JPS62224576A - Electroformed thin blade grindstone and its manufacture - Google Patents

Abstract

PURPOSE:To make it possible to obtain excellent cutting sharpness and high processing accuracy from the beginning of grinding by making super fine abrasive particles project from the surface of a peripheral cutting edge part of a metallic plating layer by 1/5 or more of average particle diameter of the abrasive particles. CONSTITUTION:Super fine abrasive particles 11 are made to project from a surface 10a of a metallic plating layer 10 on each of both surfaces and a peripheral cutting edge part by a projecting amount H of 1/5 or more of average particle diameter. By setting the projection amount H in this way, excellent cutting sharpness and high processing accuracy can be obtained from the beginning of grinding.

Description

[Detailed Description of the Invention] "Industrial Field of Application This invention relates to an electroformed thin-blade grindstone suitable for cutting and grooving materials such as silicon and ferrite, which require particularly high precision, and a method for manufacturing the same. be.

[Prior Art] For example, when cutting or grooving with high precision is applied to electronic materials such as silicon and GaΔs1 ferrite, or hard and brittle materials such as ceramics, crystal, and glass,
Generally, a thin-blade grindstone called an electroformed thin-blade grindstone, which is made by dispersing superabrasive grains in a metal plating phase, is used.

This electroformed thin-blade grindstone is produced by electroplating the surface of a substrate made of stainless steel or the like with an electroplating solution containing a Ni base or the like in which superabrasive grains such as diamond or Cl5N are dispersed, and the above superabrasive is applied within the N1 plating phase. After electrolytically depositing a grindstone layer in which abrasive grains are dispersed, the substrate is further removed, resulting in an annular plate shape having a thickness of several tens of micrometers to several hundred micrometers.

As shown in FIG. 5, the electroformed thin-blade grindstone 1 thus obtained is sandwiched between a pair of mounting flanges 2 and 2 provided on both sides, and the axis is fixed by a nut 3. The clamp is fixed to the whetstone shaft 4 which rotates around it and is ready for use.

[Problems to be Solved by the Invention] By the way, the conventional electroformed thin-blade whetstone I is usually fixed to the whetstone shaft 4 and before being put to use, it has to be fixed with a dressing plate or stick using a general whetstone. The protrusion of the superabrasive grains, called dressing, is performed.

However, in the conventional electroformed thin-blade grindstone I,
Since the strength and hardness of the metal plating phase that forms the bonding phase of the superabrasive grains are extremely high, if dressing is performed using a general grindstone as described above, the superabrasive grains from the metal plating phase of the outer cutting edge will be removed. There were only a few protruding claws.

In addition, as the particle size of the superabrasive grains increases, it becomes even more difficult to make these superabrasive grains protrude from the metal plating phase. For example, if the average grain size exceeds 20 to 30 μm,
Dressing plates using general grindstones have the disadvantage that they are hardly able to protrude from the metal plating layer.

Therefore, when dressed with a dressing plate or the like using this type of general grindstone, the sharpness is inferior, and this may cause chipping of the workpiece or increase the grinding resistance, causing it to be cut in one direction. There was a problem in that the cutting material could not be cut in a straight line, but would be cut in a curved manner.

[Purpose of the Invention] This invention has been made in view of the above circumstances, so that it is possible to perform wave machining of a workpiece material with excellent sharpness from the beginning of grinding.
Y! --/,,-+,m-,&/fi+1-111-1
It is an object of the present invention to provide an electroformed thin-blade grindstone that can obtain high machining accuracy when machining -J, Jk-No. 1, Jllq, and a method for manufacturing the same.

[Means for Solving the Problems] The electroformed thin-blade grindstone of the present invention extracts superabrasive grains from the surface of the outer peripheral cutting edge portion of the metal plating phase into particles with an average grain size of 115
This is what made it stand out.

[Function] According to the electroformed thin-blade grindstone having the above configuration, sharp sharpness can be obtained from the beginning of grinding due to the superabrasive grains having an average grain size of 115 or more protruding from the surface of the metal plated phase on the substrate side.

[Example] Figure 1 shows an example of the electroformed thin-edged grindstone of the present invention, and is an enlarged sectional view of the surface of the plated layer (substrate side surface, plated layer growth side surface, or outer peripheral cutting edge part). .

In FIG. 1, in the electroformed thin-edged grindstone of this example, superabrasive grains! 1... are each protruded by an amount indicated by reference numeral 11 in the figure. Here, this protrusion m H is 11 of the average grain size of these superabrasive grains II...
5 or more, and more preferably within the range of 115 to 2/3.

That is, the protrusion amount ■1 of the superabrasive grains 11 is 1
If it is less than 15, the amount of protrusion of the super abrasive grains 11 is too small to achieve a sufficient sharpness improvement effect. Moreover, if it exceeds 2/3, metal plating phase I
The holding power of superabrasive grains II... by O decreases, causing these superabrasive grains 11... to fall off at a relatively early stage, which causes a decrease in the thickness of the grinding wheel and reduces machining accuracy. This is because it is not desirable.

Next, a method for manufacturing the electroformed thin-blade grindstone will be specifically described.

First, electroplating is applied to the surface of a substrate made of metal such as stainless steel using an electroplating solution containing Ni-based, Co-based, or alloys thereof in which superabrasive grains such as diamond are dispersed, and these N + , G The thickness dimension of the superabrasive grains dispersed in the metal plating phase consisting of one or more metals of O and one or more of these alloys is from several +71 m to several hundred μm.
Forms a grindstone layer.

Subsequently, electroplating of Ni or the like that does not contain superabrasive grains is applied to the surface of the grinding wheel layer formed in this way on the plating growth side, and the superabrasive is removed from the surface of the gold plating phase on the plating growth side. The amount of protrusion of the grains is set to 1/5 to 2/3 of the average grain size. Then, after the substrate is subjected to water washing treatment including brushing, etc., the grindstone layer is peeled off from the substrate.

Next, the surface of the metal plating phase located on the substrate side of the obtained thin plate-like grinding wheel layer is chemically or electrochemically dissolved to remove the superabrasive grains from the surface of the metal plating phase. It protrudes by 115 to 2/3 of the average particle size of the grains.

When manufacturing the electroformed thin-blade grindstone according to the present invention from the thin plate-shaped grindstone layer obtained in this way,
The following two methods can be suitably employed.

That is, in the first method, the above-mentioned grindstone layer is first formed into a circular grindstone shape by punching or the like, and then further processed into a perfect circle to obtain an electroformed thin-blade grindstone. Next, the surface of this electroformed thin-edged grindstone other than the outer peripheral cutting edge is masked, and the exposed surface of the metal plating phase on the outer peripheral cutting edge is electrochemically or chemically dissolved, thereby removing the metal. Super abrasive grains are removed from the surface of the plating phase with an average grain size of 115~
The electroformed thin blade grindstone according to the present invention is obtained by protruding 2/3.

Here, methods for electrochemically dissolving the surface of the metal plating phase on the outer cutting edge include electrolytic etching, electrolytic polishing, etc., and the electrolytic polishing liquid mainly contains phosphoric acid or sulfamic acid. Solutions are preferred.

According to this electrochemical dissolution method, the dissolution amount of the metal plating phase is proportional to the amount of current applied, so it is easy to manage, and therefore the metal plating phase is more uniformly dissolved than the chemical dissolution method. It has the advantage that it can be dissolved in In addition, in the above electrolytic polishing method, for example, the electrolytic polishing solution contains Glyse+1'/'n/7'l.
b'/+ 11: M: l1rll fF
A') tnl, #D 'l'E /7'
If an inhibitor such as alcohol is added to lM/l', the uniformity of dissolution for metal plating can be further improved.

Further, when melting the surface of the outer peripheral cutting edge portion of the metal plating phase, as shown in FIG. By melting more than the portion 22, the shape of the surface 10a of the outer peripheral cutting edge portion is changed so that the central portion 22 thereof protrudes, and both edges 21, 21 are chamfered in a so-called radius shape. It is desirable to form a smooth convex curved surface.

On the other hand, a second method for obtaining the electroformed thin-blade grindstone according to the present invention is to first coat the outer periphery 30 and inner periphery 31 on both sides of the above-mentioned grindstone layer after it has been peeled off from the substrate, as shown in FIG. An annular masking 32 is applied to the part of the regular grindstone shape excluding the part that becomes the extra dimension. Next, this is mixed with II, So at an appropriate concentration.

A predetermined amount of the metal plating phase is dissolved by chemical etching using an acidic solution such as H202 solution, II N O3 solution, or ferric chloride → ICσ, and then it is washed with water and dried with zero water, and then the massing is carried out. Remove. As a result, the present invention has a circular grindstone shape, and at the same time, the superabrasive grains are made to protrude from the surface of the outer peripheral cutting edge portion of the metal plating phase by 115 to 2/3 of the average particle diameter of these superabrasive grains. The electroformed thin-edged grindstone is obtained.

Therefore, according to this second method, it is possible to simultaneously form the thin plate-like grindstone layer into the shape of the grindstone and to protrude the superabrasive grains from the surface of the outer peripheral cutting edge.

Therefore, in the case of the "-electroformed thin blade grindstone obtained by such a manufacturing method, the superabrasive grains 11... Since it protrudes by 115 to 2/3 of the diameter, sharp sharpness can be obtained from the beginning of grinding. For this reason,
Both the substrate side surface and the plated layer growth side surface of this electroformed thin blade grindstone do not cause chipping or burrs on the processed surface of the workpiece. Furthermore, since these superabrasive grains 11 are sufficiently retained in the metal plating phase 10, they do not fall off from the metal plating layer 10 at an early stage, so that high processing accuracy can be obtained.

In addition, when manufacturing the electroformed thin-edged grindstone, the surface 10a of the outer peripheral cutting edge part is electrochemically melted to form superabrasive grains 11.
According to the method of protruding..., the metal plating phase 1
The above metal plating phase 1
0 can be uniformly dissolved, thereby achieving high product quality.

Further, both edges 21.2 of the surface 10a of the outer peripheral cutting edge portion
1 is melted in a larger amount than in the central part 22, and the surface 10a of the outer peripheral cutting edge part is formed into a smooth convex curved surface with the central part 22 protruding, the cutting quality can be further improved. It is possible to cut the workpiece material in a straight line with higher accuracy and reliably.

On the other hand, according to the method in which the surface 10a of the peripheral cutting edge is dissolved by chemical etching to protrude the superabrasive grains, the superabrasive grains are formed into a circular grindstone shape and the superabrasive grains are released from the surface 10a of the peripheral cutting edge. Since the protrusion and ejection can be performed simultaneously, the manufacturing process can be rationalized.

[Experimental Example] First, the surface of a stainless steel-like substrate on which a passivation film was formed was masked leaving a portion forming the shape of a grindstone prototype, and then a cleaning treatment such as normal degreasing was performed. Next, the surface of the substrate was electroplated using a Ni sulfamate plating solution in which diamond abrasive particles were dispersed to form a Ni abrasive layer (in which the diamond abrasive particles were dispersed). The conditions for the electroplating in this case are shown below.

(a) Composition of electroplating solution Ni sulfamate: 4509/Q Ni chloride: I Og/12, boric acid: 309/(
1. Pit prevention agent, brightener: small amount of each, I'H: 4, type of dispersed superabrasive: diamond abrasive, particle size of dispersed abrasive: 20-307zm, (b) electroplating conditions bath temperature: 50℃, Plating time: 160 minutes, cathode current density: 5A/d+n'.

Next, the substrate is taken out from the dispersion plating tank and subjected to water washing including brushing, and then Ni sulfamate plating that does not contain diamond abrasive grains is applied to the surface of the substrate surface on the plating growth side of the grindstone layer. The diamond abrasive grains were electroplated to a thickness of approximately 8 μm, and the amount of protrusion of the diamond abrasive grains from the surface of the metal plating phase on the growth side of the plating was set to 1/2 of the average grain size.

Next, the substrate was taken out from the dispersion plating bath, washed with water, and then the grindstone layer was peeled off from the substrate.

Then, the surface of the metal plating phase on the plating growth side of the grinding wheel layer is masked, and the surface of the metal plating phase on the substrate side of the grinding wheel layer is electrolytically polished using an electrolytic polishing solution, and the diamond grinding wheel is removed from this surface. The amount of protrusion is 1 of the average particle size.
/2. The electrolytic polishing conditions in this case are shown below.

(a) Composition of electrolytic polishing solution Phosphoric acid: 700g/(1, Glycerin: 40g/
ρ, (b) Electrolytic polishing conditions Bath temperature: 40°C, electrolysis time: 4 minutes, anode current density: 20A/dm2° Next, the above-mentioned grindstone layer was taken out from the electrolytic polishing tank and washed with water, and the above-mentioned masking was peeled off. Dry.

Then, the thin plate-shaped grindstone layer obtained in this way is formed into a circular grindstone shape by electric discharge machining or the like to obtain an electroformed thin-blade grindstone, and then the outer cutting edge portion and the vicinity thereof are removed. The surface of the metal plated phase was masked to prevent current from flowing.

Next, after degreasing and cleaning the exposed surface, electrolytic polishing is applied to this surface to reduce the protrusion of the diamond abrasive grains from the surface of the metal plating phase to 1/2 of the average grain size.
And so. The electrolytic polishing conditions in this case are that the anode current density is 80 A/d, m" and the electrolysis time is 111
The electrolytic polishing conditions were the same as those for the substrate side surface above, except that the polishing conditions were as follows. As described above, an electroformed thin-blade grindstone not shown in Invention Example I, which is an electroformed thin-blade grindstone according to the present invention, was obtained.

In addition, by the same method as the electroformed thin-blade grindstone of Example I of the present invention, a thin plate-like grindstone layer in which diamond abrasive grains were protruded by 115 mm of the average particle diameter from the metal-plated surface on the substrate side and the plating growth side, respectively. These were subjected to the following two types of treatments to create two types of electroformed thin-blade grindstones, Invention Example 2 and Invention Example 3, which are electroformed thin-blade grindstones according to the present invention, respectively.

■ Invention Example 2: After processing the thin plate-shaped grinding wheel layer into a circular shape by laser cutting, as shown in FIG. The rotary shaft 41 was clamped therebetween. Then, while rotating the rotating shaft 41, using the same electrolytic polishing liquid as that used in Example 1 of the present invention,
The surface of the outer peripheral cutting edge of the metal plating phase exposed through the mask 40.40 of the grinding wheel layer is melted, and the amount of diamond abrasive grains protruding from this surface is reduced to 7/10 of the average grain size.
I made it ``2''.

In this case, the outer peripheral cutting edge of the obtained electroformed thin-edged grindstone has a smooth shape with the center protruding as shown in Figure 2 because both edges have been melted more than the center. It became a convex curved surface.

■ Example 3 of the present invention: The thin plate-like low stone layer has a regular whetstone shape with the extra dimensions of the outer circumference 30 and inner circumference 31 removed, as shown in Fig. 3. Ring-shaped masking 3 on the desired area
2 was applied. Next, add 400% ferric chloride to this.
g/12. [I CC sprays a chemical etching solution consisting of Ioom (J/I) to dissolve the part without the masking 32 and obtain a circular electroformed thin blade grindstone with regular dimensions, and in parallel with this, The amount of protrusion of the diamond abrasive grains from the surface of the outer peripheral cutting edge of the metal plating phase was set to be 7/10 or more of the average grain size.

On the other hand, apart from these, a conventional electroformed thin-blade grindstone was created, which was made of substantially the same metal plating and superabrasive grains, but was not subjected to the above-mentioned protrusion treatment of the superabrasive grains.

Table 1 shows the valley dimensions, compositions, etc. of the three types of electroformed thin-blade grindstones according to the present invention obtained above and the conventional electroformed thin-blade grindstones, as well as their respective test results.

(Hereafter, blank space) Table 1 Grinding conditions Work material: I- (IP ferrite, grinding wheel circumferential speed: 1500 m/min.

Protruding blade tip: 3 mm, Feed speed: 50 mm/min.

Cutting depth: 2.5 mm, Grinding fluid: Water soluble By chemically dissolving the superabrasive grains, the superabrasive grains are made to protrude from the surface by 115 or more of the average grain size of these superabrasive grains, so according to the electroformed thin blade grindstone of the present invention,
ff sharpness and high machining accuracy can be obtained from the beginning of grinding.

[Brief explanation of drawings]

1 to 4 are for explaining the electroformed thin-edged grindstone of the present invention and its manufacturing method, and FIG. 1 is an enlarged cross-section of the surface of the plating layer showing one embodiment of the electroformed thin-edged grindstone of the present invention. 2 is a schematic cross-sectional view showing the shape of the outer cutting edge of an electroformed thin-edged grindstone formed using an embodiment of the manufacturing method of the present invention, and FIG. FIG. 4 is a plan view showing the state of masking in the example. FIG. 4 is a schematic configuration diagram showing an example of a rotating jig used to form the outer cutting edge mark shape shown in FIG. 2. FIG. FIG. 2 is a schematic side sectional view showing a cast thin blade grindstone fixed to a grindstone shaft. IO...metal plating phase, 10a...surface, 11...superabrasive, 21...edge, 22...center, 32...masking, 40...mask plate, II...from metal plating phase Protrusion amount of super abrasive grains.

Claims (6)

[Claims] (1) In a thin plate-shaped electroformed thin-blade grindstone in which superabrasive grains are dispersed in a metal plating phase, the superabrasive grains are removed from the surface of the outer peripheral cutting edge of the metal plating phase by the average of these superabrasive grains. An electroformed thin blade whetstone characterized by protruding 1/5 or more of the grain size. (2) The electroformed thin-blade grindstone according to claim 1, wherein the metal plating phase is made of one or more metals selected from Ni, Co, and alloys thereof. (3) While forming a plating layer on the substrate in an electroplating solution, superabrasive grains are dispersed in the metal plating phase to form a grinding wheel layer, and then the substrate is removed and an electroformed thin-blade grinding wheel is formed into a thin plate. After that, this electroformed thin-blade grindstone is circularly processed to form a disc-shaped grindstone, and then the surface of the outer cutting edge of the metal-plated phase of this electroformed thin-blade grindstone is chemically or electrochemically processed. A method for manufacturing an electroformed thin-edged grindstone, characterized in that the superabrasive grains are melted to protrude from the surface of the metal plating phase by 1/5 or more of the average grain size of the superabrasive grains. (4) Claim 3, characterized in that the solution that electrochemically dissolves the surface of the peripheral cutting edge of the metal plating phase is a solution containing phosphoric acid or sulfamic acid as a main component. A manufacturing method for electroformed thin-edged grindstones. (5) When melting the outer peripheral cutting edge portion of the metal plating phase, both edges of the outer peripheral cutting edge portion are melted more than the central portion to form a smooth convex curved surface with the central portion protruding from the outer peripheral cutting edge portion. 5. A method for manufacturing an electroformed thin-blade grindstone according to claim 3 or 4, wherein the thin-edged electroformed grindstone is formed into a shape. (6) While forming a plating layer on the substrate in an electroplating solution, superabrasive grains are dispersed in this metal plating phase to form a grinding wheel layer, and then the substrate is removed and an electroformed thin-blade grinding wheel is formed into a thin plate. After this, the electroformed thin-edged grinding wheel is masked and then chemically etched to obtain a circular grinding wheel shape.At the same time, the superabrasive grains are removed from the surface of the outer peripheral cutting edge of the metal plating phase. 1 of the average particle size of the abrasive grains
A method for manufacturing an electroformed thin-edged grindstone characterized by protruding by /5 or more.