JPS59202161A - Production of copper-solder inlay clad material - Google Patents

Abstract

PURPOSE:To produce a copper-solder inlay clad material which is easy to manufacture and is joined excellently with both metallic materials to the exact size and shape by using a round wire as a solder material and rolling said material on a flat copper base material in press contact therewith. CONSTITUTION:A belt-like base material 1 consisting of copper or a copper alloy fed from a delivery device 4 is defatted and cleaned by trichloroethylene, etc. and is descaled by a wire brush, etc. in a treatreating devcie 5. A solder material 2 fed from a delivery device 6 is pretreated with a similar pretreating device 7. The pretreated material 1 and material 2 are fed to rolling rolls 8, 9 in the state of attaching longitudinally the material 2 on the one surface of the material 1 and are cold rolled by said rolls in press contact with each other, thereby forming an inlay clad material 3. The material 1 is subjected to 9-50% reduction in the stage of rolling to bring both materials in press contact with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing copper-mono inlaid clay material.

Conventionally, the manufacturing method of inlay clad material involves embedding and integrating dissimilar metal materials into a part of a band-shaped base metal material in a continuous shape along the longitudinal direction of the base metal material. A method is used in which a groove is formed in the part by cutting or rolling, and a dissimilar metal material is fitted into the groove and then rolled and pressure welded. According to this method, the base metal RN4
In addition, it is necessary to strictly control the size and shape of the old and dissimilar metal materials (formed on the base metal material), so the process is more difficult than in the case of clad materials. There is a problem that the process is complicated and manufacturing efficiency is low.

On the other hand, in the case of clad materials called toplays, there is no need to provide grooves in the base metal material, so dissimilar metal materials are bonded with adhesive or welded through a T-culm such as welding and then rolled and pressed onto a flat base metal material. The method of doing this is considered common.

For this reason, when manufacturing inlay clad materials, a method of applying the manufacturing method of top ray clad materials without forming grooves in the base metal material is being considered, but so far, there is no known method. For most types of clad materials, there is a limit to reduction due to the relationship between the materials of both metals used, especially the hardness m ratio, when using a method that does not create grooves in the base metal material, so it is difficult to bond the two metal materials and the dimensions. And the situation is such that a satisfactory shape cannot be obtained.

Incidentally, recently in the field of semiconductor lead frames, as shown in FIG. 1, solder plating 21, 21 in a continuous shape along the longitudinal direction of a base material 20 made of copper or copper alloy has been used as an inexpensive lead frame. What you have done is required. In the case of this lead frame, the solder plating is used as a brazing material to bond semiconductor elements (Si chips, etc.) later, so it must be sufficiently thick, but the plating generally has a thickness of 10μ or less. However, it is difficult to manufacture a lead frame having a thickness of 10 μm or more, and it is even more difficult to secure a sufficient plating thickness for a lead frame in which solder plating is provided in multiple strips and in a narrow width. In addition, in the case of plating, there is a problem that manufacturing efficiency is low because the speed is regulated by electrochemical conditions.

For these reasons, the present inventors focused on copper semicircular inlay clad material as a new lead frame material to replace solder plated material, and started investigating a method for manufacturing it.
In the case of copper-solder clad material, half ff1 is very soft and a large reduction can be achieved, and since the copper and solder exhibit a bond f11 (■), it is difficult to place solder material on top of the copper base material. It has been found that even if the materials are directly rolled and welded together, it is possible to obtain an inlay clad material with excellent quality, particularly in terms of bonding, depending on the manufacturing conditions.

The present invention is based on such findings, and its purpose is to provide a method for manufacturing a copper-solder inlay clad material that is easy to manufacture and has excellent bonding of both metals and dimensions and shape. .

The gist of the present invention is a method of embedding and integrating a solder material into a part of a strip-shaped base material made of copper or copper alloy in a continuous shape along the longitudinal direction of the base material, the method comprising: A method for manufacturing a copper-solder inlay clad material, characterized in that a round wire is used as a material, the wire is fed out onto a flat base material, and the base material is rolled and welded by applying a 0 to 50% gluing reduction to the base material using rolling rolls. be.

In the above, the reason why the reduction is set to 0 to 50% against the base during rolling welding is as follows: 3. If the reduction exceeds 50%, the solder material will be rolled intermittently and will not be able to be rolled normally. It is from. Note that when the reduction is O, normal rolling can be performed. The preferred range for this reduction is 5-30%.

Next, the implementation of the method for manufacturing the copper-solder cladding material of the present invention will be explained with reference to the accompanying drawings FIGS. 2 to 5.

In FIG. 2, 1 has a thickness of 0.46 mm and a width of 25 mm.

2 shows a base material made of a long annealed Sn-containing oxygen-free copper material, and 2 shows a solder material made of a 0.22 mm round wire.

In this embodiment, two strips of solder material 2.2 are provided on one side of the base material 1.
This figure shows a method for producing a copper-solder inlay clad material 3 having a cross section as shown in FIG.

This copper-solder inlay clad material 3 is used, for example, as a lead frame for a diode.

During rolling pressure welding, a glue reduction of about 10% is applied to the base material 1. Therefore, the dimensions of the inlay land material 3 after rolling welding are as follows: The thickness of the base material 1 is Q, 4 mrr.
1. For the solder material 2'', J in Figure 3: It is buried in an arc shape, with a width of 1.2 mL and a maximum thickness of 0.06 mm.
(60μ). According to this, the solder material 2' has expanded approximately six times in area after rolling and pressure welding. If the base material 1 is not an annealed material but a hard material, the area of the solder material 2' will be approximately ten times larger. The area of the solder material 2' can be arbitrarily set mainly depending on the hardness of the base material 1 and the diameter of the round wire.

To explain this method in more detail with reference to FIG.
Degreasing and cleaning using Triclean and the like and scale removal using a wire brush and the like are carried out. Further, the solder material 2 is pretreated from the delivery device 6 through a similar pretreatment treatment 7.

Next, the pretreated base material 1 and solder material 2 are sent to a rolling roll 8.9 with the solder material 2 longitudinally attached to one side of the base material 1. Then, by passing through the rolling rolls 8.9, the base material 1 and the solder material 2 are cold-rolled and welded to form an inlay clad material 3 as shown in FIG. This inlay clad material 3 may be wound up as it is by the winding device 10, but it can also be wound up after being passed through the heat treatment device 11 in order to make the bond between the two metal materials stronger. In order to strengthen the bond between the base material 1 and the solder material 2', the heat treatment device 11 uses the melting point of the solder (310 ℃〉 or below to a temperature of around 250℃.

As a further embodiment of the present invention, two strips of solder material 2' can be formed on both sides of the base material 1 as shown in FIG.

As described above, according to the method of manufacturing the copper-solder inlay clad material of the present invention, a round wire is used as the solder material 2, and this is fed out onto the flat copper base material 1, and then rolled into the base material 1 using rolling rolls. Rolling and pressure welding with 0 to 50% glue reduction provides the following effects.

(1) Compared to the plating method, manufacturing efficiency is better and the solder thickness can be increased.

(2) Unlike conventional inlaid clad materials, it does not require groove processing and can be directly rolled and welded, so manufacturing efficiency is high, and at the same time, the diameter of the round wire can be set (size of the cladding part). 1] - can be carried out very easily.

(3) Since it targets copper and solder, it is possible to obtain inlay land materials with excellent quality, especially in terms of joint surfaces.

(4) Since round wire is used as the solder material, soldering materials of any size can be easily manufactured or obtained, and are easy to handle during manufacturing.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a plating material according to a conventional example, FIG. 2 is a sectional view of a base material and solder material according to an embodiment of the present invention, FIG. The figure is a manufacturing process diagram of the same inlay-clad material, and FIG. 5 is a sectional view of the inlay-clad material according to the second embodiment of the present invention. 7-1: Base material, 2.2': Semicircular material, 3: Inlay clad material, 8.9: Roll. 8- Figure 1 Rhinoceros 2 Figure 4 Figure 2 L

Claims (1)

[Claims] A method of embedding and integrating a solder material into a part of a strip-shaped base material made of copper or copper alloy in a continuous shape along the longitudinal direction of the base material, using a round wire as the solder material, A method for producing a copper-solder inlay clad material, which comprises rolling out the material onto a flat base material, applying a 0 to 50% adhesive reduction to the base material using rolling rolls, and rolling-pressing the material.