JPS6222978Y2 - - Google Patents
Info
- Publication number
- JPS6222978Y2 JPS6222978Y2 JP1979010008U JP1000879U JPS6222978Y2 JP S6222978 Y2 JPS6222978 Y2 JP S6222978Y2 JP 1979010008 U JP1979010008 U JP 1979010008U JP 1000879 U JP1000879 U JP 1000879U JP S6222978 Y2 JPS6222978 Y2 JP S6222978Y2
- Authority
- JP
- Japan
- Prior art keywords
- slider
- boss
- shutter
- movable pieces
- switch device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Operating, Guiding And Securing Of Roll- Type Closing Members (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979010008U JPS6222978Y2 (en, 2012) | 1979-01-31 | 1979-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979010008U JPS6222978Y2 (en, 2012) | 1979-01-31 | 1979-01-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55111127U JPS55111127U (en, 2012) | 1980-08-05 |
JPS6222978Y2 true JPS6222978Y2 (en, 2012) | 1987-06-11 |
Family
ID=28821810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1979010008U Expired JPS6222978Y2 (en, 2012) | 1979-01-31 | 1979-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6222978Y2 (en, 2012) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002039802A2 (en) | 2000-11-10 | 2002-05-16 | Unitive Electronics, Inc. | Methods of positioning components using liquid prime movers and related structures |
US6863209B2 (en) | 2000-12-15 | 2005-03-08 | Unitivie International Limited | Low temperature methods of bonding components |
US7547623B2 (en) | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
WO2004001837A2 (en) | 2002-06-25 | 2003-12-31 | Unitive International Limited | Methods of forming electronic structures including conductive shunt layers and related structures |
US7531898B2 (en) | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
TWI225899B (en) | 2003-02-18 | 2005-01-01 | Unitive Semiconductor Taiwan C | Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer |
US7049216B2 (en) | 2003-10-14 | 2006-05-23 | Unitive International Limited | Methods of providing solder structures for out plane connections |
TW200603698A (en) | 2004-04-13 | 2006-01-16 | Unitive International Ltd | Methods of forming solder bumps on exposed metal pads and related structures |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4529485Y1 (en, 2012) * | 1968-05-14 | 1970-11-12 |
-
1979
- 1979-01-31 JP JP1979010008U patent/JPS6222978Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS55111127U (en, 2012) | 1980-08-05 |
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