JPS6222701B2 - - Google Patents
Info
- Publication number
- JPS6222701B2 JPS6222701B2 JP56066441A JP6644181A JPS6222701B2 JP S6222701 B2 JPS6222701 B2 JP S6222701B2 JP 56066441 A JP56066441 A JP 56066441A JP 6644181 A JP6644181 A JP 6644181A JP S6222701 B2 JPS6222701 B2 JP S6222701B2
- Authority
- JP
- Japan
- Prior art keywords
- base metal
- contact
- wire
- noble metal
- precious metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010953 base metal Substances 0.000 claims description 25
- 239000010970 precious metal Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 5
- 229910000510 noble metal Inorganic materials 0.000 description 19
- 239000000463 material Substances 0.000 description 12
- 238000005520 cutting process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
- B21K1/00—Making machine elements
- B21K1/58—Making machine elements rivets
- B21K1/62—Making machine elements rivets special rivets, e.g. with electrical contacts
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、接点材料として白金、金、銀等の貴
金属材料を使用した接点、特にその接合部が２段
形状の接点の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a contact using a noble metal material such as platinum, gold, or silver as a contact material, and particularly to a method for manufacturing a contact whose joint portion has a two-step shape.
従来、この種の接点装置としては、接点全体を
白金、金、銀等の貴金属材料で作つたものや、貴
金属材料の削減のためヘツド部を銅等の卑金属材
料で作り、このヘツド部全面にわたつて貴金属材
料層を張り合わせたものがあつた。
Conventionally, in this type of contact device, the entire contact was made of a precious metal material such as platinum, gold, or silver, or the head part was made of a base metal material such as copper to reduce the amount of precious metal material, and the entire surface of the head part was made of a base metal material such as copper. There was one in which layers of precious metal materials were pasted together.
ところで、接点は中央部が接触点となるよう曲
面になつており、従つて中央部が摩耗してくるか
ら前記貴金属材料を余り薄くすると、内部の卑金
属材料のヘツド部がすぐ露出してしまう。逆に余
り厚くすると、接触点以外の貴金属材料層部分は
熱伝導、熱拡散には有効であるが、接触には無駄
になるという欠点があつた。 By the way, the contact has a curved surface so that the center part serves as the contact point, and therefore, the center part will wear out, so if the noble metal material is made too thin, the head part of the base metal material inside will be exposed immediately. On the other hand, if it is made too thick, the portion of the noble metal material layer other than the contact point is effective for heat conduction and heat diffusion, but has the disadvantage that it is wasted for contact.
本発明は上記の点に鑑みて成したものであつ
て、その目的とするところは、貴金属と卑金属と
いう異種金属を接合して成る接点において、貴金
属材料の絶対量を少なくし、且つ接合部の貴金属
材料の厚みを十分とる接点の製造方法を提供する
ことにある。
The present invention has been made in view of the above points, and its purpose is to reduce the absolute amount of precious metal material in a contact made by joining dissimilar metals such as a noble metal and a base metal, and to reduce the amount of precious metal material in the joint. It is an object of the present invention to provide a method for manufacturing a contact point that allows a sufficient thickness of noble metal material.
本発明の接点の製造方法は、白金、金、銀等の
貴金属製ワイヤを一定長さに寸断して貴金属製チ
ツプを作り、この貴金属製ワイヤより大径の銅等
の卑金属製ワイヤを一定長さに寸断して卑金属製
ヘツド素体を作り、この両者の切断口を突き合せ
て接合した後、ヘツダ加工を施すことにより、そ
の接合部が２段形状の接点を形成し、その接合部
が均等に伸びるようにしたことを特徴とし、これ
により、上記の目的を達成せんとするものであ
る。
The method for manufacturing contacts of the present invention involves cutting a wire made of a noble metal such as platinum, gold, or silver into pieces of a certain length to make a chip made of a precious metal, and then cutting a wire made of a base metal such as copper to a certain length with a larger diameter than the wire made of a noble metal. After making a base metal head element by cutting it into pieces and joining them by butting the cut ends of the two, by applying header processing, the joint part forms a two-step contact point, and the joint part forms a two-step contact point. It is characterized by being made to stretch evenly, thereby achieving the above object.
（実施例）
以下本発明を、一実施例として掲げた図面に基
づき説明する。(Example) The present invention will be described below based on drawings listed as an example.
第１図は製造順序図であり、イに示すように、
Ｘは白金、金、銀等より成る貴金属製ワイヤ、Ｙ
は貴金属製ワイヤＸよりも径の大きな銅等より成
る卑金属製ワイヤである。前記両ワイヤＸ，Ｙを
一定長に切断し、貴金属製チツプXa及び卑金属
製ヘツド素体Yaを作製する。Ｓは貴金属製チツ
プXaの外径、Ｒは卑金属製ヘツド素体Yaの外径
である。ロに示すように、前記貴金属製チツプ
Xa及び卑金属製ヘツド素体Yaの端面を付き合せ
て熱間圧、冷間圧等の接合を行う。 Figure 1 is a manufacturing sequence diagram, and as shown in A,
X is a precious metal wire made of platinum, gold, silver, etc., Y
is a base metal wire made of copper or the like having a larger diameter than the noble metal wire X. Both wires X and Y are cut to a certain length to produce a noble metal chip Xa and a base metal head body Ya. S is the outer diameter of the noble metal chip Xa, and R is the outer diameter of the base metal head body Ya. As shown in FIG.
The end faces of Xa and the base metal head body Ya are brought together and joined by hot pressure, cold pressure, etc.
次に、ハに示すように、ヘツダ加工用の上下金
型Ａ，Ｂにてプレスし中間完成品Xb，Ybにす
る。更にニに示すように、第２工程として同じく
ヘツダ加工用の金型A′，B′によりプレスし、最
終完成品としての貴金属製チツプXc及び卑金属
製ヘツド素体Ycから成るその接合部が２段形状
の接点が形成される。 Next, as shown in C, intermediate finished products Xb and Yb are pressed using upper and lower molds A and B for header processing. Furthermore, as shown in d, in the second step, the joint part consisting of the noble metal chip Xc and the base metal head body Yc is pressed using the same header processing molds A' and B'. A stepped contact is formed.
この完成された接点は第２図に示すように、貴
金属製チツプXcの外径Scより卑金属製ヘツド素
体Ycの外径Rcの方が大きく、卑金属製ヘツド素
体Ycの外径Rcは元の外径Ｒより更に大きくなつ
ている。また、貴金属製ワイヤＸと卑金属製ワイ
ヤＹの径等の比率を変えればロに示すように、貴
金属製チツプXcと卑金属製ヘツド素体Ycの境界
を変えることができる。 As shown in Figure 2, this completed contact has an outer diameter Rc of the base metal head body Yc that is larger than an outer diameter Sc of the noble metal chip Xc, and the outer diameter Rc of the base metal head body Yc is the same as the original diameter. It is even larger than the outer diameter R of. Furthermore, by changing the ratio of the diameters, etc. of the noble metal wire X and the base metal wire Y, the boundary between the noble metal chip Xc and the base metal head body Yc can be changed, as shown in FIG.
尚、第３図は卑金属製ヘツド素体Ycの上下に
貴金属製チツプXcを接合した接点の製造順序を
示す図である。 Incidentally, FIG. 3 is a diagram showing the manufacturing sequence of a contact point in which noble metal chips Xc are bonded to the upper and lower sides of a base metal head body Yc.
上記のように、本発明の接点の製造方法は、白
金、金、銀等の貴金属製ワイヤを一定長さに寸断
して貴金属製チツプを作り、この貴金属製ワイヤ
より大径の銅等の卑金属製ワイヤを一定長さに寸
断して卑金属製ヘツド素体を作り、この両者の切
断口を突き合せて接合した後、ヘツダ加工を施す
ことにより、その接合部が２段形状の接点を形成
し、その接点部が均等に伸びるようにしたので、
貴金属と卑金属という異種金属を接合して成る接
点において、貴金属材料の絶対量を少なくし、且
つ接合部の貴金属材料の厚みを十分とれるよう
な、接合部が２段形状の接点が製造でき、更に、
硬度の高い貴金属製チツプの径より大きい径を有
する硬度の低い卑金属製ヘツド素体を用いている
ので、ヘツダ加工の際に卑金属ヘツド素体の方の
みが大きく変形するということがなくなり、貴金
属製チツプと卑金属製ヘツド素体の両方に適度な
塑性変形量が加えられ、しかも接合部が均等に伸
びるため、接合強度の十分高い接点の製造方法が
提供できると共に、従来の異種の金属を接合させ
て成る接点の製造工程と略同様のものを利用して
安定に生産できるという効果を奏する。
As described above, the method for manufacturing contacts of the present invention involves cutting a wire made of a noble metal such as platinum, gold, or silver into a certain length to make a chip made of a noble metal, A head element made of base metal is made by cutting the manufactured wire into a certain length, and the two parts are joined by butting the cut ends together, and then a header is processed, so that the joined part forms a two-step contact point. , the contact area was made to stretch evenly, so
In a contact made by joining dissimilar metals such as a noble metal and a base metal, it is possible to manufacture a contact with a two-step shape in which the absolute amount of the precious metal material is reduced and the thickness of the precious metal material in the joint part is sufficient. ,
Since we use a base metal head body with low hardness that has a diameter larger than the diameter of the hard noble metal chip, only the base metal head body will not be significantly deformed during header processing. Appropriate plastic deformation is applied to both the chip and the base metal head body, and the joint stretches evenly, making it possible to provide a method for manufacturing contacts with sufficiently high joint strength, and to eliminate the conventional method of joining dissimilar metals. This has the advantage that it can be stably produced using a process that is substantially similar to the manufacturing process of contacts made of other materials.
第１図は、本発明の一実施例を示す製造順序
図、第２図は、同上に係る接点の断面図、第３図
は、本発明の他の実施例を示す製造順序図であ
る。
Ｘ……貴金属製ワイヤ、Ｙ……卑金属製ワイ
ヤ、Xa，Xb，Xc……貴金属製チツプ、Ya，
Yb，Yc……卑金属製ヘツド素体。
FIG. 1 is a manufacturing sequence diagram showing one embodiment of the present invention, FIG. 2 is a sectional view of a contact according to the above, and FIG. 3 is a manufacturing sequence diagram showing another embodiment of the invention. X...Precious metal wire, Y...Base metal wire, Xa, Xb, Xc...Precious metal chip, Ya,
Yb, Yc...Base metal head element.
Claims (1)
に寸断して貴金属製チツプを作り、この貴金属製
ワイヤより大径の銅等の卑金属製ワイヤを一定長
さに寸断して卑金属製ヘツド素体を作り、この両
者の切断口を突き合せて接合した後、ヘツダ加工
を施すことにより、その接合部が２段形状の接点
を形成し、その接合部が均等に伸びるようにした
ことを特徴とした接点の製造方法。1. Cut a wire made of a precious metal such as platinum, gold, or silver into a certain length to make a precious metal chip, and cut a wire made of a base metal such as copper into a certain length with a larger diameter than the precious metal wire to make a base metal head. After making the element body and joining the two by butting the cut ends together, by applying a header process, the joined part forms a two-step contact point and the joined part is made to stretch evenly. Featured contact manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6644181A JPS57181740A (en) | 1981-04-30 | 1981-04-30 | Manufacture of contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6644181A JPS57181740A (en) | 1981-04-30 | 1981-04-30 | Manufacture of contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57181740A JPS57181740A (en) | 1982-11-09 |
| JPS6222701B2 true JPS6222701B2 (en) | 1987-05-19 |
Family
ID=13315857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6644181A Granted JPS57181740A (en) | 1981-04-30 | 1981-04-30 | Manufacture of contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57181740A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100921166B1 (en) | 2009-07-15 | 2009-10-13 | 이호석 | A manufacture method of caulking electric contact and caulking electric contact |
| CN102842448A (en) * | 2011-06-24 | 2012-12-26 | 三菱综合材料C.M.I.株式会社 | Method of manufacturing composite contact |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS509981A (en) * | 1973-05-31 | 1975-01-31 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52162457U (en) * | 1976-06-03 | 1977-12-09 |
-
1981
- 1981-04-30 JP JP6644181A patent/JPS57181740A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS509981A (en) * | 1973-05-31 | 1975-01-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57181740A (en) | 1982-11-09 |
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