JPS62188677A - Electrocast sharp edged abrasive wheel - Google Patents

Abstract

PURPOSE:To improve the heat resistance and fatigue resistance of an electrocast sharp edged abrasive wheel and to restrain the formation of intermetallic compounds fostering fragility by dispersing super abrasive grains in the Ni-Mn alloy plated periphery. CONSTITUTION:Masking is applied to the surface of a board having peeling ability against a metal to be plated remaining the portion forming the original shape of an abrasive wheel. In the next step, after such cleaning as degreasing, an abrasive wheel layer, of which Ni-Mn alloy plated layer is dispersed with super abrasive grains therein by use of electroplating liquid containing an Ni group dispersed with such super abrasive grains as diamond grains, is formed on the surface of the board. Then, after water washing including brushing is applied to the board, the abrasive wheel layer is peeled from the board. Thus obtained abrasive wheel layer is formed to the circular shape by punching or the like and then further machined to roundness. An electrocast sharp edged abrasive wheel is thus obtained.

Description

[Detailed Description of the Invention] [Industrial Field of Application] This invention is applicable to the cutting of silicon, ferrite, etc., which require particularly high precision. The present invention relates to an electroformed thin blade grindstone suitable for use in No. 14 processing.

[Prior Art] For example, electronic materials such as silicon, GaAs, and ferrite, or hard and brittle materials such as ceramics, crystal, and glass,
When cutting or grooving with high precision, a thin-blade grindstone called an electroformed thin-blade grindstone, which has superabrasive grains dispersed within a metal plating layer, is generally used.

The figure shows a conventional electroformed thin-blade grindstone of this type. It has an annular plate shape with a length of several tens of micrometers to several hundred micrometers.

And the above electroformed thin blade whetstone! is sandwiched between a pair of mounting flanges 2.2 provided on both sides, and is also fitted with a nut 3.
The grindstone shaft 4, which rotates around its axis, is fastened and ready for use.

[Problems to be Solved by the Invention] However, in the conventional electroformed thin-blade grindstone l described above, for example, the outer diameter is 51φmm, the inner diameter is 40φmm, and the thickness is 0°01mm.
When the silicon wafer is diced after each part has been formed to a size of 5 mm, the cutting edge usually wears out and the life of the grinding wheel ends.
There was a problem that an annular crack was generated in a11a, and as a result, it became unusable.

Furthermore, when grooving a ferrite for a magnetic head using a tool formed to dimensions of, for example, an outer diameter of 100 φmm, an inner diameter of 40 φmm, and a thickness of 0.2111 m, the cutting edge becomes bent and the processing accuracy decreases. There was a problem with it being put away. In addition, when used for any purpose, the grinding wheel wears out quickly, resulting in a short service life.

Therefore, as a result of intensive research to solve these problems, the present inventors have found that the above problems are mainly due to the fatigue resistance of Ni forming the metal plating layer and the stiffness and mechanical strength as a binder phase. It has been found that the occurrence of the above problems is further exacerbated by the fact that the heat resistance is insufficient even though the cutting edge reaches high temperatures due to frictional heat during machining.

In addition, in the case of electrolytic Ni plating, a stress reducing agent (sulfur compound) such as saccharin Na is usually added to the N1 plating solution in order to reduce the internal stress of the plating film. This stress reducing agent is gradually electrolyzed as the plating progresses, and sulfur, a decomposition product, is eutectoided into the Ni plating film. However, when this alloy containing a minute amount of sulfur is heated to 200° C. or higher, an intermetallic compound of Ni-S is formed at the grain boundaries and becomes extremely brittle. On the other hand, since the cutting edge of the grinding wheel reaches a high temperature due to ripening, it was considered from the above results that the above-mentioned embrittlement phenomenon was promoted and the wear of the grinding wheel was accelerated.

Furthermore, the present inventors have found that when Ni-Mn is used as the metal plating layer, the occurrence of cracks at the contact portion 1a with the mounting flange 2 can be reduced, and the life of the grinding wheel can be improved. It has been found that the above problems can be effectively improved by suppressing the formation of Ni-8 intermetallic compounds that promote the embrittlement phenomenon.

[Purpose of the Invention] This invention was made based on the above knowledge, and provides an electroformed thin-blade grindstone that has excellent heat resistance and fatigue resistance, has a long service life, and can obtain high machining accuracy. The purpose is to

[Means for Solving the Problems] The electroformed thin-blade grindstone of the present invention has superabrasive grains dispersed within the Ni-Mn alloy plating layer.

[Example] Hereinafter, a first example of the electroformed thin blade grindstone of the present invention will be described.
A detailed explanation will be given based on an example of the manufacturing method.

First, the surface of the substrate, which is removable from the metal to be plated, is masked leaving a portion forming the prototype shape of the grindstone, and then a cleaning process such as degreasing is performed. Next, this input (
Ni with super abrasive grains such as diamond dispersed on the surface of the plate
A grindstone layer in which the superabrasive grains are dispersed within the Ni-Mn alloy plating layer is formed using an electroplating solution containing a base.

Here, the Mn content m in the Ni-Mn alloy plating layer is 0.005 wt% or more and 1. Owj%
The following is desirable. That is, if the Mn content is less than 0,005 wt%, sufficient heat resistance, fatigue resistance, and Ni-5 formation suppression effect cannot be obtained, and if it exceeds 1.0 wt%, This is because you can only get the desired effect.

Further, the content of the superabrasive grains in the Ni--Mn alloy plating layer is preferably IO to 50 vol%. That is, the content of the superabrasive grains is lovol%.
If it is less than 50 vol%, the sharpness will deteriorate and the service life will be shortened, while if it exceeds 50 vol%, the metal forming the metal plating layer will be relatively reduced, and the strength of the grinding wheel and the holding power of the superabrasive will decrease, and the This is because the grinding ratio cannot be obtained and it becomes uneconomical.

Next, the substrate on which the whetstone layer has been formed in this way is subjected to a water washing treatment including a cleaning agent, and then the abrasive layer is peeled off from the substrate. Next, the obtained whetstone layer is formed into a circular whetstone shape by punching or the like, and further processed into a perfect circle to obtain an electroformed thin-blade whetstone.

However, in the electroformed thin-blade grindstone produced in this way, Ni-M is used as the metal plating layer that holds the superabrasive grains.
Since the n-alloy plating layer is used, fatigue resistance and heat resistance can be greatly improved, and the formation of intermetallic compounds such as Ni-5 can be suppressed, so there is no contact with the mounting flange. The occurrence of cracks at the joint can be significantly reduced. In addition, since high mechanical strength can be obtained at the same time, even when used for groove machining, for example, excellent machining accuracy can be obtained without causing the cutting edge to bend and reducing machining accuracy. can. moreover,
As a result of the improved heat resistance, the wear resistance at the cutting edge is improved, and in combination with the above-mentioned effects, a long grinding wheel life can be obtained.

[Experiment example] Electroplating was performed on the surface of a stainless steel substrate on which a passivation film was formed under the following conditions, and diamond-containing (Tm was 31 vol% and Mn was included in the Ni metal plating layer) was electroplated under the following conditions. A grindstone layer (thickness: 100 μm) was formed.

(a) Composition of electroplating solution Sulfamic acid Ni+ 4509IQ, N chloride
i: 10@/(!.

Sulfamic acid Mn: 25g/(!, Boric acid:
309/Q, stress reducer, brightener, pit preventer:
3 Small amount, type of superabrasive: diamond, particle size of superabrasive: 5~IOμm, concentration of superabrasive in liquid: 2009/Q, P I-1・
4.0 (b) Plating conditions Bath temperature: 50°C, cathode current density: 3A/dm' Plating time: 130 minutes Next, the grindstone layer was peeled off from the above weir plate, and this grindstone layer was formed into a ring by electrical discharge machining. After forming it into a plate-like whetstone shape, the outer periphery is further ground to create a perfect circle, with an outer diameter of 100 mm.
An electroformed thin-blade grindstone (Example 1 of the present invention) shown in the above first example having a diameter of φa++a and a thickness of 0.1 mm was produced.

Furthermore, for comparison, as a conventional example, an electroformed thin-blade grindstone (
Conventional example 1) was created.

Next, using the same manufacturing method as above, two types of electroformed thin-blade grindstones (invention example 2, conventional example 2) each having a diamond grain size of 4 to 6 μm, an outer diameter of 50φlllIn, and a thickness of 0.02+nm were manufactured. )It was created.

Using each of these two types of electroformed thin-blade grindstones, a glass or Noricon wafer grinding test was conducted under the following conditions.

Tables 1 and 2 show the dimensions, compositions, and test results of the two types of electroformed thin-blade grindstones, respectively.

(Hereafter, margin) Grinding conditions: Grinding material: Nigarasu, Grinding wheel peripheral speed: 1500 m/min Blade tip protrusion l: 3mm, Feed speed 200mm/min Depth of cut: 2mm.

Grinding fluid: Water soluble Table 2 Cutting conditions Work material: Silicon wafer Grinding wheel rotation speed:
30. Goo r, P, m.

Amount of cutting edge protrusion: 0.4 as Feed rate: 200 mm/win Depth of cut Ml: 0.15 aug Grinding fluid: Water [Effects of the invention] As explained above, the m cast thin blade grindstone of this invention has Ni
- Since superabrasive grains are dispersed within the Mn alloy plating layer, it has excellent heat resistance and fatigue resistance, but it may inhibit the formation of intermetallic compounds that promote embrittlement. You can do it. This allows for long-term use and even higher processing accuracy.

[Brief explanation of drawings]

The figure is a schematic side sectional view showing a conventional electroformed thin-blade grindstone fixed to a grindstone shaft.

Claims (3)

[Claims] (1) An electroformed thin-blade whetstone characterized by having a thin plate shape and having superabrasive grains dispersed within a Ni-Mn alloy plating layer. (2) The Ni-Mn alloy plating layer has Mn of 0.005
The electroformed thin blade grindstone according to claim 1, characterized in that it contains ~1.0 wt%. (3) The electroformed thin-blade grindstone according to claim 1 or 2, wherein the content of the superabrasive grains in the Ni-Mn alloy plating layer is 10 to 50 vol%.