JPS62233777A - Many wiring inspecting method - Google Patents

Abstract

PURPOSE:To remove restrictions on electrode constitution and to shorten an inspection time by dipping a substrate plating liquid and feeding electricity, and deciding whether the breaking of wire or short-circuit is caused or not from the formation state of a deposited plating layer. CONSTITUTION:A conductive tape 6 is stuck on one end of the electrode of the substrate 1 and all electrodes are connected in common. Then, the substrate 1 is dipped in the plating electrode except the part where the conductive tape 6 is stuck along with a metallic plate 2 and a DC voltage is applied. At this time, if there is the breaking of wire due to a defect in etching and a flaw at part of striped electrodes, the part is not plated. Consequently, it is decided from the formation state of this plating whether there is the breaking of wire or not and this wire breaking position is also marked by whether or not the part is plated or not, so the position is easily confirmed without using any special device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for inspecting disconnections of a substrate having a large number of electrodes formed in a stripe shape.

[Summary of the Disclosure] This specification and drawings describe a substrate having a large number of electrodes formed in a stripe shape, which is immersed in a plating solution and energized, and the formed state of the deposited plating layer causes disconnection or short circuit. By determining the presence or absence of , the test time can be shortened without being restricted by the electrode configuration.

[Prior Art] Conventionally, as this type of wire breakage inspection method, there is a method using a blobbing machine. This method is.

In this method, one end of the striped electrodes is all connected in common, and the other ends are sequentially connected using a pro bar to check the electrical continuity of each electrode.

[Problems to be Solved by the Invention] When 16/I1m (line 50Bm, space 12.5gm) stripe electrodes are formed on the short side of a glass substrate having an effective part of A4 size (210mm x 30Gmm), The number of electrodes is 3360. On the other hand, the scan speed of current general-purpose blobbing machines is 1
It took approximately one hour to inspect the board as described above, and after the inspection was completed, the position of the disconnection on the board had to be confirmed using a measurement tester or the like. Another drawback is that the configuration of the substrate to be measured is restricted by the movability of the blowing machine, the dimensions of the stage, and the like.

SUMMARY OF THE INVENTION An object of the present invention is to provide a multi-wiring inspection method that eliminates the drawbacks of the conventional example, is not limited by the electrode configuration of the measurement board, and shortens inspection time.

[Means for Solving the Problems] The present invention provides a substrate on which a large number of striped electrodes are provided, and an electrode substrate facing this substrate, which is immersed in a plating solution and a current is passed between the two electrodes. A plating layer is deposited on the stripe electrode, and the presence or absence of a disconnection or short circuit in the stripe electrode is determined from the state of formation of this plating layer.

[Function] If there is no abnormality in the striped electrode, the plating layer is uniformly formed on the electrode surface. On the other hand, if an electrode is disconnected for some reason, the plating layer is not formed in that portion, so it is possible to determine at once whether or not all electrodes are disconnected. Moreover, since the wire breakage point is directly marked by the presence or absence of the plating layer at the same time as this inspection, the location of the wire breakage can be easily confirmed.

[Example] FIG. 1 is a schematic configuration diagram showing an example of an apparatus used in the inspection method of the present invention. In Fig. 1, l is a substrate on which stripe electrodes are formed, and ■↑0 (Indium-Tin-O
A transparent electrode consisting of
6th tree/1III (line 50 Hiromu, space 12.5I
L layer) is formed in a stripe shape. 2 is a metal plate that becomes an anode during plating, 3 is a DC power supply for passing a current between the substrate 1 and the metal plate 2, the substrate 1 is a cathode, and the metal plate 2
is connected so that it becomes the anode. The polarities may be opposite to each other. 4 is a plating tank filled with a plating solution 5. The conditions of the copper sulfate bath in the case of general copper plating are shown below.

Composition: Copper sulfate 200-250 Cg/R) Sulfuric acid 4
0 to 80 (g#) Temperature: 20 to 50°C Current density = 2 to 8 (A/■2) In the above configuration, first, conductive tape 6 is attached to one end of the electrode of substrate 1, and all electrodes are 0 to connect in common
Next, leave the part where the conductive tape 6 has been pasted, and then
is immersed together with the metal plate 2 in the plating solution 5, and a DC voltage is applied under the above conditions. At this time, if there is no abnormality in the striped electrodes on the substrate 1, a normal potential will be generated in the part of the electrode immersed in the plating solution, a current will flow between it and the metal plate 2, and the electrode surface will be coated with copper uniformly. is plated. On the other hand, if a part of the stripe electrode is broken due to poor etching, scratches, etc., that part is not plated, and therefore whether or not there is a break can be determined by the state of the plating.

Furthermore, since the disconnection point is marked by the presence or absence of this plating, its position can be easily confirmed without using any special equipment.

Note that the copper plating formed on the substrate can be simply peeled off using a copper etching solution such as cupric chloride.

The inspection method according to the present invention can be used not only to inspect striped electrodes for disconnection, but also to inspect for short circuits with adjacent electrodes at the lead-out portions of staggered electrodes as shown in FIG. Furthermore, it can also be used to test for short circuits between upper and lower electrodes that are combined with a small interval.

Further, the testing method according to the present invention can be used without being limited to the type of electrode material by changing the components of the plating solution depending on the electrode material. Furthermore, the same effect as in the above embodiment can be obtained by generating an arbitrary current electric field by the potential generated at one end of the stripe electrode, and using a material 1 such as liquid crystal, heat-sensitive material, etc. whose shape changes due to the action of the electric field. I can do it.

[Effects of the Invention] As explained above, according to the present invention, it is possible to simultaneously confirm the presence or absence of disconnection of the stripe electrode and its position, and it is possible to significantly shorten the inspection process and inspection time. Furthermore, compared to conventional methods, a large number of electrodes can be tested simultaneously without being restricted by the configuration of the substrate to be measured (size, number of electrodes, electrode pitch, etc.). Furthermore, since a highly accurate device is not required, the inspection can be performed using simple and inexpensive equipment.

[Brief explanation of drawings]

Figure 1 is a schematic configuration diagram showing an example of the device, Figures 2 and 3 are
The figure is a diagram showing an example of the configuration of electrodes. l... Board, 2... Metal plate, 3... DC power supply, 4
... Plating tank, 5... Plating solution, 6... Conductive tape.

Claims (1)

[Claims] 1) After immersing a substrate with a large number of striped electrodes and an opposing electrode substrate in a plating solution, electricity is passed between the two electrodes to determine whether the striped electrodes are disconnected or shorted depending on the formation state of the deposited plating layer. A multiple wiring inspection method characterized by determining the presence or absence of wiring.