JPS62218067A - Electroformed thin blade grindstone and its manufacture - Google Patents

Abstract

PURPOSE:To obtain excellent sharpness in grinding and high processing accuracy from the beginning of grinding by making a plated layer surface on the side of a substrate for growing a plating layer to be melted either chemically or electrically thereby making superfine abrasive grains project by a required amount. CONSTITUTION:A surface of a metallic plated layer placed on the side of a substrate of an electroformed thin blade grindstone of circular thin plate shape is treated either chemically or electrically. Superfine abrasive grains 11 are made to project by a height H of 1/5-2/3 of average grain diameter of the grains 11 from a surface 10a of the metallic plated layer 10 treated as described above. By making the electroformed thin blade grindstone in this manner, it is made possible to obtain excellent sharpness from the beginning of grinding, to prevent a processed surface from chipping or exfoliating, and to obtain high accuracy.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an electroformed thin-blade grindstone suitable for cutting and grooving materials such as silicon and ferrite, which require particularly high precision, and a method for manufacturing the same. be.

[Prior Art] For example, when cutting or grooving electronic materials such as silicon, GaAs, and ferrite, or hard and brittle materials such as ceramics, crystal, and glass with high precision,
Generally, a thin-blade grindstone called an electroformed thin-blade grindstone, which is made by dispersing superabrasive grains in a metal plating phase, is used.

This electroformed thin-blade grindstone is made by dispersing super abrasive grains such as diamond or CBN on the surface of a substrate made of stainless steel, etc.
Electroplating is performed using an electroplating solution containing i groups, etc.,
After electrodepositing a grinding wheel layer in which the superabrasive grains are dispersed in the Ni plating phase, the above-mentioned bracket is further removed, resulting in an annular plate shape with a thickness of several tens of micrometers to several hundred micrometers. .

As shown in FIG. 2, the electroformed thin-blade grindstone 1 obtained in this way is sandwiched between a pair of mounting flanges 2 and 2 provided on both sides, and the axis is fixed by a nut 3. The clamp is fixed to the whetstone shaft 4 which rotates around it and is ready for use.

[Problems to be Solved by the Invention] However, the above-mentioned conventional electroformed thin-blade grindstone 1 has problems due to its manufacturing method.
Since it is obtained by first applying electroplating to the surface of a substrate and then removing the substrate, as shown in FIG. Super abrasive grains 6 from the metal plating phase 5 are on the surface 1a.
There is no protrusion at all. Therefore, during grinding, this surface 1a has a poor sharpness, and there is a problem in that chipping or so-called "mushiri" is likely to occur in the workpiece, especially in the initial stage of grinding.

[Purpose of the Invention] This invention was made in view of the above circumstances, and provides excellent sharpness from the beginning of grinding without causing any chipping or burrs on the side surface of the workpiece, while at the same time achieving high machining accuracy. The object of the present invention is to provide an electroformed thin-edged grindstone that can be used as an electroformed thin-edged grindstone, and a method for manufacturing the same.

[Means for Solving the Problems] The 7IX cast thin blade grindstone of the present invention extracts superabrasive grains from the surface of the metal plating phase on the substrate side for plating layer growth to an average particle size of I15 to 2 of the superabrasive grains. /3 is made to protrude.

[Function] According to the electroformed thin-blade grindstone having the above configuration, the superabrasive grains that protrude from the substrate side surface of the metal plating phase by 115 to 2/3 of the average grain size can start grinding even on this substrate side surface. Excellent sharpness can be obtained from the beginning. Therefore, the above-mentioned superabrasive grains are applied from the surface of the metal plating phase to 115 to 2/2 of the average grain size.
3 protrudes, these superabrasive grains are sufficiently retained in the metal plating phase. Therefore, during cutting, the superabrasive grains fall off and the thickness of the grinding wheel decreases, which reduces the cutting process. This does not result in a decrease in width accuracy.

[Example 1] FIG. 1 shows an example of the electroformed thin-edged grindstone of the present invention, and is an enlarged sectional view of the surface of the plating layer (the surface on the substrate side, the surface on the growth side of the plating layer, or the outer cutting edge portion).

In FIG. 1, in the electroformed thin-edged grindstone of this example, superabrasive grains 11 are indicated by the reference numeral 4 in the figure from the surface 10a of the metal plating phase lO on both surfaces and each part of the outer cutting edge. It stands out in quantity. And this protrusion fftH is 11 of the average grain size of these superabrasive grains 11...
It is said to be 5 to 2/3.

Here, the above super abrasive grain! The protrusion amount H of l... is I15~2
/3 is chosen because if it is less than 115, its action as a cutting edge will be insufficient and its sharpness will be poor, and if it exceeds 2/3, the holding power of the superabrasive grains will decrease and the superabrasive grains will fall off early. This is because, as a result, the thickness of the grinding wheel suddenly decreases and the machining accuracy decreases, making it impossible to achieve sufficient effects.

Next, a method for manufacturing the electroformed thin-blade grindstone will be specifically explained.

First, electroplating is applied to the surface of a substrate made of metal such as stainless steel using an electroplating solution containing Ni-based, Co-based, or alloys thereof in which superabrasive grains such as diamond are dispersed. The superabrasive grains are dispersed in a metal plating phase made of one or more of these alloys to form a grinding wheel layer having a thickness of several tens of micrometers to several hundred micrometers.

Subsequently, electroplating of Ni or the like that does not contain diamond abrasive grains is applied to the surface of the grinding wheel layer formed in this way on the plating growth side, to remove the diamond abrasive from the metal mesh phase surface on the plating growth side. The protruding insects are reduced to 115-2/3 of their average particle size. Then, after the substrate is subjected to water washing treatment including brushing, etc., the grindstone layer is peeled off from the substrate.

Next, the surface of the metal plating phase located on the substrate side of the obtained circular thin plate-shaped electroformed thin blade grinding wheel is chemically or electrochemically dissolved to remove the surface of the metal plating phase from the surface of the metal plating phase. The grains are made to protrude by 115 to 2/3 of the average grain size of these superabrasive grains.

Next, the obtained whetstone layer is formed into a circular whetstone shape by punching, etc., and further processed into a perfect circle to reduce the Ti n %
After obtaining the Ii blade grindstone, masking is applied to the surface other than the peripheral cutting edge, and electrolytic polishing is applied to the exposed surface to reduce the diamond abrasive grains from the surface of the metal plating phase to 115% of the average particle size. ~2/3 stick out.

Here, as a method for chemically dissolving the surface of the metal plating phase on the substrate side, for example, after masking the surface of the electroformed thin-blade grindstone that does not require dissolution, this is coated with HtsO, + at an appropriate concentration. 1-1 to 2 solution, HNO
There is a dissolution method in which the masking layer is immersed in an acidic solution such as a .

Further, electrochemical dissolution methods include electrolytic etching, electrolytic polishing, and the like, and the electrolytic polishing solution is preferably a solution containing phosphoric acid or sulfamic acid as a main component.

In any case, this electrochemical dissolution method can dissolve the metal plating phase more uniformly than a chemical dissolution method, and moreover, the amount of dissolution is less than Tiff1.
It has the advantage that it is easy to manage because it is proportional to . In addition, in the above electrolytic polishing method, for example, if a thickening substance such as glycerin, an oxidizing agent such as chromic acid, or an inhibitor such as alcohol is added to the electrolytic polishing solution,
Furthermore, the uniformity of dissolution of the metal plating phase can be further improved.

However, in this electroformed thin blade grindstone, the superabrasive grains 11 are made to protrude from the surface 10a of the metal plating phase 10 by 115 to 2/3 of their average grain size, so that the grinding Excellent sharpness can be obtained from the beginning. Therefore, chipping and burrs do not occur on the corrugated surface of the workpiece on both the substrate side surface and the plated layer growth side surface of this electroformed thin blade grindstone. Moreover, these super abrasive grains 11.
Since the metal plating layer 10 is sufficiently retained in the metal plating IO, it does not fall off from the metal plating phase 10 at an early stage, and therefore high processing accuracy can be obtained.

[Experimental Example] First, the surface of a stainless steel substrate on which a passivation film was formed was masked leaving a portion forming the shape of the grindstone prototype, and then a cleaning treatment such as normal degreasing was performed. Next, the surface of the substrate was electroplated using a Ni sulfamate plating solution in which diamond abrasive grains were dispersed to form a grindstone layer in which the diamond abrasive grains were dispersed in the Ni plating phase. The conditions for the electroplating in this case are shown below.

(a) Composition of 11-gas plating solution Ni sulfamate: 4509/Q Ni chloride: 109/Q, boric acid: 301? /f2
, pit preventive agent, brightener: each small amount, PH+4, type of dispersed superabrasive: diamond abrasive, particle size of dispersed abrasive: 20-30 μm1, concentration of dispersed abrasive: l 009/Q0 (b) electroplating condition bath Temperature: 50°C, plating time: 160 minutes, cathode current density: 5A/dII”.

Next, the substrate is taken out from the dispersion plating tank and subjected to water washing including brushing, and then Ni sulfamate plating that does not contain diamond abrasive grains is applied to the surface of the substrate surface on the plating growth side of the grindstone layer. The protrusion m of the diamond abrasive grains from the surface of the metal plating phase on the growth side of the plating was set to 1/2 of the average grain size.

Next, the substrate was taken out from the dispersion plating bath, washed with water, and then the grindstone layer was peeled off from the substrate.

Then, the surface of the metal plating phase on the plating growth side of the grinding wheel layer is masked, and the surface of the metal plating phase on the substrate side of the grinding wheel H is electrolytically polished using an electrolytic polishing liquid, and the diamond grinding wheel is removed from this surface. The amount of protrusion is 1 of the average particle size.
/2. The electrolytic polishing conditions in this case are shown below.

(a) Composition of electrolytic polishing solution Phosphoric acid: 70097Q, G') Seri 7: 409
/(1, (b) Electrolytic polishing conditions Bath temperature: 40°C, electrolysis time: 4 minutes, anode current density + 20 A/dl'.

Next, the grindstone layer was taken out from the electrolytic polishing bath, washed with water, and the masking layer was peeled off and dried.

Then, the thin plate-shaped grindstone thus obtained is formed into a circular grindstone shape by electric discharge machining or the like. After obtaining the cast thin blade grindstone, masking was performed to prevent current from flowing on the surface except for the outer peripheral cutting edge portion and the vicinity thereof. After degreasing and cleaning the exposed surface, this surface was electrolytically polished so that the amount of diamond abrasive grains protruding from the surface of the metal plating phase was reduced to 1/2 of its average grain size.

In this case, the electrolytic polishing conditions are such that the anode current density is 80
The electrolytic polishing conditions were the same as those for the substrate side surface, except that the electrolysis time was 1 minute at A/dm''.

An electroformed thin-blade grindstone shown as Example 1 of the present invention was prepared by the above method, and an electroformed thin-blade grindstone shown as Example 2 of the invention was produced by the same method. Furthermore, a conventional electroformed thin-blade grindstone was created that consisted of substantially the same metal plating phase and superabrasive grains, but was not subjected to the above-described protrusion treatment of the superabrasive grains.

Table 1 shows the dimensions, compositions, and test results of the three types of electroformed thin-blade grindstones.

Table 1 Grinding conditions Work material: HIP ferrite, grinding wheel peripheral speed:
1500 m/min.

Blade tip protrusion m: 3 open, Feed speed: 50 mm/min.

Cutting claw: 2.5 mm.

Grinding fluid: Water soluble [Effects of the invention As explained above, the electroformed thin-edged grindstone of the present invention and its manufacturing method chemically or electrochemically dissolves the surface of the metal plating phase on the substrate side for plating layer growth. By doing so,
From this surface, the superabrasive grains are removed from the surface with an average grain diameter of 115 mm.
Since the blade protrudes by ~2/3, the electroformed thin-blade grindstone of the present invention can provide excellent sharpness and high machining accuracy from the beginning of grinding.

[Brief explanation of drawings]

Fig. 1 is an enlarged cross-sectional view of the surface of an embodiment of the electroformed thin-blade grindstone of the present invention, and Figs. 2 and 3 show conventional electroformed thin-blade grindstones, and Fig. 2 is fixed to the grindstone shaft. FIG. 3 is an enlarged sectional view of the surface on the substrate side. 10... Metal plating phase, 10a... Surface, 11... Super abrasive grains, [4... Amount of protrusion of super abrasive grains from metal plating phase .

Claims (4)

[Claims] (1) In a thin plate-shaped electroformed thin-blade grindstone in which superabrasive grains are dispersed in a metal plating phase, the superabrasive grains are removed from the surface of the metal plating phase on the substrate side for plating layer growth. An electroformed thin blade grindstone characterized by having grains that protrude by 1/5 to 2/3 of the average grain size. (2) The electroformed thin-blade grindstone according to claim 1, wherein the metal plating phase is made of one or more metals selected from Ni, Co, and alloys thereof. (3) While forming a plating layer on the substrate in an electroplating solution, superabrasive grains are dispersed in the metal plating phase to form a grinding wheel layer, and then the substrate is removed and an electroformed thin-blade grinding wheel is formed into a thin plate. After this, the surface of the metal plating phase on the substrate side of this electroformed thin blade grindstone is chemically or electrochemically dissolved to remove the superabrasive grains from the surface of the metal plating phase. A method for manufacturing an electroformed thin blade grindstone, characterized in that the grains are protruded by 1/5 to 2/3 of the average diameter. (4) The electrolyte according to claim 3, wherein the solution that electrochemically dissolves the surface of the metal plating phase on the substrate side is a solution containing phosphoric acid or sulfamic acid as a main component. Manufacturing method for cast thin blade grindstone.