JPS6223467U - - Google Patents

Info

Publication number
JPS6223467U
JPS6223467U JP1985115167U JP11516785U JPS6223467U JP S6223467 U JPS6223467 U JP S6223467U JP 1985115167 U JP1985115167 U JP 1985115167U JP 11516785 U JP11516785 U JP 11516785U JP S6223467 U JPS6223467 U JP S6223467U
Authority
JP
Japan
Prior art keywords
led
light emitting
emitting diode
electrode plate
diode chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985115167U
Other languages
Japanese (ja)
Other versions
JPH0414945Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985115167U priority Critical patent/JPH0414945Y2/ja
Publication of JPS6223467U publication Critical patent/JPS6223467U/ja
Application granted granted Critical
Publication of JPH0414945Y2 publication Critical patent/JPH0414945Y2/ja
Expired legal-status Critical Current

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａは、本考案のＬＥＤランプの第１の実
施例を示す平面図、第１図Ｂは、第１図ＡのＡ―
Ａ線における断面図、第１図Ｃは、第１図ＡのＢ
―Ｂ線における断面図、第２図は、第１の実施例
のＬＥＤランプの回路を示す図、第３図Ａは、第
１の実施例のＬＥＤランプの製法に用いられるリ
ードフレームの平面図、第３図Ｂは、同リードフ
レームに反射ケース及び結合部がインサートモー
ルド成形された状態を示す図、第４図は、第１の
実施例のＬＥＤランプを光源用ＬＥＤランプ装置
に実装させる状態を示す斜視図、第５図Ａは、第
２の実施例のＬＥＤランプの製法に用いられるリ
ードフレームの平面図、第５図Ｂは、同リードフ
レームに反射ケース及び結合部がインサートモー
ルド成形された状態を示す図である。 １……ＬＥＤランプ、２……単位ＬＥＤランプ
、３……結合部、４……反射ケース、５……電極
板、６……発光ダイオードチツプ（ＬＥＤチツプ
）、７……外部リード。 FIG. 1A is a plan view showing the first embodiment of the LED lamp of the present invention, and FIG.
A cross-sectional view taken along line A, Figure 1C, is B of Figure 1A.
-A cross-sectional view taken along line B; FIG. 2 is a diagram showing the circuit of the LED lamp of the first embodiment; FIG. 3A is a plan view of the lead frame used in the manufacturing method of the LED lamp of the first embodiment. , FIG. 3B shows a state in which a reflective case and a coupling part are formed by insert molding on the same lead frame, and FIG. 4 shows a state in which the LED lamp of the first embodiment is mounted in an LED lamp device for a light source. FIG. 5A is a plan view of a lead frame used in the manufacturing method of the LED lamp of the second embodiment, and FIG. FIG. DESCRIPTION OF SYMBOLS 1... LED lamp, 2... Unit LED lamp, 3... Coupling part, 4... Reflection case, 5... Electrode plate, 6... Light emitting diode chip (LED chip), 7... External lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外部リードを有する電極板上に発光ダイオード
チツプがボンデイングされ、該電極板と発光ダイ
オードチツプはＬＥＤランプの外殻をなす反射ケ
ース内に設けられてなる単位ＬＥＤランプが複数
個並設され、前記単位ＬＥＤランプ間は、前記反
射ケースの壁面の一部に一体に形成された結合部
を介して連結されていることを特徴とするＬＥＤ
ランプ。 A light emitting diode chip is bonded onto an electrode plate having an external lead, and the electrode plate and the light emitting diode chip are provided in a reflective case that forms an outer shell of the LED lamp. An LED characterized in that the LED lamps are connected via a joint formed integrally with a part of the wall surface of the reflective case.
lamp.
JP1985115167U 1985-07-29 1985-07-29 Expired JPH0414945Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985115167U JPH0414945Y2 (en) 1985-07-29 1985-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985115167U JPH0414945Y2 (en) 1985-07-29 1985-07-29

Publications (2)

Publication Number Publication Date
JPS6223467U true JPS6223467U (en) 1987-02-13
JPH0414945Y2 JPH0414945Y2 (en) 1992-04-03

Family

ID=30998562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985115167U Expired JPH0414945Y2 (en) 1985-07-29 1985-07-29

Country Status (1)

Country Link
JP (1) JPH0414945Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002089222A1 (en) * 2001-04-26 2002-11-07 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler
JP2006041379A (en) * 2004-07-29 2006-02-09 Nippon Leiz Co Ltd Light source device
US7380961B2 (en) 2002-04-24 2008-06-03 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler
JP2009200531A (en) * 2001-04-10 2009-09-03 Osram Opto Semiconductors Gmbh Leadframe and housing for radiation emitting component, radiation emitting component and method for manufacturing the component

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200531A (en) * 2001-04-10 2009-09-03 Osram Opto Semiconductors Gmbh Leadframe and housing for radiation emitting component, radiation emitting component and method for manufacturing the component
WO2002089222A1 (en) * 2001-04-26 2002-11-07 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufcturing light source coupler
US7380961B2 (en) 2002-04-24 2008-06-03 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler
JP2006041379A (en) * 2004-07-29 2006-02-09 Nippon Leiz Co Ltd Light source device
JP4556166B2 (en) * 2004-07-29 2010-10-06 ライツ・アドバンスト・テクノロジー株式会社 Light source device

Also Published As

Publication number Publication date
JPH0414945Y2 (en) 1992-04-03

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