JPS6222954B2 - - Google Patents
Info
- Publication number
- JPS6222954B2 JPS6222954B2 JP56186567A JP18656781A JPS6222954B2 JP S6222954 B2 JPS6222954 B2 JP S6222954B2 JP 56186567 A JP56186567 A JP 56186567A JP 18656781 A JP18656781 A JP 18656781A JP S6222954 B2 JPS6222954 B2 JP S6222954B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- crucible
- storage structure
- hip
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 66
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 28
- 229910002804 graphite Inorganic materials 0.000 claims description 19
- 239000010439 graphite Substances 0.000 claims description 19
- 239000011888 foil Substances 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 claims description 8
- 239000005297 pyrex Substances 0.000 claims description 8
- 239000003566 sealing material Substances 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 230000035699 permeability Effects 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 12
- 230000005484 gravity Effects 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000001513 hot isostatic pressing Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56186567A JPS5888180A (ja) | 1981-11-19 | 1981-11-19 | 被処理物収納構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56186567A JPS5888180A (ja) | 1981-11-19 | 1981-11-19 | 被処理物収納構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5888180A JPS5888180A (ja) | 1983-05-26 |
| JPS6222954B2 true JPS6222954B2 (enrdf_load_stackoverflow) | 1987-05-20 |
Family
ID=16190783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56186567A Granted JPS5888180A (ja) | 1981-11-19 | 1981-11-19 | 被処理物収納構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5888180A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018148163A (ja) * | 2017-03-09 | 2018-09-20 | 日本特殊陶業株式会社 | 半導体製造装置用部品の製造方法 |
-
1981
- 1981-11-19 JP JP56186567A patent/JPS5888180A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5888180A (ja) | 1983-05-26 |
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