JPH0636006B2 - Multiple wiring inspection method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a disconnection inspection method for a substrate having a large number of electrodes formed in stripes.

[Summary of Disclosure] This specification and the drawings show a substrate having a large number of electrodes formed in stripes, which is immersed in a plating solution and energized to cause a disconnection or a short circuit depending on the state of the plated layer deposited. By determining the presence or absence of the above, it is possible to shorten the inspection time without being restricted by the electrode configuration.

[Prior Art] Conventionally, as a disconnection inspection method of this type, there is a method using a probing machine. In this method, one end of each of the striped electrodes is commonly connected, and the other end is sequentially connected by a probe bar to check the electrical continuity of each electrode.

[Problems to be solved by the invention] 16 / mm (line 50μm, space 12.5μ for the short side of a glass substrate with an effective part of A4 size (210mm x 300mm)
When the stripe electrode of m) is formed, the number of electrodes is 336.
It becomes 0. On the other hand, the scanning speed of a general-purpose probing machine at present is about 1 line / sec, and it takes about 1 hour to inspect the above-mentioned board. After the inspection, the disconnection position on the board must be confirmed with a measurement tester. I had to do it. Further, there is a drawback that the structure of the substrate to be measured is restricted by the moving performance of the probing machine, the stage size, and the like.

SUMMARY OF THE INVENTION It is an object of the present invention to eliminate the drawbacks of the above-mentioned conventional example, to provide a multi-wiring inspection method that is not restricted by the electrode configuration of the measurement substrate and has a reduced inspection time.

[Means for Solving the Problems] In the present invention, a substrate provided with a large number of stripe-shaped electrodes and an electrode substrate facing the substrate are immersed in a plating solution, and a current is applied between the electrodes to form a stripe electrode. A plating layer is deposited on the substrate, and the presence or absence of disconnection or short circuit of the stripe electrode is determined from the state of formation of this plating layer.

[Operation] When there is no abnormality in the stripe electrode, the plating layer is uniformly formed on the electrode surface. On the other hand, when the electrodes are disconnected for some reason, the plating layer is not formed only in that portion, and therefore the presence or absence of disconnection in all the electrodes can be determined at once. Moreover, since the disconnection location is directly marked by the presence or absence of the plating layer simultaneously with this inspection, the disconnection location can be easily confirmed.

[Examples] FIG. 1 is a schematic configuration diagram showing an example of an apparatus used for the inspection method of the present invention. In FIG. 1, reference numeral 1 denotes a substrate on which a stripe electrode is formed, and a transparent electrode made of ITO (Indium-Tin-Oxide) is provided on the substrate having an effective area of A4 size described above with respect to the short side of the substrate. 16 lines / mm (line 50 μm,
It is formed in stripes with a space of 12.5 μm.
Reference numeral 2 is a metal plate that serves as an anode during plating, and 3 is a direct current power source for flowing an electric current between the substrate 1 and the metal plate 2, which are connected so that the substrate 1 serves as a cathode and the metal plate 2 serves as an anode. The polarities may be opposite to each other. A plating tank 4 is filled with a plating solution 5. The conditions of the copper sulfate bath in the case of general copper plating are shown below.

Composition: Copper sulfate 200 to 250 (g /) Sulfuric acid 40 to 60 (g /) Temperature: 20 to 50 ° C Current density: 2 to 8 (A / m ² ) In the above configuration, first, the electrode of the substrate 1 A conductive tape 6 is attached to one end of each of the electrodes to connect all the electrodes in common.
Next, the substrate 1 is left with the portion to which the conductive tape 6 is attached remaining.
Is immersed in the plating solution 5 together with the metal plate 2, and a DC voltage is applied under the above conditions. At this time, if there is no abnormality in the stripe electrode of the substrate 1, a normal potential is generated in the electrode immersed in the plating solution, a current flows between the electrode and the metal plate 2, and the copper surface is evenly coated with copper. Is plated. On the other hand, if a part of the stripe electrode has a disconnection due to defective etching, scratches, etc., that part is not plated. Therefore, the presence or absence of disconnection can be determined by the plating formation state. In addition, since the broken portion is also marked by the presence or absence of this plating, the position can be easily confirmed without using a special device.

The copper plating formed on the substrate can be easily peeled off with an etching solution of copper such as cupric chloride.

The inspection method according to the present invention is not limited to such a disconnection inspection of the striped electrodes, and is, for example, a short-circuit inspection with adjacent electrodes in the lead-out portion of the staggered electrode as shown in FIG. 2 or as shown in FIG. It can also be used for short circuit inspection between upper and lower electrodes combined with a slight distance.

In addition, the inspection method according to the present invention can be used without being limited by the type of electrode material by changing the components of the plating solution according to the electrode material. Furthermore, the same effect as in the above embodiment can be obtained by using a substance that changes its shape by the action of generating an arbitrary current electric field by the potential generated at one end of the stripe electrode, such as liquid crystal or heat sensitive material. You can

[Effects of the Invention] As described above, according to the present invention, the presence or absence of disconnection of the stripe electrode and the position thereof can be checked at the same time, and the inspection process and inspection time can be significantly shortened. Further, compared with the conventional method, a large number of electrodes can be inspected at the same time without being restricted by the configuration (size, number of electrodes, electrode pitch, etc.) of the substrate to be measured. Furthermore, since a highly accurate device is not required, the inspection can be performed with simple and inexpensive equipment.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an example of an apparatus, FIG. 2 and FIG.
The figure is a diagram showing a configuration example of an electrode. 1 ... Substrate, 2 ... Metal plate, 3 ... DC power supply, 4 ... Plating tank, 5 ... Plating liquid, 6 ... Conductive tape.

Claims (1)

[Claims] 1. A substrate having a large number of stripe electrodes,
A multi-wiring inspection method characterized in that after the opposing electrode substrates are immersed in a plating solution, the electrodes are energized to determine the presence or absence of disconnection or short circuit of the striped electrodes depending on the formation state of the deposited plating layer. .