ink (X-66 Taiyo Ink) on the necessary areas, dry it, and print FeCjl! After dissolving unnecessary parts by spray etching with three liquids, the resist was peeled off with a 5% NaOH aqueous solution to form the pattern shown in FIG. The area ratio of the small opening 1 of this electric & fi shielding material was 60%.
〈発明の効果〉
本発明の電磁遮蔽材は、エツチングにより金属箔に所望
のパターン形成してなるもので、この構成によれば金属
箔を用いての多孔質の電磁遮蔽材の製造が可能であり、
製造が容易であると共に薄い金属箔として電磁遮蔽効果
が高く、多様なパターンを持つ多種類の金属箔遮蔽材と
して安価に効率良く提供することができる。<Effects of the Invention> The electromagnetic shielding material of the present invention is formed by forming a desired pattern on metal foil by etching, and with this configuration, it is possible to manufacture a porous electromagnetic shielding material using metal foil. can be,
It is easy to manufacture, has a high electromagnetic shielding effect as a thin metal foil, and can be efficiently provided at low cost as a wide variety of metal foil shielding materials with various patterns.
また、スクリーンマスクを変更するだけで、いかなるパ
ターンも容易に作成でき、所望の開口部比率をもった電
磁遮蔽材がきわめて簡単に得られる。Moreover, any pattern can be easily created by simply changing the screen mask, and an electromagnetic shielding material with a desired opening ratio can be obtained very easily.
第１図は、本発明電磁遮蔽材の一実施例を示す平面図で
ある。
第２図は、金属箔のエツチング工程を説明する模式図で
ある。
符号の説明
ｌ・・・・小開口部、
２・・・・金属箔、
３・・・・レシストインクFIG. 1 is a plan view showing an embodiment of the electromagnetic shielding material of the present invention. FIG. 2 is a schematic diagram illustrating the etching process of metal foil. Explanation of symbols 1...Small opening, 2...Metal foil, 3...Resist ink
Claims (2)
ッチングにより、小開口部を多数有するパターンを形成
してなることを特徴とする電磁遮蔽材。(1) An electromagnetic shielding material characterized by applying an etching resist to a conductive metal foil and etching it to form a pattern having many small openings.
積の３０〜７０％である特許請求の範囲第１項に記載の
電磁遮蔽材。(2) The electromagnetic shielding material according to claim 1, wherein the total area of the small openings is 30 to 70% of the total area of the pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7773886A JPS62235480A (en) | 1986-04-04 | 1986-04-04 | Electromagnetic shielding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7773886A JPS62235480A (en) | 1986-04-04 | 1986-04-04 | Electromagnetic shielding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62235480A true JPS62235480A (en) | 1987-10-15 |
Family
ID=13642248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7773886A Pending JPS62235480A (en) | 1986-04-04 | 1986-04-04 | Electromagnetic shielding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62235480A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2638596A1 (en) * | 1988-10-28 | 1990-05-04 | Thomson Csf | METHOD OF MAKING AN ARMOR SHIELD, SHIELD OBTAINED BY THIS METHOD, AND ELECTRONIC EQUIPMENT COMPRISING THE SHIELDING |
-
1986
- 1986-04-04 JP JP7773886A patent/JPS62235480A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2638596A1 (en) * | 1988-10-28 | 1990-05-04 | Thomson Csf | METHOD OF MAKING AN ARMOR SHIELD, SHIELD OBTAINED BY THIS METHOD, AND ELECTRONIC EQUIPMENT COMPRISING THE SHIELDING |
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